Defect structure of gold introduced by high-speed deformation

The effect of deformation speed on defect structures introduced into bulk gold specimens at 298 K has been investigated systematically over a wide range of strain rate from ′=10⁻² to 10⁶ s⁻¹. As strain rate increased, dislocation structure changed from heterogeneous distribution, so-called cell structure, to random distribution. Also, stacking fault tetrahedra (SFTs) were produced at anomalously high density by deformation at high strain rate. The anomalous production of SFTs observed at high strain rate is consistent with the characteristic microstructure induced by dislocation-free plastic deformation, which has been recently reported in deformation of gold thin foils. Thus, the results of the present study indicate that high-speed deformation induces an abnormal mechanism of plastic deformation, which falls beyond the scope of dislocation theory. Numerical analysis of dislocation structure and SFTs revealed that the transition point of variation of deformation mode is around the strain rate of 10³ s⁻¹.     

锆钡镧铝氟化物玻璃的分相研究

本文综述了氟化物玻璃中的分相研究。在前人研究基础上应用透射电镜，X射线能谱，电子能量损失谱及X射线衍射，差热分析等研究了锆钡镧铝氟化物玻璃中的液-液分相，发现此种现象普遍存在于该类玻璃之中。对玻璃成分与分相形貌及微观结构之间的关系、对析出晶相种类及分相与析晶的相互影响进行了研究。提出欲降低氟化物玻璃的光损耗，分相与析晶一样是不容忽视的因素。     

复合材料压缩破坏模式的缺陷敏感性

本文基于弹塑性分叉理论研究单向纤维增强复合材料的压缩破坏模式和压缩强度对缺陷的敏感性问题。对于常见复合材料,所得结论是:无缺陷或者小缺陷情况的破坏模式为倾斜破坏带;大缺陷情况的破坏模式为水平破坏带;形成水平破坏带的压力值小于形成倾斜破坏带的压力。     

硅外延片中的杂质控制

有5类掺杂源影响硅的外延片中的杂质分布。主掺杂质控制外延层的杂质浓度，决定外延层的电阻率。固态外扩散、气相自掺杂和系统自掺杂影响衬底界面附近的外延层杂质浓度的深度分布。该文介绍了此3类掺杂源的掺杂过程和抑制方法。金属杂质在外延层中对器件有害，防止沾污和使用吸杂技术能降低金属杂质在外延层中的浓度。     

锅炉未焊透椭圆接管结构应力数值分析

应用有限元法对未焊透的椭圆接管结构进行了应力数值分析,并应用压力容器分析设计法,对该结构进行了疲劳分析,得出结构因未焊透缺陷导致疲劳破坏。     

光纤中二次谐波的产生及机理的电镜分析

本文报导了石英光纤中的二次谐波产生及用透射电子显微镜观察光纤内部物质结构变化的实验结果,观察到了已“预置”光纤中缺陷的存在.     

缺陷交互作用对陶瓷半导体导电性能的影响

本文借助于缺陷化学反应过程，分析了陶瓷半导体内缺陷间的交互作用，得到了陶瓷半导体实验研究的三个重要启示：（1）强还原（或氧化）或施主（或受主）掺杂对同一样品不能同时起到最佳效果；（2）本征原子空位对施主或受主的补偿导致电导率的非线性增长；（3）缺陷的缔合降低了半导化杂质的有效浓度，从而使电导性能发生异常变化。     

SAS数据挖掘在冷轧酸洗卷质量缺陷分析中的应用

数据挖掘作为一种发现大量数据中潜在信息的数据分析技术,受到各界的密切关注。SAS数据挖掘技术是众多数据挖掘方法中的佼佼者,它在大型企业中得到很好的应用。本文介绍数据挖掘的背景知识,并利用SAS/EM工具,对该技术在冷轧酸洗卷质量缺陷原因分析作了初步尝试。     

LearningADD: Machine learning based acoustic defect detection in factory automation

Defect inspection of glass bottles in the beverage industrial is of significance to prevent unexpected losses caused by the damage of bottles during manufacturing and transporting. The commonly used manual methods suffer from inefficiency, excessive space consumption, and beverage wastes after filling. To replace the manual operations in the pre-filling detection with improved efficiency and reduced costs, this paper proposes a machine learning based Acoustic Defect Detection (LearningADD) system. Moreover, to realize scalable deployment on edge and cloud computing platforms, deployment strategies especially partitioning and allocation of functionalities need to be compared and optimized under realistic constraints such as latency, complexity, and capacity of the platforms. In particular, to distinguish the defects in glass bottles efficiently, the improved Hilbert-Huang transform (HHT) is employed to extend the extracted feature sets, and then Shuffled Frog Leaping Algorithm (SFLA) based feature selection is applied to optimize the feature sets. Five deployment strategies are quantitatively compared to optimize real-time performances based on the constraints measured from a real edge and cloud environment. The LearningADD algorithms are validated by the datasets from a real-life beverage factory, and the F-measure of the system reaches 98.48 %. The proposed deployment strategies are verified by experiments on private cloud platforms, which shows that the Distributed Heavy Edge deployment outperforms other strategies, benefited from the parallel computing and edge computing, where the Defect Detection Time for one bottle is less than 2.061 s in 99 % probability.     

基于图像处理的片式元件缺陷检测算法

表面缺陷检测是电子元器件生产过程中的关键步骤,通过分析表面缺陷检测的现状问题,结合片式元件图像的自身特征,提出一种基于改进的自适应阈值canny算子的片式元件缺陷检测算法;该算法把片式元件灰度图像进行区域分割,得到不同值域范围内的灰度区域,利用带有敏感度的自适应双阈值canny算子进行边缘检测;算法实现结果表明,该算法能高效地检测并处理不同缺陷类型的片式元件,并且可以达到工业生产的检测速度。