喷镀系统在凸点制备中的应用

介绍了利用电镀法制造晶圆凸点的典型工艺和喷镀设备.喷镀系统是凸点电镀设备中最关健的部件.通过计算机软件模拟试验,对喷镀系统中的喷杯体和匀流板等各种参数和位置进行了优化设计,并在设备上应用验证.该系统在凸点电镀设备上应用后,在晶圆片上成功做出了高质量的均匀凸点,取得了良好效果.     

Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints

This paper is concerned with the mechanics of interfacial fracture that are active in two common testing configurations of solder joint reliability. Utilizing eutectic Pb-Sn/Cu as a reference system and assuming the presence of a predefined crack size in the intermetallic compound (IMC) layer, stress intensity factors (K _I and K _II) at the crack are numerically calculated for the two given configurations. The analysis of the tensile test configuration reveals that the fracture occurs by the crack-opening mode (K _I mode), as anticipated, but that it is greatly assisted by the viscoplasticity of the solder. With nonuniform viscoplastic deformation across the joint, K _I is found to increase much more rapidly than it would without the solder, decreasing the critical crack size to the micron scale. The same mechanism is also responsible for the development of a K _II comparable to K _I at the crack tip, that is, |K _I /K _II| ~ 1. It is also found that the predominant fracture mode in the bump shear configuration is crack opening, not crack shearing. This is an unexpected result, but numerical analyses as well as experimental observations provide consistent indications that fracture occurs by crack opening. During shear testing, bump rotation due to nonzero rotational moment in the test configuration is found to be responsible for the change in the fracture mode because the rotation makes K _I become dominant over K _II. With rotational moment being affected by the geometry of the bump, it is further found that the fracture behavior may vary with bump size or shape.     

Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints

The scope of this paper covers a comprehensive study of the lead-free Sn-Zn-Bi solder system, on Cu, electrolytic Ni/Au and electroless Ni(P)/Au surface finishes. This includes a study of the shear properties, intermetallic compounds at the substrate-ball interface and dissolution of the under bump metallization. The Sn-8Zn-3Bi (wt.%) solder/Cu system exhibited a low shear load with thick IMCs formation at the interface. The dissolution of the Cu layer in the Sn-Zn-3Bi solder is higher than that of the other two Ni metallizations. It was found that the formation of a thick Ni-Zn intermetallic compound (IMC) layer at the solder interface of the electrolytic Ni bond pad reduced the mechanical strength of the joints during high temperature long time liquid state annealing. The solder ball shear-load for the Ni(P) system during extended reflow increased with an increase of reflow time. No spalling was noticed at the interface of the Sn-Zn-3Bi solder/Ni(P) system. Sn-8Zn-3Bi solder with electroless Ni(P) metallization appeared as a good combination in soldering technology.     

倒装芯片凸焊点的UBM

介绍了倒装芯片凸焊点的焊点下金属（UBM）系统,讨论了电镀Au凸焊点用UBM的溅射工艺和相应靶材、溅射气氛的选择,给出了凸焊点UBM质量的考核试验方法和相关指标。     

冗余系统切换输出扰动问题的研究——ControlLogix冗余系统应用解决方案

冗余系统切换时发生输出扰动,对控制现场危害很大,引起的原因可能是网络硬件组态,也可能是程序运行结果,文章主要列举了冗余切换输出扰动的引起原因及解决方案。     

铸链炉卡伤轴承套圈的解决方法

针对热处理铸链炉加工轴承套圈产生卡伤现象,对其产生原因进行分析,提出解决的方法。     

超临界600MW直流锅炉蒸汽吹管

结合我公司超临界600MW直流锅炉的特点,通过分析比较了目前常用的两种吹管方式的的优缺点,并提出了英巴推荐的吹管方式,以及吹管后的检查工作。     

浅谈高速公路桥头跳车的成因及其控制

分析研究了高速公路桥头跳车的危害、成因,结合工程实践,从设计、施工等方面提出预防控制措施,以延长高速公路使用寿命、提高行车舒适感、发挥其社会效益,对今后施工起到借鉴作用.     

公路桥头跳车的成因及防治措施

从地基沉降、台背填料、压缩沉降、施工、设计、自然因素等方面分析了公路桥头跳车的成因,针对桥头跳车造成的危害,提出了几种常用的防治桥头跳车的措施,并结合施工实践,给出了一些施工工艺及设计上的建议,以保证行车的舒适性和安全性。     

衬底对铟凸点织构的影响研究

为研究衬底材料对所溅射的铟织构模式的影响，选用UBM(Under Bump Metallization)膜、InSb单晶和无定形PR(光刻胶)3种不同衬底材料磁控溅射铟，实验对比了3种衬底材料对铟织构的影响。实验结果表明：铟的织构模式基本不受衬底材料的影响，其织构模式主要为强(101)丝织构和弱的(110)丝织构。这证明了铟的织构形成机理是典型的生长竞争机制。