导电塑料概述

概述了导电塑料的发展状况，对其分类情况，应用领域，导电机理及制备工艺进行了阐述，并介绍了导电塑料的最新进展及动向。     

用于氮化铝陶瓷基片的电子浆料

研制了用于ＡｌＮ陶瓷基片的导体银浆和电阻浆料。采用低ＰｂＯ含量晶化玻璃料配制银导体浆料，玻璃软化点４３０～４５０℃。电阻浆料采用ＰｂＯ（质量分数小于６％）的晶化玻璃料Ｂ、Ｃ、Ｄ三种，软化点分别为５２０℃、６９０℃、６１０℃。改变ＲｕＯ２与玻璃相的质量比，能控制电阻浆料的方阻值。质量比在５０比５０至１５比８５之间。加入添加剂ＭｎＯ２可改善电阻浆料的ＴＣＲ，阻值在２０Ω／□～１ＭΩ／□范围内，ＴＣＲ绝对值小于２００×１０－６／℃。     

Chemical and electrochemical synthesis of conducting graft copolymer of acrylonitrile with aniline

A new conducting copolymer, polyacrylonitrile‐graft‐polyaniline (PAN‐g‐PANi), has been prepared by chemical and electrochemical methods from a precursor polymer. Poly[acrylonitrile‐co‐(acrylimine phenylenediamine)] (PAN‐co‐PAIPD) was synthesized chemically by reacting PAN with sodium 1,4‐phenylenediamine salt. PAN‐g‐PANi was synthesized chemically using ammonium peroxydisulfate as the oxidant and p‐toluenesulfonic acid in dimethylsulfoxide solution and adding aniline to oxidized PAN‐co‐PAIPD. Electrochemical polymerization was carried out by spin coating PAN‐co‐PAIPD on the surface of a Pt electrode, then the growth of the graft copolymer (PAN‐g‐PANi) in the presence of fresh aniline and acidic solution. The structures of the graft copolymer and PAN‐co‐PAIPD were characterized using UV‐visible, Fourier transform infrared, and ¹H and ¹³C NMR spectroscopies. The thermal properties of PAN‐g‐PANi were studied using thermogravimetric analysis and differential scanning calorimetry. Scanning electron microscopy (SEM) images showed that the morphology of PAN‐g‐PANi copolymer films was homogeneous. Electrical conductivity of the copolymer was studied using the four‐probe method, which gave a conductivity of 4.5 × 10^?3 S cm^?1 with 51.4% PANi. SEM and electrical conductivity measurements supported the formation of the graft copolymer. Copyright © 2006 Society of Chemical Industry     

炼钢电炉用耐火材料

叙述了炼钢用耐火材料的发展动态，特别是电炉（含超高功率和直流电弧炉）炼钢用耐火材料对于我国钢铁工业发展的意义和关系。直流电弧炉内导电炉底耐火材料的技术性能取决于所用的材质、制造工艺、石墨的粒度和含量以及热处理的温度和制度。     

碘酸钾作氧化剂合成聚苯胺及其性能研究

本文以盐酸苯胺为原料,碘酸钾作氧化剂,在盐酸水溶液中化学法合成聚苯胺,研究了碘酸钾、盐酸苯胺、盐酸的浓度及配比、反应温度和反应时间等对苯胺聚合及产物性能的影响。发现碘酸钾是制备聚苯胺的一种很理想的氧化剂,在很宽广的反应条件范围里,都可以获得具有良好导电性的聚合产物。FT-IR及X射线衍射分析的结果表明,聚合产物在本征态时具有emeraldine式的结构,盐酸掺杂前后都呈非晶态。     

Helical polyaniline induced by specific interaction with biomolecules in neutral solution

Some kinds of sugar and amino acid are used to interact with polyaniline emeraldine base in neutral aqueous solution. PANI complexed with these molecules shows interesting induced circular dichirom (ICD) spectra, which indicates that excess one-handed helical structure is induced on PANI. Furthermore, opposite ICD spectra are observed for PANI while it is interacted with l- and d-amino acid, respectively. It is presumed that H-bonding interaction plays a central role in such a helical induction. This is the first example to prepare optically active PANI in neutral solution by one step without protonating EB into polycation in advance.     

辐射交联对LDPE/CB复合物PTC效应稳定性的影响

研究了低密度聚乙烯（LDPE）／炭黑（CB）复合物在升温、降温循环中的导电性能。利用示差扫描量热分析仪（DSC）研究了复合物的熔融行为，以及应用压力－体积－温度分析仪（PVT）研究了复合在聚合物熔点时的体积膨胀性能。结果表明，辐射交联可以有效地提高复合物正温度系数（PTC）效应的重复性，纯凝胶复合物的PTC强度显著降低，说明溶胶在聚乙烯熔点时的体积膨胀是交联复合物正温度系数（PTC）效应的产生的重要原因。     

导电衬垫材料的屏蔽效能研究

导电衬垫材料是计算机防信息泄漏研究中应用最广泛的一类屏蔽材料，在研制TEMPEST计算机中发挥了重要的作用，本文通过对6种常用的导电衬垫材料的屏蔽效能的测试研究，得出了一些有工程参考价值的结论。     

高电导率聚苯胺

聚苯胺是导电离分子化合物中一个极有应用前途的功能高分子材料，而阻碍其应用前景的主要有两个方面：其一是不溶不熔，其二是电导率较低。本实验采用新的掺杂方法，得到机械强度、溶解性、电导率均高于传统各类合成方法的导电聚苯胺。     

聚苯胺和聚对苯二甲酰对苯二胺导电复合物的研究

聚对苯二甲酰对苯二胺(PPTA)与导电性聚苯胺(PAn)共混,得到一种既有PPTA的液晶性,又有PAn导电性的全新材料。PPTA和PAn以不同质量比共溶于浓硫酸后,可制成线材及薄膜,在1mol/1HCl水溶液中成型及拉伸。实验结果表明:PPTA的液晶性随PAn加入量的增加稍有减弱;线状PPTA/PAn的抗张强度随PAn混入量的增加而增大(从41.20N/mm~2增至44.80N/mm~2);断裂伸长与PAn混入量的多少无关(仍保持在4%),PPTA/PAn复合物的电导率随PAn含量的增加而升高,当PPTA:PAn=2:1(质量比)时,其电导率为2.3×10~(-1)S/cm,较纯PAn(3-5S/cm)小一个数量级,复合物的衍射图在2θ=22.7°及25°处有两个峰,分别与纯PPTA及统PAn的峰的位置相同,因此说明二者是以分子复合形式存在。SEM图表明复合物线材表面呈取向排列,且PPTA与PAn混合均匀。