A One‐Kilobit PQR‐CMOS Smart Pixel Array

The photonic quantum ring (PQR) laser is a three dimensional whispering gallery (WG) mode laser and has anomalous quantum wire properties, such as microampere to nanoampere range threshold currents and √T‐dependent thermal red shifts. We observed uniform bottom emissions from a 1‐kb smart pixel chip of a 32×32 InGaAs PQR laser array flip‐chip bonded to a 0.35 µm CMOS‐based PQR laser driver. The PQR‐CMOS smart pixel array, now operating at 30 MHz, will be improved to the GHz frequency range through device and circuit optimization.     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.     

LF6铝合金的超塑性／扩散连接组合工艺试验及理论研究EI

本文研究了ＬＦ６铝合金的超塑性／扩散连接组合工艺，用变形和再结晶的方法细化晶粒，成功地进行了ＳＰＦ／ＤＢ工艺试验，利用电子探针观察了扩散连接接头的界面微观区域，并从机理上分析了金属的超塑性／扩散连接两种工艺之间的内部联系及其金属学行为。     

精密铜带圆盘纵剪机

通过对精密铜带圆盘剪切机的工作原理和工艺过程进行研究，对引进的美国剪切机进行了技术改造，设计制作了新的装置，实现了软态铜带的剪切。     

砌筑砂浆达不到设计要求的事故原因分析

从砂浆的配合比、和易性、原材料等对砌筑砂浆达不到设计要求的事故原因进行了分析。     

基于遗传算法的工作辊温度场参数优化模型

针对热连轧机工作辊热辊形计算中温度场模型的热交换等参数难以确定的问题 ,建立了基于遗传算法的参数优化模型 ,可以解决复杂条件下的热参数的求解问题。利用优化参数计算的轧辊温度场与实际测量结果一致。     

Study of miscibility enhancement in poly(styrene‐co‐4‐vinylphenol)/poly(ethylene oxide) blends by the spin labelling method

The electron spin resonance (ESR) spectra of end‐group spin labelled poly(ethylene oxide) (SLPEO) using 2,2,6,6‐tetramethyl‐piperdine‐1‐oxyl nitroxide and its blends with poly(styrene‐co‐4‐vinylphenol) (STVPhs) of different hydroxyl contents were recorded over a wide temperature range. For a blend of SLPEO and pure polystyrene (PS), the ESR spectrum was composed of a single motion component, indicating that PS was immiscible with PEO. For blends composed of SLPEO and different‐hydroxyl‐content STVPhs, two spectral components with different motion rates were observed over a certain temperature range. The difference between the motion rates should be attributed to micro‐heterogeneity in the blends, with the faster rate corresponding to a nitroxide radical motion trapped in the PEO‐rich domain and the slower rate corresponding to a nitroxide radical motion trapped in the STVPh‐rich domain. Variations in the values of a number of the ESR parameters (T_a, T_d and T_50G) and the apparent activation energy (E_a) with hydroxyl content in the blends indicated that the miscibility of the blends increased with increasing hydrogen‐bonding density due to specific interactions between the hydroxyl groups in STVPh and the ether oxygens in PEO. Copyright © 2004 Society of Chemical Industry     

基于PTFE的PCB的多层层压方法

介绍了采用不同材料类型的粘结膜、半固化片、所需设备和粘结材料,用于生产低到高层数的PTFE多层板的情况。     

等腰梯形焊管孔型设计

在对等腰梯形焊管形状分析的基础上。精确计算了其周长，并在数学推导基础上，计算了各架次孔型尺寸，完成了等腰梯形焊管轧辊设计，使用结果表明；设计方法合理，孔型尺寸计算准确。使用效果良好。