中美文化差异对国际商务谈判的影响

经济全球化浪潮下的中关经贸合作达到前所未有的高度,但文化差异却时常成为中关商务谈判的障碍。本文通过文化差异对中关商务谈判的影响做出分析,指出文化在中美商务谈判活动中具有的重要作用并提出相应对策。     

双余度高压无刷直流电机有限元分析

针对多电飞机的快速发展,设计了基于270 V的双余度高压无刷直流电机。根据双余度高压无刷直流电机的结构特点,建立了双余度高压无刷直流电机的数学模型,推导了双余度工作时的转矩计算公式。建立了双余度高压无刷直流电机的电磁场模型,并利用magnet对其进行了电磁场仿真,对比分析了单绕组工作时与双余度工作时的反电势、转矩、转速等。并建立了双余度高压无刷直流电机的磁热耦合分析模型,对其双余度工作时的热场进行了仿真。仿真结果表明:双余度高压无刷直流电机在运行过程中,可以达到与单绕组工作时相同的动态特性,转矩为单绕组工作时的2倍,且大大提高了系统的可靠性。     

一种嵌入式U盘数据采集系统的设计

根据数据采集系统中有大量数据需要存储又要方便与计算机交互这一实际需要,提出在数据采集系统中嵌入USB—Host．实现用U盘或移动硬盘作为数据存储介质的设计方案。     

基于视觉感知机制的织物疵点轮廓检测

针对传统人工织物疵点检测存在的误检及低效等问题,提出了一种基于视觉感知机制的自适应织物疵点轮廓检测方法.首先,模拟视觉系统中视网膜感受野对视觉信息的处理机制对织物疵点图像进行滤波及疵点增强;其次,依据初级视皮层(V1)区对视觉信息响应的方向选择性机制构建织物疵点图像边缘检测模型,实现对织物疵点图像的边缘检测.最后,采用自适应阈值选择的方法对检测到的边缘进行二次处理,获得织物图像疵点的轮廓.为验证本文方法的有效性和准确性,对4类织物疵点图像进行测试,并定性和定量两方面进行比较分析,结果表明文中提出的方法能够较好地检测出织物疵点轮廓信息,不仅可以得到质量较高的织物疵点轮廓图像,而且在整个检测过程中能够自适应的选择参数,避免受人的主观因素影响,具有实际的应用价值.     

钒微合金化H型钢表面裂纹研究与控制

分析了V微合金H型钢S450J0-T轧后表面裂纹的形成原因。结果表明,S450J0-T钢轧后裂纹主要是由于连铸过程中铸坯上细小裂纹所导致,并在轧制过程中扩展形成。通过对钢水成分进行控制以及连铸工艺进行优化,显著降低了该钢种轧后裂纹修磨率。     

复合正极材料xLiFePO_4·yLi_3V_2(PO_4)_3/C的合成及其电化学性能

以聚吡咯(PVP K60)为表面活性剂和碳源,采用流变相法合成了x Li Fe PO4·y Li3V2(PO4)3/C正极材料样品。利用扫描电子显微镜(SEM)、X射线衍射仪(XRD)对样品形貌和结构进行了测试;采用电池测试仪和电化学工作站对样品电化学性能进行了测试,分析了不同复合比(x:y)对其结构和电化学性能的影响。研究表明:复合材料中存在两相复合与元素掺杂两种效应;当复合比为5∶1时材料的电化学性能最优,在0.1和10 C倍率下放电容量分别达到162.7和104.6 m Ah·g-1,且具有良好的循环稳定性。     

GAAS80焊机焊接U76CrRE钢轨工艺研究

分析了GAAS80/580焊接原理,结合GAAS80闪光焊机焊接工艺特点,制定了U76CrRE钢轨的焊接工艺。采用落锤试验检验焊头质量,并对断口形貌进行扫描,能谱分析表明,断口缺陷处低熔点共晶硫化物的形成是裂纹产生的主要原因。在此基础上优化焊接工艺参数,降低预热阶段的电压、减小烧化阶段的位移、提高烧化阶段的闪光速度。优化后的U76CrRE钢轨焊接工艺通过了落锤试验,各项力学性能符合铁道部钢轨焊接标准的相关要求。     

交变电场下不锈钢的电化学行为

主要研究了交变电场下SS304不锈钢在2.5 mol/L硫酸 溶液中的表面成膜情况.运用电位阶跃研究了不锈钢在交变电场高电位、低电位下的电化学 反应；用AFM准现场地观察了不锈钢在交变电场下各个阶段的成膜状况；用XPS分析了膜层的 纵向组成结构.结果表明：交变电场下不锈钢表面钝化膜的生长机制不同于直流钝化.最后 分析了不锈钢在交变电场下的电化学反应和成膜机理.     

Examination of superplastic forming combined with diffusion bonding for titanium: Perspective from experience

Superplastic forming (SPF) combined with diffusion bonding (DB) has been used successfully for the fabrication of titanium aerospace hardware. Many of these applications have been for military aircraft, whereby a complex built-up structure has been replaced with monolithic parts. Several methods for applying the two- and four-sheet titanium SPF/DB processes have been devised, including the welding of sheets prior to forming and the use of silk-screened stop-off (yttria) to prevent bonding where it is undesirable. Very little progress has been made in the past few years toward understanding and modeling the SPF/DB process using constitutive equations and data by laboratory testing. Concerns that engineers face in designing for fatigue life, acceptable design loads, and damage tolerance are currently being studied, but the database is very limited. This is a summary of past work found in the literature and forms the foundation for additional research. This paper was presented at the International Symposium on Superplasticity and Superplastic Forming sponsored by the Manufacturing Critical Sector at the ASM International AeroMat 2004 Conference and Exposition, June 8–9, 2004, in Seattle, WA. The symposium was organized by Daniel G. Sanders, The Boeing Company.     

Infrared heat treatment of Ti-6Al-4V with electroplated Cu

The objective of this study is to investigate an innovative infrared (IR) technique to enhance adhesion of electroplated copper (Cu) on Ti-6Al-4V without dichromate dipping. The ultimate goal is to develop a Cu coating process on Ti-6Al-4V without hazardous hexavalent chromium (Cr) solution treatments. Cu coatings of around 50 μm were electroplated on Ti-6Al-4V specimens at a current density of 0.03 A/cm² in an acidic Cu solution. To improve adhesion of coatings, IR heat treatments were performed on the Cu-coated samples at different temperatures and durations: 860 °C for 600 s and 875 °C for 20–120 s. This process was accomplished in an attempt to replace the use of dichromate dipping before electroplating. For samples heat treated at 860 °C, no bonding existed, even after 600 s. It is believed that solid-state diffusion prevailed at 860 °C and that 600 s was not enough for sufficient diffusion to occur. Adhesion was poor when samples were heat treated at 875 °C for 20 s. Excellent adhesion was observed when the heat treatment holding time was increased to 40 s. For 90 s, the surface appearance of coatings partially changed from Cu-colored to a grayish color. There was no Cu left on the surface after a 120 s heat treatment. From optical microscopic observations on sample cross sections, an interlayer between the Cu and Ti-6Al-4V formed when heat treated at 875 °C for 40 s and longer. The interlayer thickness increased as the holding time increased, until depletion of Cu. The sheet resistivity of coated specimens was on the order of pure Cu for samples heat treated at 875 °C and less than 90 s. During the 875 °C heat treatment, the following occurred: solid-state diffusion of Cu in Ti-6Al-4V, formation of eutectic solutions, dissolution of Cu and Ti-6Al-4V into the liquid phase, and the formation of intermetallic compounds. The lowest eutectic temperature of 875 °C played a key role in this innovative process of Cu coating on Ti-6Al-4V. This paper was presented at the 2nd International Surface Engineering Congress sponsored by ASM International, on September 15–17, 2003, in Indianapolis, Indiana and appears on pp. 403–10 of the Proceedings.