On the permeation rate of copper extraction through liquid membranes

The understanding of the permeation rate of metal ions through liquid membranes is important for the design of such systems. In this paper, the permeation rates of copper ions through liquid surfactant membranes, including interfacial reaction rates and the diffusion rate of the copper ion, were analyzed using a model based on a mobilized hollow spherical globule configuration. The analysis shows that the extracting reaction is dominant at the external interface of the membrane and the stripping reaction is dominant at the internal interface; this means the reactions at both interfaces are not in equilibrium during the course of extraction. It also shows that the extraction rate, the diffusion rate and the stripping rate are not of equal value, especially at the early stage of the run.     

Growth and characterization of barium copper oxalate single crystals in gels

Barium copper oxalate was grown in silica hydrogel at ambient temperature. The effect of various parameters like gel pH, gel density, gel aging and concentrations of reactants on the growth of these crystals was studied. The crystals grown were characterized by chemical analysis, X-ray powder diffractometry, infrared spectroscopy, thermogravimetric and differential thermal analysis. The results of these observations are described and discussed.     

The initial behaviour of freshly etched copper in moderately acid, aerated chloride solutions

When freshly etched samples of various types of copper were exposed in moderately acid, aerated chloride solutions, two phenomena were observed. First the corrosion potential and the pH of the solution decreased over a shorter time, then the potential increased over a long period (600-1500 min), following an s-shaped pattern. Increase in pH during the second stage was avoided using a pH-stat. The corrosion rate increased little or not at all over the entire period. A tentative interpretation of the short-term behaviour is presented with some reservation. The long-term development of the potential suggests phase formation or transformation following the Avrami pattern. By suitable derivations it was possible to fit the development of potentials to the Avrami equation. Subsequent examinations by Auger spectroscopy proved the presence of thin layers of Cu₂O on the copper surfaces, increasing in thickness with exposure time. The dissolution kinetics can be described in terms of two parallel electrochemical reactions and a simultaneous non-electrochemical dissolution reaction.     

UL简介与CCL认可

本文从六个方面对UL的基本知识作了一个简要的概述及CCL认可过程的介绍,希望能为业界同仁提供一个参考方向。     

对未来我国覆铜板业技术发展的战略与任务的探讨

对未来十年我国覆铜板业技术发展的战略与技术开发重点任务进行了探讨。     

精密铜带圆盘纵剪机

通过对精密铜带圆盘剪切机的工作原理和工艺过程进行研究，对引进的美国剪切机进行了技术改造，设计制作了新的装置，实现了软态铜带的剪切。     

Effects of thermal oxidation conditions of silicon electrodes on cathodic electrochemiluminescence of Ru(bpy)3 chelate

Hot electrons emitted from thin oxide film-coated heavily doped silicon electrodes by cathodic pulse polarization can induce electrochemiluminescence from luminophores. The intensity of electrochemiluminescence produced at the electrode surface is dependent on the features of thin oxide films formed by thermal oxidation. As a preliminary study, we investigated the effect of thermal oxide growth conditions on the intensity of electrochemiluminescence produced at these electrodes, such as oxidation atmospheres, oxidation temperature, oxidation time and pre-treatment of wafers, using ruthenium(II) tris-(2,2′-bipyridine) chelate as a model luminophore. Optimal oxidation conditions of heavily doped silicon electrodes were obtained for the generation of intense electrochemiluminescence at this kind of silicon electrodes.     

ULSI中的铜互连线RC延迟

随着ULSI向深亚微米特征尺寸发展，互连引线成为ULSI向更高性能发展的主要限制因素。由互连引线引起的串扰噪音及RC延迟限制了ULSI的频率性能的提高，同时考虑到电迁移和功率损耗，人们开始寻找新的互连材料；低电阻率的铜互连材料和低介电常数介质的结合可以有效地发送互连线的性能，主要讨论了互连延迟的重要性以及发送和计算延迟的方法。     

石墨电极高温抗氧化技术研究现状

概述石墨电极抗氧化技术的研究现状，重点介绍选择抗氧化涂层体系的要求及涂层制备方法，包括包埋浸渗法、化学气相沉积法、等离子喷涂法及溶胶--凝胶法．展望了石墨电极材料高温抗氧化涂层研究的方向．     

进一步降低钼精矿中铜、铅含量的生产实践

分析了钼精矿Cu、Pb含量高的主要原因 ,通过实施一系列措施 ,达到了降低钼精矿中Cu、Pb含量的目的