Cu-Fe-Cr原位复合材料的纤维相结构

通过感应熔炼和冷拔变形制备了Cu 16Fe 2Cr原位复合材料 ,将铜基体选择腐蚀后提取出了纤维 ,采用SEM和TEM观察分析了纤维相结构。在较低的应变量 (η =1.6 7)时 ,纤维不均匀 ,随着变形量的增大 (η =5 .42 ) ,纤维外形变得均匀。在 η =5 .42时 ,一个显著的特点是单根Fe Cr纤维分为一些由晶界隔开的平行亚单元 (宽度约为 10 0nm) ,通过亚单元共同的 [110 ]衍射获得了晶粒之间的相对取向 ,相邻晶粒的取向角在 3°～ 15°之间。     

电解电容器铝箔纯交流腐蚀工艺影响因素的研究

对电解电容器铝箔交流腐蚀体系中各影响因素的研究结果表明，在电流密度为０．５Ａ／ｃｍ２，温度为４７±２℃；控制腐蚀液中Ａｌ（３＋）含量及适量添加表面保护剂和辅助添加剂的条件下，可获得最大比电容。通过循环伏安曲线测试，探讨了各因素影响腐蚀的机理及相互关系。     

Electrochemical investigations of copper behaviour in different cupric complex solutions: Voltammetric study

The electrochemical behaviour of copper has been investigated in different cupric complex solutions by cyclic voltammetry. In pyridinic and picolinic solutions the reduction of cupric complex occurred in two stages leading to Cu(I) and Cu(0), respectively. The electrodeposited copper is oxidized in two steps leading to Cu(I) and Cu(II) as in ammoniacal cupric complex solutions. In glycine, alanine, sulfamic acid and ethylenediamine solutions, the cuprous complex is an intermediate in the cupric complex reduction but it is not detected during the oxidation of the electrodeposited copper in these solutions. In EDTA and triethanolamine solutions, the cuprous complex is not observed. The rate of copper etching was determined in pyridinic and ammoniacal cupric solutions and was shown to be faster in ammoniacal cupric solutions than in the pyridinic solutions.     

Modelling of copper etching in aerated chloride solutions

The effect of dissolved oxygen on the rate of chemical etching of copper by acidic cuprous chloride solution was investigated numerically for the case of a rotating disc electrode (RDE). Copper dissolution in aerated acidic cupric chloride solutions of composition 3.5M CuCl2 + 0.5M HCl + 0.5M KCl and 3.5M CuCl2+0.5M HCl was investigated with consideration of the instantaneous homogeneous reaction 4CuCl32-+4H++O2rlhar4CuCl 3-+2H2O which takes place within the mass transport boundary layer. It was assumed that CuCl32- and O2 react instantaneously, resulting in the formation of a reaction plane which separated the mass transport boundary layer into two regions: a region adjacent to the electrode where oxygen was depleted, and a region adjacent to the bulk where CuCl32- was absent. A one-dimensional mathematical model was developed to predict the position of the reaction plane. The model accounted for diffusion, migration and fluid flow generated by an RDE and included nine species and five heterogeneous electrochemical reactions. The homogeneous redox reaction served to regenerate the chemical etchant solution and thus enhance the etch rate. With increasing oxygen concentration and rotation rate the reaction plane was found to move closer toward the electrode and thus the etch rate of copper increased. Addition of KCl increased the Cl- content in solution so as to shift the reaction plane toward the bulk.     

Evaluation of some of the properties of plasma treated wool fabric

Low temperature plasma (LTP) treatment was applied to wool fabric with the use of a nonpolymerizing gas, namely oxygen. Properties of the LTP‐treated samples including low stress mechanical behavior, air permeability, and thermal characteristics were evaluated in this study. Kawabata evaluation system fabric (KES‐F) was employed to determine the tensile, shearing, bending, and compression strength properties and surface roughness of the specimens. The changes in these properties are believed to be closely related to the interfiber and interyarn frictional force induced by the LTP. The decrease in the air permeability of the LTP‐treated wool fabric was found to be probably because of the plasma action effect on increasing the fabric thickness and a change in fabric surface morphology, which was confirmed by scanning electron microscopy micrographs. The change in the thermal properties of the LTP‐treated wool fabric was in good agreement with the earlier findings and can be attributed to the amount of air trapped between the yarns and fibers. This study suggested that the LTP treatment can influence the final properties of the wool fabric, and also provide information for developing LTP‐treated wool fabric for industrial use. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 5958–5964, 2006     

The Effect of Aluminum Ions on the DC Etching of Aluminum Foil

A study has been made of the electrochemical etching of 99.99% aluminum foils at a current density of 50 mA cm^–2in AlCl₃–HCl solutions (1 m Cl^–) at 80 °C. The solutions were made by dissolving metallic aluminum into 1m HCl solution, to give a Cl^– concentration of 1 m. The number density of etch tunnels and the homogeneity of tunnel length decreased, and the mean pit size and its standard deviation increased with increasing Al³⁺ concentration. The results were discussed based on potential transients at a current density of 50 mA cm^–2, current–potential curves at a scan rate of 10 m Vs^–1 and electrochemical impedance spectra.     

通过淀积-腐蚀-淀积实现平坦化的研究

在半导体器件和集成电路的研制和制备过程中,随着工艺水平的提高及技术进步,双层乃至多层布线越来越多,尺寸也越来越小。然而,在尺寸较小、台阶较高的情况下,如果在第一层金属上淀积介质后直接形成上层布线就会导致断条现象的出现,这就导致了平坦化成为非常重要的一项工艺。给出了平坦化工艺的基本原理,通过优化工艺条件并进行实验验证,确定了平坦化的最佳工艺条件,可以确保进行一次金属刻蚀以后,片子表面仍能基本平坦,这样就为二次布线打下了良好基础,杜绝了断条现象的产生。     

Self-aligned fabrication of single crystal diamond gated field emitter array

This paper describes a self-aligned fabrication process for diamond gated field emitter array (FEA). Utilizing the non-conformal coverage sputtering conditions of silicon oxide, an interesting “sphere on cone” structure is formed on diamond nano tip array, which is the key point of gate hole opening process. This structure causes shadowing at certain regions of side-wall during Ti / Au gate metal deposition. Removal of “sphere” by wet etching leads to the successful fabrication of a single crystalline diamond gated FEA. Scanning electron microscope observations reveal the fabrication of a uniform emitter array with tip radius of curvature (20 nm) and gate hole (1.4 μm). We also confirmed that no noticeable physical damage exists on tip. In field emission characteristics of the fabricated single crystal diamond gated FEA, gate voltage control of field emission current is realized.     

Environmental etch performance, and scratch and mar of automotive clearcoats

Environmental etch damage to automotive coatings, and scratch and mar of these coatings are an important element of customer satisfaction as well as a significant warranty repair consideration for automotive companies. The conditions that result in environmental etch are examined and a laboratory test proposed. Data from this test are compared to automotive hoods exposed in Florida. The performance of various crosslinking chemistries is discussed and the requirements for improved environmental etch are outlined. Scratch and mar performance of these systems is also reviewed. We have found that coatings respond to physical stress by elastic recovery, by plastic flow and by brittle fracture. Classifying types of damage in this way is important for understanding the chemistry needed for improved scratch and mar of coatings.     

Electrochromic WO3−x films with reduced lattice deformation stress and fast response time

Electrochromic properties of electrochemically deposited and etched (EDE) WO_3−x films have been investigated using voltammetry and nanogravimetry to elucidate the amount of residual stress associated with lattice polarization and deformation in WO_3−x nanoparticles. The cathodic WO_3−x deposition from pertungstic acid solution and unusual properties of the cathodic electroetching of the oxide in tetraethyl ammonium chloride solution are reported and elucidated on the basis of Electrochemical Quartz Crystal Nanogravimetry (EQCN) measurements. The stress enhanced resonant frequency shift was observed upon WO_3−x film coloration. However, the stress enhancement appeared to be much lower (up to 4-6 times) than that measured for films synthesized by other methods. The stress reduction in WO_3−x films under study has been attributed to the stress relaxing propensity of EDE film to suppress the compressive stress wave. A considerable isotopic effect has been observed in nanogravimetry of the H⁺ and D⁺ ion intercalation into WO_3−x films. We have found that the isotopic effect is primarily due to the true mass loading difference between hydrogen and deuterium ions, for the same concentration of color centers (2.65 × 10²¹ cm⁻³), since EQCN frequency shifts associated with stress in the film for H⁺ and D⁺ are very close to each other.