Prediction of the tensile load-bearing capacity of a co-cured single lap joint considering residual thermal stresses

In this paper, stress distributions in a co-cured single lap joint subjected to a tensile load were investigated using the finite element analysis. Residual thermal stresses, which resulted from the curing process of the co-cured single lap joint, were also considered. Since the adhesive layer in the co-cured single lap joint was about 10 μm thick, very thin compared with the thickness of both adherends, the interface between the steel and composite adherends was assumed to be perfectly bonded. The co-cured single lap joint was analyzed with respect to several bond parameters such as the bond length and stacking sequence of the composite adherend. The failure mechanism of the co-cured single lap joint was partial cohesive failure in the composite material, which was significantly affected by the interfacial tensile stress at the free edge of the co-cured single lap joint. Interfacial tensile stress was a primary factor that caused interfacial delamination between the steel and composite adherends in the co-cured single lap joint. Finally, tensile load-bearing capacities calculated from the Ye-delamination failure criterion were compared with the experimental results, and relatively good agreement was found.     

On the Effect of Time-Dependent Deformations on the Interface Behaviour of RC Beams Strengthened by FRP Plates

In this paper, the effect of time-dependent deformations (such as shrinkage and creep) on the interfacial stresses between a concrete beam and a fibre reinforced polymer plate is presented. The analysis given here involves a closed-form solution for such stresses and includes creep and shrinkage effects. The adherend shear deformations have been included in the present theoretical analysis by assuming a parabolic shear stress through the thickness of both concrete beam and fibre reinforced polymer panel. Contrary to some existing studies, the assumption that both the concrete beam and the fibre reinforced polymer panel have the same curvature is not used in this investigation. The influence of creep and shrinkage effect relative to the time of the casting and the time of the loading of the beams is taken into account. Numerical examples of a typical concrete beam strengthened with an externally bonded fibre reinforced polymer plate are discussed with the emphasis on the shear and normal stresses at the edge of the plate.     

Study on Plasticity Modification for Measuring High Residual Stress by Hole-Drilling Method

Hole-drilling method is a commonly used method for measuring residual stress. The calibration coefficients in ASTM E837-13 a would cause large errors due to the...     

Finite element modelling of development of stresses in thermal barrier coatings

Abstract

Thermal barrier coatings (TBCs) are used to allow higher gas temperatures (and hence greater efficiencies) in power generation gas turbines and/or to lengthen blade lifetimes, by reducing the heat transfer from the combustion gases to the blade substrate materials. However, the lives of TBC coated components tend to be limited by the growth of an oxide layer between the thermally insulating top coat and the MCrAlY coated superalloy substrate; this results in stresses which can lead to spallation (flaking-off) of the top coat. The present paper gives an overview of a recent programme of modelling work undertaken to understand the development of stresses due to the growth of the oxide layer. Typical examples of the rough interface between top coat and bond coat are characterised in terms of their aspect ratios. Representative geometries are then studied using a series of 2D finite element models of the interface layer. Initial models assumed a simple parabolic growth law for the oxide layer; the models were then developed to consider the evolving properties of the substrate and bond coat, and a more rigorous model of the oxidation process was implemented. The resulting model takes as its input the results of a microstructure evolution model developed at Loughborough University, which provides phase proportions. These in turn are used in conjunction with a constitutive model based upon an analytical homogenisation (based on Eshelby approach) that allows the substrate and bond coat creep and elastic behaviour to be predicted as the microstructure evolves. The formation of the thermally grown oxide (TGO) is modelled by considering the volume change due to oxidation. In turn, the model predicts the evolution of stresses at positions within the TGO layer. The influences of interface roughness, temperature and bond coat formulations are all explored by running the coupled model with different input parameters.     

Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux

In this study we have carried out the thermal residual stress analyses of adhesively bonded functionally graded clamped plates for different edge heat fluxes. The material properties of the functionally graded plates were assumed to vary with a power law along an in-plane direction not through the plate thickness direction. The transient heat conduction and Navier equations describing the two-dimensional thermo-elastic problem were discretized using the finite-difference method, and the set of linear equations was solved using the pseudo singular value method. The plate material properties near the interfaces played an important role in the interfacial adhesive stresses. The compositional gradient affected considerably both in-plane temperature distributions and heat transfer periods. The type of in-plane heat flux had only a minor effect on the temperature profiles but affected both the temperature levels and heat transfer period. Both plates undergo considerable compressive normal strains and stresses, but shear strains were more effective. Peak equivalent strains were observed for a constant heat flux and plates with a metal-rich composition. The compositional gradient and direction played important role in the profiles and levels of normal, shear and equivalent stresses as well as strains. The equivalent stress and strains concentrated along the free edges of the adhesive layer. The adhesive layer experienced a considerable distortional deformation rather than volumetric deformation. The equivalent stress exhibited small changes through the adhesive thickness and along the overlap length. The equivalent stress remained uniform in a large region of the overlap length and increased to a peak level around the free edges of the first plate–adhesive interface, whereas it increased to a peak level in a large region of the overlap length from a minimum level around the free edges of the second plate–adhesive interface. The strains and equivalent strains were higher for a metal-rich material composition. The direction of the material composition of the plates affected both stress and strain levels; thus, the CM–CM and CM–MC plates exhibited lower strain and stress levels than those in the MC–CM and MC–MC plates. However, only the adhesively bonded CM–MC plate configuration could achieve the lowest deformations and stresses in both plates and adhesive layer.     

Mechanical characteristics of resistance multispot welded joints

Abstract

In the present study, three-dimensional thermal elastoplastic analysis has been carried out in order to clarify the mechanical phenomena of the thermal elastoplastic behaviour of multispot welded joints. As the shape of multispot welded joints is not axisymmetrical, unlike single spot welded joints, the solution domain for simulation should be three-dimensional. Therefore, the present study first developed three-dimensional heat conduction and thermal elastoplastic programs using the isoparametric finite element method. Second, from the results analysed by the developed programs, thermal and mechanical characteristics and their production mechanisms on single and multispot welded joints were clarified. Moreover, effects of pitch length on the temperature distribution, welding residual stresses and plastic strain of multispot welded joints were evaluated, indicating that a pitch of 30 mm was more advantageous compared to a pitch of 15 mm.     

Residual stresses and practical adhesion: effect of organo-metallic complex formation and crystallization

Epoxy-amine liquid pre-polymers are often applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. The overall performance of such systems depends on the interphase created between the epoxy-amine polymer and the metallic substrate. When epoxy-amine liquid mixtures are applied onto a metallic oxide layer, concomitant amine chemisorption and oxide dissolution occur leading to organo-metallic complex formation. Depending on the amine nature, as soon as the organo-metallic complex concentration is higher than the solubility product (e.g., isophoronediamine (IPDA)), these organo-metallic complexes crystallize as sharp needles. At the same time, the uncrystallized organo-metallic complexes react with the epoxy monomer to form, after curing cycle, a new network. Moreover, the crystal size increases with the solid/liquid contact time leading to an increase of intrinsic residual stresses and Young's modulus. When aliphatic diethylenetriamine (DETA) was used, no crystallization occurred, but the interphase formation was observed. The aim of this study was to understand and to establish the role of crystallization of organo-metallic complexes formed within the interphase on the practical adhesion performance. As the crystallization of the organo-metallic complex depends on the nature of the amine, two amine hardeners were used (IPDA inducing the formation of crystals and DETA without formation of crystals). For DGEBA-IPDA systems, the ultimate load decreases while residual stresses increase when the liquid/solid contact time increases. When no crystal formation was observed (e.g., DGEBA-DETA system), residual stresses, coating Young's modulus and ultimate load values all remained nearly constant irrespective of the liquid/solid contact time.     

Modeling of Residual Stress in Oxide Scales

The magnitude of the residual stress in an oxidescale, and how this varies with temperature, is of majorimportance in understanding the failure mechanisms ofoxide scales. This stress encompasses both growth stresses introduced at the oxidationtemperature and thermal-expansion-mismatch stressesinduced on heating and cooling, as well as anyexternally applied stresses or stress relaxation whichtakes place in the scale/substrate system. Althoughsome of these components are reasonably well understood(e.g., thermal stresses), growth stresses and therelaxation of the total scale stress by creep orfracture processes are much less well understood. Inthis study a model has been developed to predict stressgeneration and relaxation in oxide scales as a functionof time and temperature for both isothermal exposure and cooling to room temperature. The modeldetermines growth stress and thermal-stress generationin the scale and how this is balanced by stresses in thesubstrate. The substrate stresses are then allowed to relax by creep and the scale stressesrecalculated. This model accurately predicts theroom-temperature scale stresses for a range ofscale/alloy systems. The model can be used to show howthe scale stress depends on oxidation temperature,cooling rate, substrate, and scale thickness. The modelpredictions are discussed in light of experimentalobservations for alumina scales on FeCrAlY.     

5—THE EFFECTS OF SOME PRE-CARDING CONDITIONS ON WOOL-COMBING

Combing performance, as assessed by the percentage of noil and the fibre length and nep count of the top, is better for alkaline than for neutral wool, and worse for wool stored in bales before being carded. These results are at variance with some previously reported by other workers.