Electrochemical analysis of zincate treatments for Al and Al alloy films

Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.     

平煤四矿丁5,6煤层冲击动力灾害危险区域划分的研究

为了进一步研究和评价矿井冲击地压特征,结合平煤四矿丁5,6煤层阐述了煤岩冲击倾向性测试方法、测试过程及测试结果,根据测试结果在丁5,6煤层中选取了一些特征点,结合开采条件对这些特征点进行赋值,最后运用科学绘图软件绘制了丁5,6冲击动力灾害危险区域划分图,从图中可看出大部分区域为弱冲击倾向,在西翼19160和19180间的窄煤柱区域由于受到两侧采空影响,应力集中很高,具有强冲击倾向,在煤层合并线及煤柱拐角处以及上山煤柱边缘具有中等冲击倾向,为矿井制定有针对性的防治措施提供了参考依据.     

Using LaModel to analyze coal bumps

Coal bumps have long been a safety hazard in coal mines, and even after decades of research, the exact mechanics that cause coal bumps are still not well understood. Therefore, coal bumps are still difficult to predict and control. The LaModel program has a long history of being used to effectively analyze displacements and stresses in coal mines, and with the recent addition of energy release and local mine stiffness calculations, the LaModel program now has greatly increased capabilities for evaluating coal bump potential. This paper presents three recent case histories where coal stress, pillar safety factor, energy release rate and local mine stiffness calculations in LaModel were used to evaluate the pillar plan and cut sequencing that were associated with a number of bumps. The first case history is a longwall mine where a simple stress analysis was used to help determine the limiting depth for safely mining in bump-prone ground. The second case history is a room-and-pillar retreat mine where the LaModel analysis is used to help optimize the pillar extraction sequencing in order to minimize the frequent pillar line bumps. The third case history is the Crandall Canyon mine where an initial bump and then a massive pillar collapse/bump which killed 6 miners is extensively back-analyzed. In these case histories, the calculation tools in LaModel are ultimately shown to be very effective for analyzing various aspects of the bump problem, and in the conclusions, a number of critical insights into the practical calculation of mine failure and stability developed as a result of this research are presented.     

健身车人机交互系统的研究与实现

在分析交互信息的种类、传输方式的基础上，研究了交互系统的结构，综合运用力反馈技术、传感器技术、DSP控制技术、碰撞检测技术、多通道交互技术，实现了人在虚拟环境中的漫游，增强了人机交互的真实感，提出了一种实现虚拟现实技术与人机交互技术相结合的新方案。     

Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints

Fe-Ni films with compositions of Fe-75Ni, Fe-50Ni, and Fe-30Ni were used as under bump metallization （UBM） to evaluate the interracial reliability of SnAgCu/Fe-Ni solder joints through ball shear test, high temperature storage, and temperature cycling. The shear strengths for Fe-75Ni, Fe-5ONi, and Fe-3ONi solder joints after reflow were 42.57, 53.94 and 53.98 MPa, respectively, which were all satisfied the requirement of industrialization （〉34.3 MPa）. High temperature storage was conducted at 150, 175 and 200 ℃. It was found that higher Fe content in Fe-Ni layer had the ability to inhibit the mutual diffusion at interface region below 150 ℃, and the growth speed of intermetallic compound （IMC） decreased with increasing Fe concentration. When stored at 200 ℃, the IMC thickness reached a limit for all three films after 4 days, and some cracks occurred at the interface between IMC and Fe-Ni layer. The activation energies for the growth of FeSn2 on Fe-30Ni, Fe-5ONi, and Fe-75Ni films were calculated as 246, 185, and 81 kJ/mol, respectively. Temperature cycling tests revealed that SnAgCu/Fe-5ONi solder joint had the lowest failure rate （less than 10%）, and had the best interfacial reliability among three compositions.     

WDM传输系统中泵浦配置对光纤拉曼放大器增益特性的影响

通过理论分析和模拟运算,研究了光纤拉曼放大器泵浦优化的一般规律。     

臭氧在食品加工用水处理工程上的应用

本文叙述了臭氧的一些特性 ,并以烟台某食品加工公司食品加工用水处理工程为例 ,介绍了臭氧的产生及应用情况 ,提供了处理前后水中各项指标的对照     

分步法电镀制备的Au-Sn共晶凸点的微观组织

研究金属离子与络合剂摩尔浓度比、pH值及电镀温度对Au、Sn镀层表面形貌及其镀速的影响。通过分步法电镀Au/Sn/Au三层结构薄膜,并回流制备Au-Sn共晶凸点。结果表明:镀Au过程中,随着Au离子与亚硫酸钠摩尔浓度比的增加,Au镀层晶粒细化,并在摩尔浓度比为1:6时获得了最快的沉积速度;当电镀温度较低时,镀Au层表面呈多孔状,随着温度的升高,镀层致密性增加,晶粒也趋于圆滑。镀Sn过程中,随着Sn离子与焦磷酸钾摩尔浓度比的增大,镀层表面起伏加剧,镀层孔洞增多。当pH值为8.0时,镀层平整致密,随着pH值的增高,析氢反应加剧,Sn离子水解,导致镀层质量下降。运用分步法电镀制备的Au/Sn/Au三层结构薄膜均匀,回流得到了具有典型共晶组织的Au-Sn凸点。     

UBM凸点互连结构信号完整性分析

建立了凸点下金属层(under bump metallization,UBM)和凸点互连结构仿真分析模型,基于HFSS软件对其高频条件下的信号完整性进行了研究.得到了UBM凸点互连结构表面电场强度分布,分析了UBM各层厚度及不同材料组合变化对UBM凸点互连结构信号完整性的影响.结果表明,不同信号频率下电场强度在凸点及UBM各层表面分布不均匀,越接近UBM顶端电场强度越大;随信号频率的提高,UBM凸点互连结构的回波损耗增大而插入损耗减小;随镍层厚度、铜层厚度和钛层厚度的增加插入损耗减小;采用Ti-Wu-Au组合UBM凸点互连结构的信号完整性最好,Ti-Cu-Ni组合次之,而Cr-Ni-Au组合最差.     

三河尖煤矿高应力区冲击矿压动态防治实践

介绍三河尖矿采用动态防治的方法,在具有冲击倾向的9202工作面高应力地区成功防治冲击矿压的技术实践。