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41.
采用聚苯乙烯(PS)和丁二烯与苯乙烯的嵌段共聚物(S BS)为成膜物,以硫酸钡、聚异丁烯为填料和改性剂,并加入偶联剂,获得有较强防腐能力的蚀刻用保护涂料并筛选出最佳工艺条件.在较高温度下,该涂料对饱和氟化氢、饱和氟化氢铵溶液等强腐蚀性介质有良好的化学稳定性,可用于玻璃、石英蚀刻中的表面防腐.  相似文献   
42.
The combination of directional solidification and selective dissolution was applied to fabricate tungsten (W) wires and porous NiAl matrix. A NiAl–W pseudobinary eutectic alloy with 1.5?at.% tungsten was directionally solidified in a Bridgman-type oven at 1700°C. Results confirmed that the relationships of the growth rate with the interfibrous spacing and diameter of W fibrous phases in the directionally solidified samples are in accordance with the Jackson and Hunt (J?H) model. Afterward, the NiAl matrix was selectively dissolved in an HCl:H2O2 solution to reveal W wires, which present various three-dimensional (3D) morphologies at different growth rates. The W fibrous phases in the NiAl–W alloy samples were then selectively removed with a mixed etchant of ammonium acetate to form a porous NiAl matrix at a constant potential. Dynamic corrosion curves revealed that etching W from the NiAl matrix was inhibited after 2–3?h. The porous structures of NiAl after removing W phases are linked to the 3D morphologies of W fibrous phases embedded in the NiAl matrix. The aspect ratio of W wires and the structures of porous NiAl can be adjusted by selecting the process parameters of this combined technology.  相似文献   
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44.
采用吹砂处理、砂带抛光、毡轮抛光3种表面处理使铸态单晶(SX)Ni基高温合金叶片表面形成塑性变形层,对叶片表面变形层进行电解腐蚀实验,然后进行标准热处理,研究了单晶高温合金叶片表面处理的变形层及其电解腐蚀后显微组织。结果表明:3种表面处理的铸态单晶高温合金叶片表面变形层深度分别约为6,3.5μm和2μm,并在吹砂处理和砂带抛光的表面变形层周围存在显微裂纹;表面变形层电解腐蚀过渡区内存在大量γ′变形组织,且3种表面处理的塑性变形残存量依次递减,而变形层完全电解腐蚀区内无塑性变形痕迹;标准热处理后,变形层未电解腐蚀区存在凹陷特征和再结晶晶粒,但无塑性变形痕迹;变形层完全电解腐蚀区无明显凹坑和再结晶晶粒。  相似文献   
45.
在硅片表面制备绒面结构能够有效降低太阳光在硅片表面的反射损失,是提高太阳能电池转换效率的一条重要途径。通过真空热蒸发法在多晶硅片上沉积纳米银颗粒,利用金属辅助化学腐蚀(MACE)法,制备了不同腐蚀时间下的纳米绒面结构,其中,腐蚀时间为60s的纳米绒面的平均反射率低至4.66%(300~1100nm)。同时,对腐蚀时间为60s的纳米绒面用KOH溶液进行优化处理,将KOH处理前后的多晶硅片采用常规电池工艺进行电池制备研究。对比发现,经过KOH处理后的电池效率比未经KOH处理的电池效率提高了0.43%。  相似文献   
46.
硅烷偶联剂表面改性玄武岩纤维增强复合材料研究进展   总被引:1,自引:0,他引:1  
表面改性是增强玄武岩纤维与基体材料之间结合性能的关键。综述了硅烷偶联剂表面改性以及酸、碱刻蚀,等离子处理辅助协同硅烷偶联剂表面改性玄武岩纤维的研究进展,介绍了硅烷偶联剂表面改性玄武岩纤维在聚合物基复合材料中的应用,并对发展趋势进行了展望,同时分析了硅烷偶联剂表面改性玄武岩纤维当前存在的问题。  相似文献   
47.
通过实验与有限元(FDTD)模拟系统研究了不同粒径尺寸的Ag纳米颗粒在P(100)Si表面刻蚀过程中等离激元光散射增强对刻蚀孔形貌的影响。SEM结果表明,刻蚀孔由与粒径尺寸接近的垂直孔演化为一种上大下小的火炬状形貌特征孔,该孔的直径与纳米颗粒尺寸散射半径相仿。模拟不同粒径的Ag纳米颗粒进入刻蚀孔后的光散射特征,证实了Ag纳米颗粒等离激元散射对刻蚀孔初期形成的重要作用。分析表明,基于光照条件下电子-空穴的激发特征,刻蚀孔的形貌主要依赖Ag纳米颗粒等离激元散射的光增强,即通过改变入射光频率以及Ag纳米颗粒粒径可以有效地调控Si表面形貌特征。Ag纳米颗粒等离激元光散射增强技术在Si基太阳能电池、发光二极管(LED)器件等领域有潜在应用前景。  相似文献   
48.
Two InP‐based III–V semiconductor etching recipes are presented for fabrication of on‐chip laser photonic devices. Using inductively coupled plasma system with a methane free gas chemistry of chlorine and nitrogen at a high substrate temperature of 250 °C, high aspect ratio, anisotropic InP‐based nano‐structures are etched. Scanning electron microscopy images show vertical sidewall profile of 90° ± 3°, with aspect ratio as high as 10. Atomic Force microscopy measures a smooth sidewall roughness root‐mean‐square of 2.60 nm over a 3 × 3 μm scan area. The smallest feature size etched in this work is a nano‐ring with inner diameter of 240 nm. The etching recipe and critical factors such as chamber pressure and the carrier plate effect are discussed. The second recipe is of low temperature (?10 °C) using Cl2 and BCl3 chemistry. This recipe is useful for etching large areas of III–V to reveal the underlying substrate. The availability of these two recipes has created a flexible III–V etching platform for fabrication of on‐chip laser photonic devices. As an application example, anisotropic InP‐based waveguides of 3 μm width are fabricated using the Cl2 and N2 etch recipe and waveguide loss of 4.5 dB mm?1 is obtained.
  相似文献   
49.
Ultralow expansion (ULE) glasses are of special interest for temperature stabilized systems for example in precision metrology. Nowadays, ULE materials are mainly used in macroscopic and less in micromechanical systems. Reasons for this are a lack of technologies for parallel fabricating high-quality released microstructures with a high accuracy. As a result, there is a high demand in transferring these materials into miniaturized application examples, realistic system modeling, and the investigation of microscopic material properties. Herein, a technological base for fabricating released micromechanical structures and systems with a structure height above 100 μm in ULE 7972 glass is established. Herein, the main fabrication parameters that are important for the system design and contribute thus to the introduction of titanium silicate as material for glass-based micromechanical systems are discussed. To study the mechanical properties in combination with respective simulation models, microcantilevers are used as basic mechanical elements to evaluate technological parameters and other impact factors. The implemented models allow to predict the micromechanical system properties with a deviation of only ±5% and can thus effectively support the micromechanical system design in an early stage of development.  相似文献   
50.
In this paper the process of silicon anisotropic etching in KOH solutions containing isopropyl alcohol in a wide concentration range is extensively studied. Though the alcohol does not take part in the etching process itself, it strongly affects the etching results. Both etch rates and the roughness of etched surfaces depend on the alcohol concentration in the etching solution, which is connected with the adsorption phenomena on the etched surface. The surface coverage with alcohol depends on the level of saturation of the etching solution and crystallographic orientation of an etched surface. It was observed that the best morphology of (1 1 0) surface was achieved just below saturation level with IPA whereas the (1 0 0) surfaces were improving above the saturation. A model, which explains these phenomena, was proposed. Based on this model, a simple way of selection of the composition of KOH solutions with alcohol additives, assuring optimization of etching results was suggested. The method is restricted to surface tension measurements and allows one to avoid elaborated etching experiments.  相似文献   
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