填充材料Ti原位增强SiCp/101Al基复合材料TIG焊接头反应机理

接头组织对焊接接头的性能起着决定性作用,研究表明,在SiCp/101Al基复合材料TIG焊焊接过程中,填充材料Ti与复合材料中的增强颗粒SiC反应生成了性能更好、颗粒度更小、分布更弥散的TiC颗粒。     

离心铸造SiC颗粒增强铝基复合材料电子封装零件的成形研究

研究了离心铸造法制备SiC／Al复合材料电子封装零件的成形过程。在离心力场中,得到组织致密的铸件,实现零件的近终成型。显微组织结构观察表明,SiC颗粒均匀分布在基体合金中,细小的SiC颗粒充分填充到粗大颗粒的间隙中,分布均匀,无颗粒团聚现象,组织均匀致密,无夹渣、气泡等缺陷。     

热处理对SiCp/Al-6%Mg复合材料微观组织及腐蚀行为影响

采用无压渗透法制备了SiC_p/Al-6%Mg复合材料,并对其进行4种热处理工艺(T1, T4, T6和退火)处理,研究了热处理工艺对SiC_p/Al-6%Mg复合材料微观组织和腐蚀行为的影响。结果表明,复合材料在4种热处理工艺下均出现了界面反应产物Si、MgA1₂O₄ 和 Mg₂Si。界面反应产物析出量(f)与热处理工艺密切相关,并呈现出如下规律：f_T1< f_T4< f_T6annealing。界面反应析出物是导致复合材料发生点蚀的主要原因,从而促进复合材料发生腐蚀。热处理工艺能影响界面反应析出量而间接影响复合材料的腐蚀速度(j_corr)：j_corr-T6> j_corr-T4> j_corr-T1。     

Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites

A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction) and Ni(10%P) (mass fraction) layers. It is observed that variation of P contents in the electroless Ni(P) layer results in different types of microstructures of SnAgNi/Ni(P) solder joint. The morphology of Ni3Sn4 intermetallic compounds (IMCs) formed between the solder and Ni(10%P) layer is observed to be needle-like and this shape provides high speed diffusion channels for Ni to diffuse into solder that culminates in high growth rate of Ni3Sn4. The diffusion of Ni into solder furthermore results in the formation of Kirkendall voids at the interface of Ni(P) layer and SiCp/Al composites substrate. It is observed that solder reliability is degraded by the formation of Ni2SnP, P rich Ni layer and Kirkendall voids. The compact Ni3Sn4 IMC layer in Ni(5%P) solder joint prevents Ni element from diffusing into solder, resulting in a low growth rate of Ni3Sn4 layer. Meanwhile, the formation of Ni2SnP that significantly affects the reliability of solder joints is suppressed by the low P content Ni(5%P) layer. Thus, shear strength of Ni(5%P) solder joint is concluded to be higher than that of Ni(10%P) solder joint. Growth of Ni3Sn4 IMC layer and formation of crack are accounted to be the major sources of the failure of Ni(5%P) solder joint.     

搅拌工艺参数对SiC_p/Al复合材料颗粒分布的影响

采用机械搅拌法制备了不同SiCp含量Al基复合材料,研究了搅拌参数对颗粒分布的影响。通过SEM和XRD对SiCp在基体中的分布及复合材料的物相成分进行了分析。结果表明,搅拌桨直径为60mm,叶片倾角为30°,搅拌速度为680r/min时制得的复合材料,其SiCp分布均匀且无明显气孔生成。在慢冷条件下浇注的复合材料无明显颗粒沉降现象发生。物相分析显示有MgAl2O4、Mg2Si生成,没有发现有害界面反应产物Al4C3。     

SiCp/Al基复合材料的高压扭转试验

采用高压扭转（high-pressure torsion,HPT）工艺制备SiCp/Al基复合材料,试验发现随着扭转半径的增加,剪切应变增大,SiC颗粒分布逐渐均匀;升高温度,SiC颗粒分布的均匀性好;随着扭转半径的增加材料的硬度先增加后减小,且材料越致密,SiC含量越多,分布越均匀,材料硬度越高。     

Machining Characteristics in Cryogenic Grinding of SiCp/Al Composites

In this study, liquid nitrogen was applied to grind SiCp/Al composites with high volume fraction and large SiC particle at different levels of cutting conditions, and the effects of grinding depth and speed on grinding force, surface morphology, and surface roughness were investigated. At the same time, the effect of cryogenic cooling was also compared with that of conventional wet grinding. The experimental results indicated that cryogenic cooling is effective in enhancing supporting function of Al matrix to the SiC particles and improving surface quality. Additionally, the brittle fracture of SiC particles was suppressed and some ductile streaks on SiC particle could be observed.     

激光熔覆Cu包SiCp/Ni35覆层组织及磨损性能

目的研究Cu包SiC_p/Ni35激光熔覆层的显微组织、物相及其在25℃和600℃下的摩擦机理。方法采用化学镀的方法在SiC_p表面包覆一层Cu,并用激光熔覆的方法在H13钢表面制备了Cu包SiC_p增强Ni35熔覆层。用XRD、OM、SEM和EDS对熔覆层的物相、组织和成分进行了分析,用显微硬度计测试了熔覆层的显微硬度,用高温磨损试验机测试了熔覆层在常温、高温下的耐磨性能。结果熔覆层由基相γ-Ni(Fe)固溶体、增强相M7C3以及硼化物、硅化物和石墨构成。熔覆层的显微硬度和常温摩擦性能较H13钢显著提高,而其高温摩擦性能较H13钢基体提高较少。结论 SiC_p化学包覆Cu能减缓激光熔覆过程中SiC_p的分解,但分解速度还是过快。常温磨损时,高硬度碳化物和硅化物的覆层提高了材料的耐磨性能。高温下模具钢表面形成致密的氧化物薄膜,起到减磨降摩的作用,而高温下覆层无法形成致密氧化膜,导致其耐磨性能弱于常温。     

热挤压对不同搅拌时间制备的纳米SiCp/Mg-9Al-1Zn复合材料组织和性能的影响

通过半固态搅拌铸造和热挤压变形复合工艺制备出了质量分数为1%的纳米SiCp/Mg-9Al-1Zn镁基复合材料。研究了搅拌时间分别为10min和30min时对纳米SiCp/Mg-9Al-1Zn镁基复合材料的显微组织和力学性能的影响。结果表明,对于铸态的纳米SiCp/Mg-9Al-1Zn镁基复合材料来说,搅拌时间为30min时,基体的晶粒细化,但在晶界处析出的Mg17Al12相数量增多,网状化严重且SiC团聚增加,使得复合材料的力学性能下降。而通过热挤压后,复合材料形成了粗晶与细晶交替的组织结构。特别是对于搅拌时间为30min的复合材料,细晶区增多且纳米SiC颗粒分布更加均匀, 这就使得力学性能高于搅拌10min的挤压态的SiCp/Mg-9Al-1Zn复合材料。     

基于Ti中间层的SiCp/6061-T6Al MMCs低功率激光-TIG复合焊组织与性能

以0.1mm厚的Ti箔做中间夹层,使用低功率激光-TIG复合焊的方式对SiCp/6061-T6Al MMCs 进行焊接,并对接头的宏观形貌、显微组织、物相、电阻率、抗拉强度及断口形貌进行分析。结果表明：激光功率对焊缝的成形有着较大影响;Ti箔的加入基本抑制了焊缝中针状Al₄C₃生成,并生成TiC增强相以及条状TiAl₃;焊缝区为等轴晶组织,熔合区为柱状晶组织,热影响区组织变化不明显;随着激光功率的增加接头的电阻率呈现出增加的趋势,并明显高于母材;在554W时接头的抗拉强度可达196.98MPa,是母材强度的54.71%。接头断口中几乎没有气孔,韧窝中的第二相粒子以TiC为主,接头呈现出以脆性断裂为主的脆-韧性混合断裂特征。