航天飞机外贮箱热防护系统

在航天飞机发射前和发射过程中,外贮箱热防护系统维护推进剂质量,保持箱体结构温度在设计要求范围内.它由两类基本材料组成:高效、硬质、闭孔泡沫塑料绝热材料和高热容、轻质、粘稠烧蚀材料.在外贮箱不同的部位,设计不同的热防护系统,满足发射航天飞机各种轨道不同的技术要求.     

微小型自适应光学系统及其在星载光学遥感器上的应用

主要阐述了自适应光学系统的微小型化和集成化趋势,介绍了国内外微小型自适应光学系统的研究概况、水平和发展趋势,探讨了微小型自适应光学系统在空间光学遥感器上应用的系统构思及可行性,进行了空间光学遥感器主镜温度场变形的自适应光学闭环校正模拟实验,闭环后波前的Ｐ－Ｖ值小于λ／４,ＲＭＳ值小于λ／３０,改善了波前质量,为自适应光学技术在星载相机上的应用提供了有力的实验基础。     

Long-term thermal stability of Ti/Al/Mo/Au ohmic contacts on n-GaN

Improved performance of the ohmic contacts on n-GaN has been demonstrated with the use of MoAu as the capping layer on TiAl metallization. Contact resistance as low as 0.13 Θ-mm was achieved in these ohmic contacts when annealed at 850°C for 30 sec. We have studied the long-term thermal stability of these contacts at 500°C, 600°C, 750°C, and 850°C, respectively. The Ti/Al/Mo/Au metallization forms low contact-resistance ohmic contacts on n-GaN that are stable at 500°C and 600°C after 25 h of thermal treatment. The ohmic-contact performance degrades after 10 h of thermal treatment at 750°C, while the contacts exhibit nonlinear current-voltage (I-V) characteristics after 1 h of thermal treatment at 850°C with the formation of oxide on the surface of the contacts accompanied by surface discoloration. The intermetallic reactions taking place in the contacts during the long-term thermal treatments were studied using Auger electron spectroscopy (AES), and the surface morphology was characterized using atomic force microscopy (AFM).     

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

The thermal fatigue properties of Sn-xAg-0.5Cu (x=1, 2, 3, and 4 in mass%) flip-chip interconnects were investigated to study the effect of silver content on thermal fatigue endurance. The solder joints with lower silver context (x=1 and 2) had a greater failure rate compared to those with higher silver content (x=3 and 4) in thermal fatigue testing. Cracks developed in the solders near the solder/chip interface for all joints tested. This crack propagation may be mainly governed by the nature of the solders themselves because the strain-concentrated area was similar for tested alloys independent of the silver content. From the microstructural observation, the fracture was a mixed mode, transgranular and intergranular, independent of the silver content. Higher silver content alloys (x=3 and 4) had finer Sn grains before thermal cycling according to the dispersion of the Ag₃Sn intermetallic compound, and even after the cycling, they suppressed microstructural coarsening, which degrades the fatigue resistance. The fatigue endurance of the solder joints was strongly correlated to the silver content, and solder joints with higher silver content had better fatigue resistance.     

Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions

In this paper, we present an implementation of a thermal modelling method applied to a multichip module used as a power converter. Analytical functions of thermal impedances, with original formulations for the mutuals are defined. They are derived from 3D thermal simulations and experimental validations with direct chips temperature measurements. Finally, simulations are performed in order to improve the capability of our model to assess, with fast computation, the thermal constraints applied on the multichip module in a real operating condition.     

Low-cycle fatigue prediction model for pb-free solder 96.5Sn-3.5Ag

Low-cycle fatigue (LCF) data of Sn-Ag eutectic solder (96.5Sn-3.5Ag) under various temperatures and frequencies has been described using three different prediction models, i.e., Coffin-Manson model, Smith-Watson-Topper (SWT) model, and Morrow energy model. The LCF behavior represented by the present prediction models showed temperature and frequency dependences, i.e., the fatigue ductility coefficient increased with increasing frequency and decreasing temperature. In order to better correlate the LCF data, a flow stress and/or frequency-dependent modifications were introduced to the Coffin-Manson and Morrow energy models. The frequency-modified Coffin-Manson model could not describe the influence of temperature on LCF behavior, while the flow stress-modified frequency-modified Morrow energy model, into which the metallurgical response (flow stress and frequency) was introduced to account for the effect of temperature and frequency on LCF behavior, gave reasonable predictions of LCF data under various temperatures and frequencies.     

Theory and simulation of a thermally matched micromachined thermopile in a wearable energy harvester

In this paper, a new theoretical concept in the thermoelectric theory is discussed, which is important for design optimization of a thermoelectric energy harvester. The general conditions are defined, which are required to make a thermoelectric converter effective in energy harvester application. The necessity of the work has been prompted by the fact that while modeling the harvesters neither a constant temperature difference nor a constant heat flow can be assumed. It is shown that the proposed equations allow thermal optimization of energy harvesters to reach their top performance characteristics. The example of thermal optimization in case of MEMS thermopiles is discussed then. It is shown that the knowledge of thermal properties of the environment, i.e., those of a heat source and a heat sink, play the key role in the optimization procedure.     

蜂窝结构的红外热波无损检测

蜂窝结构是常规无损检测方法难以检测的对象。红外热波无损检测技术利用脉冲主动加热．采用红外热像仪实时监视表面温场,通过计算机完成图像采集,针对不同试件材料特点采用不同的图像处理方法进行处理。红外热波无损检测方法对蜂窝结构实现了快速、灵敏检测及动态演示,为进一步分析判断提供了依据。     

拉丝环境湿度对高强度光纤动态疲劳的影响

文章研究了高强度石英玻璃光纤的动态疲劳性能与拉丝环境相对湿度的函数关系。光纤是在采用石墨感应加热炉加热,并在控制温度、相对湿度和拉丝环境尘埃粒子数的条件下拉制的。所谓拉丝环境指的是从感应加热拉丝炉至涂覆点之间的空间。通常,人们采用两种不同的加载方式,即拉伸和两点弯曲来测量拉制的光纤的动态疲劳。业已发现,拉丝湿度对用张力法加载方式测得的光纤的动态疲劳起着决定性的影响。     

等温时效对SnSb4.5CuNi/Cu焊接接头力学性能的影响

SnSb4.5CuNi/Cu焊点在175℃进行等温时效,分析了不同时效时间的SnSb4.5CuNi/Cu焊点中金属间化合物(IMC)组织形貌演变,通过纳米压痕法测量SnSb4.5CuNi/Cu焊点界面IMC的硬度和弹性模量,对焊接接头进行拉伸强度和低周疲劳测试。结果表明,时效48 h的焊缝中Cu6Sn5呈曲率半径均匀的半圆扇贝状特征,IMC的弹性模量与铜基板很接近,在恒幅对称应变条件下焊点的抗低周疲劳的性能最佳,焊点的抗拉强度高;当时效时间大于48 h,焊接接口的抗疲劳性能和抗拉伸强度逐渐变差。