Growth structure investigation of MgF2 and NdF3 films grown by molecular beam deposition on CaF2(111) substrates

The growth structure of MgF₂ and NdF₃ films grown on polished CaF₂(111) substrates deposited by molecular beam deposition has been investigated using transmission electron microscopy (TEM) of microfractographical and surface replications as well as cross-sectional TEM, atomic force microscopy, packing density, and absorption measurements. It has been shown that by taking advantage of ultrahigh vacuum environments and a special stratification property of MgF₂ and NdF₃ films, the preparation of nanocrystalline films of high packing density and low optical absorption is possible at a substrate temperature of 425 K.     

A theory for the formation of tetrahedral amorphous carbon including deposition rate effects

A theoretical model is presented to describe the effect of ion beam bombardment rate on the formation of tetrahedral amorphous carbon (ta-C) films. The critical ion energy, E_c, corresponding to a 50% sp³ content in the films, is found to be dependent on both the effective thermal resistance and the ion beam bombardment rate. In the model, the ‘window’ width in the ion energy scale for the formation of ta-C material increases with decreasing deposition rate and with a reduction in the effective thermal resistance, until limited by lower and upper boundary thresholds. Experimental data are reproduced by the model. The plasmon energy, which correlates with sp³ fraction, is found experimentally of be higher for lower deposition rate and smaller effective thermal resistance. Data points for high sp³ content ta-C films deposited on silicon substrates at room temperature occupy a region in the ion energy-deposition rate (E-r) diagram similar to that predicated from the theory.     

Properties of thin TiN films deposited onto stainless steel by an in-line dry coating process

A new coil-coating pilot plant, capable of utilizing ion plating, sputtering and plasma-assisted chemical vapor deposition (PACVD) processes, independently or in series, was developed and optimum conditions for TiN, TiC, Al_xO_y, SiO_x and Cr coating were established. This paper is mostly concerned with the results of characterization (conducted in parallel by the authors′ two institutions) of TiN films deposited by ion plating or sputtering onto type-304 stainless steel strips. In particular, the dependence of the basic properties such as chemical composition, structure, adhesion, and color on the coating process are discussed with respect to anti-corrosion, anti-wear, and decorative applications. TiN coatings with a very attractive gold coloration were obtained; they performed well in wear testing, but did not show satisfactory corrosion resistance. However, it was found that the latter can be improved significantly by depositing a SiO_x, top layer by PACVD above the TiN coating. Thus the in-line dry coating processes are capable of producing highly functional steel surfaces with decorative color and high corrosion resistance.     

Structure and photoconductive properties of dip-deposited SnS and SnS2 thin films and their conversion to tin dioxide by annealing in air

SnS and SnS₂ thin films have been prepared by the dip technique. In this technique, a substrate was dipped into an alcoholic solution of the corresponding chloride and thiourea and then withdrawn vertically at a controlled speed, and finally baked in a high temperature furnace at atmospheric condition. XRD and SEM data suggest that good quality SnS and SnS₂ films are obtained at a baking temperature of 300 and 360°C, respectively. Values of band gap for SnS and SnS₂ obtained from spectral response of photoconductivity are 1.4 and 2.4 eV, respectively. The indirect allowed band gap values for SnS₂ film obtained from optical absorption measurements are 1.95 and 2.05 eV. Open-air annealing of both SnS and SnS₂ films at 400°C converts them to transparent conducting SnO₂.     

微波电子回旋共振等离子体技术及其应用

微波电子回旋共振等离子体是淀积薄膜、微细加工和材料表面改性的一种重要手段。由于这种等离子体电离水平高,化学活性好,可以用来实现基片上薄膜的室温化学气相淀积和反应离子刻蚀,因此对于微电子学、光电子学和薄膜传感器件的发展,这种等离子体会具有重要的意义。此外,采用微波电子回旋共振等离子体原理,没有灯丝的离子源可以提高离子源的使用寿命,可以增加离子束的束流密度。可以确信,微波电子回旋共振等离子体的发展,将把离子源技术提高到一个新的水平。显然,这必将对材料表面改性工艺,包括离子注入掺杂等工艺的发展发挥作用。自从1985年以来,为了得到大容积等离子体而发展了微波电子回旋共振多磁极等离子体,这些技术在薄膜技术、微细加工以及材料表面改性中的应用前景是乐观的。我们将在本文中,介绍微波电子回旋共振等离子体的原理及其应用。     

电子束法沉积ITO膜的XPS研究

采用电子束蒸发法制备了均匀、致密、透明导电的ITO膜。讨论了其光电性能,并用XPS技术研究了ITO膜的表面组成、结构和状态。     

生长温度对CVD金刚石薄膜的影响

系统研究了ＣＶＤ金刚石薄膜成膜过程中生长温度对薄膜质量、生长率和力学性能的影响。研究结果表明：在典型沉积条件下，生长温度愈高、薄膜的晶体质量愈好；但薄膜的应力状况和附着性能变坏；在８００℃时，金刚石薄膜的生长速率最大。讨论了ＣＶＤ金刚石薄膜作为机械工具涂层的最佳生长温度。     

Electrophoretic deposition of chitosan

The electrophoretic deposition (EPD) of chitosan on metallic substrates was investigated. The electrophoretic mobility of the natural biopolymer in aqueous solution as a function of pH was studied. Because the protonation/deporotonation of chitosan is pH-dependent, the electrophoretic mobility and deposition rate is shown to increase with increasing pH from 2.9 to 4.1. The film growth rate is estimated to vary in the range 0.02–0.08 µm/s depending on the pH value. At high growth rates (> 0.05 µm/s), a porous film is obtained due to hydrogen entrapment. The EPD method developed here is applicable for the surface modification of metal implants by chitosan to develop novel bioactive coatings.     

Investigations on welding residual stresses in penetration nozzles by means of 3D thermal elastic plastic FEM and experiment

Recent discoveries of stress corrosion cracking (SCC) in weldments including penetration nozzles at pressurized water reactors (PWRs) and boiling water reactors (BWRs) have raised concerns about safety and integrity of plant components. It is well known that welding residual stress is an important factor resulting in SCC in weldments. In the present work, both experimental method and numerical simulation technology are used to investigate the characteristics of welding residual stress distribution in penetration nozzles welded by multi-pass J-groove joint. An experimental mock-up is fabricated to measure welding residual stress at first. In the experiment, each weld pass is performed using a semi-circle balanced welding procedure. Then, a corresponding finite element models with considering moving heat source, deposition sequence, inter-pass temperature, temperature-dependent thermal and mechanical properties, strain hardening and annealing effect is developed to simulate welding temperature and residual stress fields. The simulation results predicted by the 3D model are generally in good agreement with the measurements. Meanwhile, to clarify the influence of deposition sequence on the welding residual stress, the welding residual stress field in the same geometrical model induced by a continuous welding procedure is also calculated. Finally, the influence of a joint oblique angle on welding residual stress is investigated numerically. The numerical results suggest that both deposition sequence and oblique angles have effect on welding residual stress distribution.     

ZnO layers grown by Atomic Layer Deposition: A new material for transparent conductive oxide

We demonstrate possibility of a control (by selection of zinc precursors and variation of a growth temperature) of electrical properties of ZnO films grown by Atomic Layer Deposition (ALD). ZnO films grown by ALD are used in test photovoltaic devices (solar cells) as transparent conductive oxides for upper, transparent layer in inorganic and organic solar cells, and as n-type partners of p-type CdTe.