Cure reaction for modified diallylbisphenol A/diaminodiphenylsulfone/bismaleimide

The glass‐transition temperature as a function of curing conversion for a modified diallylbisphenol A/diaminodiphenylsulfone/bismaleimide (BMI) resin was investigated at different temperature regimes and modeled using a modified Di Benedetto equation. Although the relationship between the glass‐transition temperature and conversion of the BMI system conforms to the Di Benedetto equation for α < 0.6 and at lower cure temperatures, at higher cure temperatures the results deviated significantly from the equation; thus, it was an inadequate model for the system. Fourier transform IR analysis showed that the major crosslinking reactions did not occur during cure for the modified BMI at and below 150°C. However, as the cure temperature was increased, the crosslinking reactions responsible for 3‐dimensional network structures became more dominant. At 190°C the C? N? C_stretch vibration of the uncured maleimide ring converted into succinimide rings in the curing process. Simultaneously, a decrease was observed for the absorbance bands of ? C? H_bending (maleimide). The higher cure temperatures induced a significantly faster initial crosslinking rate and also resulted in a shorter period of time after which further crosslinking was retarded, because the increase in the crosslinks also physically slowed further crosslinking activity. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 227–235, 2002     

双马来酰亚胺基体树脂的改性研究

本文报道用改性物B改善双马来酰亚胺/二胺预聚物溶解性的实验研究.结果表明,改性后的双马来酰亚胺/二胺基体树脂在低沸点、低毒性溶剂如丙酮中具有良好的溶解性,并且有足够的均相期,为湿法制作预浸料创造了有利条件.同时对树脂的固化反应、耐热稳定性及其复合材料在高温条件下(150℃、200℃)的层间剪切性能进行了研究.     

改性BMI微孔轴承保持器材料研究

采用改性双马来酰亚胺树脂制备微孔轴承保持器材料，探讨了制备工艺和最佳工艺参数，得到性能优良的改性双马来酰亚胺微孔轴在保持器材料。     

双马来酰亚胺/二烯丙基双酚A共聚树脂及其玻璃布层压板的制备和性能

用溶液法合成了双马来酰亚胺(BMI)/二烯丙基双酚A(DABPA)共聚树脂。用FTIR、~1H-NMR等方法表征了树脂的结构。DSC曲线显示该树脂的固化能与熔融法得到的基体树脂有所不同。该树脂固化后有良好的热稳定性。以该树脂为基体制备了玻璃布层压板,测试结果表明层压板具有较好的力学性能和电气性能可以作为耐高温结构材料或电绝缘材料在180～200℃长期使用。     

Surface and Interfacial Studies of Plasma-Modified Composite Surfaces

Model epoxy and bismaleimide compounds in thin film form were used to simulate epoxy and bismaleimide composite surfaces, in order to study compositional changes and interfacial reactions induced by oxygen plasma treatment. X-ray photoelectron spectroscopy (XPS) and infrared reflection-absorption spectroscopy (IR-RAS) were used to probe chemical changes which occurred. XPS and IR-RAS were found to be complementary techniques in determining the nature of functional groups incorporated into surfaces by plasma treatment. IR-RAS analysis of the model surfaces following exposure to a liquid epoxy resin revealed that while adsorption of the liquid epoxy occurred on both plasma-treated and nonplasma-treated surfaces, the oxygen plasma-treated surface alone was capable of initiating ring-opening reactions in the epoxy. However, this effect was not observed unless immediate contact was made between the plasma-treated surface and the liquid epoxy resin, illustrating the short-lived reactivity of the functional groups on the plasma-treated surface.     

Glass‐transition temperature in the curing process of bismaleimide modified with diallylbisphenol A

The T_g‐conversion relationship, during the thermal curing of different stoichiometric formulations of 1,1′‐(methylene‐di‐4,1‐phenylene) bismaleimide (BMI), modified with o,o′‐diallyl bisphenol A (DABA), was investigated. The DiBenedetto equation was used to model this relationship for the formulation of DABA‐1 (BMI : DABA, 1 : 1). Based on this model, the T_g‐conversion relationship of formulation DABA‐0.5 (BMI : DABA, 1 : 0.5) was modeled. The high consistency between the model curve and experimental data showed that the change of T_g, attributed to copolymerization between BMI and DABA in DABA‐0.5, in the low‐conversion regime, was the same as that in DABA‐1. This also verifies that, for the formulation DABA‐0.5, copolymerization and homopolymerization do not overlap with each other. The reactions progressed sequentially and homopolymerization occurred after completion of copolymerization. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 3244–3247, 2004     

双马来酰亚胺树脂的研究进展

研究了双马来酰亚胺树脂(BMI)在航空宇航工业中发挥其先进的聚合物基复合材料的作用,并发现BMI树脂的主要缺点是脆性大、固化温度和后处理温度高.综述了BMI研究现状和改性方法.详细介绍了各种BMI的增韧改性方法和增韧机理及最新研究进展.新的BMI改性方法和新型的改性剂将会随科技进步和工业发展的需要不断涌现,低成本和绿色成型技术将是未来BMI研究主要方向之一.     

缠绕用无溶剂低温固化双马来酰亚胺树脂体系

在乙烯基苄基化合物改性双马来酰亚胺树脂体系中添加烯丙基苯酚活性稀释剂,得到了粘度小于1000 mPa·s,加工适用期大于8 h,在150～155℃完成固化与后固化、适用于缠绕成型工艺的树脂体系。增韧改性后,该树脂的玻璃化转变温度达到261℃,拉伸强度和弯曲强度分别为73 MPa和133 MPa。     

新型高性能无溶剂双马来酰亚胺/氰酸酯浸渍树脂的研究

研发了一种新型高性能无溶剂双马来酰亚胺/氰酸酯浸渍树脂(HBC60),探讨了该树脂配方对树脂的成型工艺性、耐热性、力学性能和介电性能的影响.研究结果表明,HBC60树脂的成型工艺性取决于其组成的配比,所有配方都具有优良的工艺性,即低粘度、长工作期和良好的反应性;树脂固化物具有优异的介电性能、突出的耐热性(玻璃化转变温度约为300℃)和良好的力学性能.     

烯丙基化合物改性双马来酰亚胺反应机理的探讨

介绍了烯丙基化合物改性BMI树脂体系的反应机理,包括“ene”反应、Diels-Alder反应以及其它可能存在的反应。对比研究了二烯丙基双酚A醚(DABPE)/BDM和二烯丙基双酚A(DABPA)/BDM体系的固化机理和固化物的物性,表明DABPA的活性比较高。