Electrolyte composition and removal mechanism of Cu electrochemical mechanical polishing

The optimization of electrolytes and the material removal mechanisms for Cu electrochemical mechanical planarization （ECMP） at different pH values including 5-methyl-1H-benzotriazole （TTA）, hydroxyethylidenediphosphoric acid （HEDP）, and tribasic ammonium citrate （TAC） were investigated by electrochemical techniques, X-ray photoelectron spectrometer （XPS） analysis, nano-scratch tests, AFM measurements, and polishing of Cu-coated blanket wafers. The experimental results show that the planarization efficiency and the surface quality after ECMP obtained in alkali-based solutions are superior to that in acidic-based solutions, especially at pH=8. The optimal electrolyte compositions （mass fraction） are 6% HEDP, 0.3% TTA and 3% TAC at pH=8. The main factor affecting the thickness of the oxide layer formed during ECMP process is the applied potential. The soft layer formation is a major mechanism for electrochemical enhanced mechanical abrasion. The surface topography evolution before and after electrochemical polishing （ECP） illustrates the mechanism of mechanical abrasion accelerating electrochemical dissolution, that is, the residual stress caused by the mechanical wear enhances the electrochemical dissolution rate. This understanding is beneficial for optimization of ECMP processes.     

Effects of Al and Sn on electrochemical properties of Mg-6%Al-1%Sn （mass fraction） magnesium alloy as anode in 3.5%NaCl solution

Mg-6%Al-1%Sn（mass fraction） alloy is a newly developed anode material for seawater activated batteries. The electrochemical properties of Mg-1%Sn, Mg-6%Al and Mg-6%Al-1%Sn alloys are measured by galvanostatic and potentiodynamic tests. Scanning electron microscopy（SEM） with energy dispersive spectrometry（EDS） is used to characterize the microstructures of the experimental alloys. The results show that the Mg-6%Al-1%Sn alloy obtains more negative discharge potential（-1.38 V（vs SCE）） in hot-rolled condition. This is attributed to the fine dynamically recrystallized grains during the hot rolling process. After the experimental alloys are annealed at 473 K for 1 h, the discharge potentials of Mg-6%Al-1%Sn alloy are more negative than those of Mg-6%Al alloy under different current densities. After annealing at 673 K, the discharge potentials of Mg-6%Al-1%Sn alloy become more positive than those of Mg-6%Al alloy. Such phenomenon is due to the coarse grains and the second phase Mg2 Sn. The discharge potentials of Mg-1%Sn shift positively obviously in the discharge process compared with Mg-6%Al-1%Sn alloy. This is due to the corrosion products pasting on the discharge surface, which leads to anode polarization.     

NH_4Cl薄层液膜下X70钢腐蚀的电化学研究

采用电化学阻抗法和阴极极化曲线法研究了X70钢在含NH4Cl薄层液膜下的电化学行为.研究了液膜厚度、NH4Cl浓度对X70钢腐蚀行为的影响.结果表明,液膜厚度降低,X70钢腐蚀电位正移,阴极极限扩散电流增大.液膜厚度为130μm时,阴极极限扩散电流达最大值.液膜厚度为130~100μm时,阴极极限扩散电流反而降低.液膜厚度进一步减薄,阴极极限扩散电流又增大.薄层液膜下,NH4Cl浓度增大,阴极极限扩散电流减小,抑制了阴极过程;随着NH4Cl浓度增大,X70钢腐蚀的电荷传递电阻减小,对阳极过程有一定的促进作用,从而加速X70钢的腐蚀速率.     

以Mn3O4为锰源合成高性能LiMn2O4正极材料

以Mn3O4为锰源,采用固相反应法,在较低的温度(650℃)制得尖晶石LiMn2O4正极材料。采用X射线衍射(XRD)、扫描电镜(SEM)、循环伏安和恒流充放电等技术对其相组成、微结构和电化学性能进行表征。结果表明该正极材料结晶良好,一次粒径约为150 nm。它的电化学性能,尤其是循环性能,明显优越于在较高温度合成的LiMn2O4。在电流密度为74 mA?g-1时,测得比容量为128 mAh?g-1,在1 480 mA?g-1时,比容量为105 mAh?g-1;在室温、148 mA?g-1充放电200次循环后,容量保持率为93%。     

AZ91D镁合金表面环保型钙系磷化膜的制备及其耐蚀性

采用化学转化处理的方法,在AZ91D镁合金的表面制备了均匀致密的钙系磷化膜,其中磷化液配方中不含铬、氟及亚硝酸盐等对环境有害的离子。通过场发射扫描电子显微镜和X射线衍射仪研究了磷化时间及温度对磷化膜结构和相组成的影响。结果表明:磷化时间为20min,磷化温度为40℃时,所得到的磷化膜的致密性和均匀性较好。与空白基体相比,经磷化处理后的镁合金在3.5%NaCl溶液中的耐腐蚀性能明显提高。     

基于追踪部署的着色包标记算法的研究 *

基于追踪部署的相关理论和着色包标记算法 ,针对当前危害很大的分布式拒绝服务攻击 ,提出一种基于追踪部署的 IP回溯算法。该算法是以贪心算法为基础 ,利用 K-剪枝算法在网络拓扑图中找出一些关键的路由器 ,利用这些路由器也就是只让 tracers对过往的数据包按照着色包标记算法进行标记 ,这样不但减少了重构路径所需的数据包数 ,降低了路径误报率 ,提高了追踪到攻击者的速度 ,而且大大减轻了路由器标记的负担 ,从而能够迅速准确地找到攻击源。     

5Cr套管钢在不同CO2分压下高温高压腐蚀特性研究

为了研究5Cr套管钢在不同CO₂分压下的腐蚀特性,进行了5Cr套管钢高温高压腐蚀失重和高温高压电化学试验,并采用XRD、SEM和EDS等手段对其腐蚀产物进行微观分析。结果表明,在高温高压腐蚀环境下随着CO₂分压从低到高,其表面点蚀坑的深度和直径均无明显变化,而点蚀速率则出现逐渐减小的趋势;其腐蚀产物膜由Cr(OH)₃、FeCO₃和CaCO₃共同组成,且随着CO₂分压的升高Cr的富集量逐渐增加;在电化学测试中,随着CO₂分压的不断升高,5Cr套管钢表现出半钝化特征,产物膜逐渐增厚且致密,且极化电阻逐渐增大,阳极反应受到抑制,电化学反应阻力增大,其抗局部腐蚀能力不断提高。     

TiO2-SnO2 coated bamboo biochar for electrochemical treatment of coking wastewater

A new type of bamboo biochar (BC) loaded TiO₂-SnO₂ particle electrode was prepared and characterized by SEM, FT-IR, BET and XRD for efficient treatment of the coking wastewater in a three-dimensional electrochemical reaction system(3DERs). The results showed that bamboo biochar had a dense microporous space structure, and a significant amount of Ti-Sn oxides existed on the surface and in the interior of the BC. The removal rates of COD and DOC in coking wastewater reached to 73.96% and 66.72% respectively, and UV₂₅₄ reduced from 6.65 cm^-1 to 3.00 cm^-1 by the electrolysis treatment of 150 min at the current density of 30 mA/cm². The three-dimensional fluorescence spectra indicated that the most of the soluble organic compounds and soluble microbial by-products were degraded and transformed. The addition of Ti and Sn enhanced the efficacy of the electrooxidation, electro-adsorption and electrocatalytic behavior of the BC particle electrodes, which improved the treatment effect on coking wastewater in the 3DERs. In addition, this study provides the possibility of basic research for the engineering practice of electrochemical oxidation treatment of coking wastewater.     

LiF-NaF-KF-K2 TiF6-KBF4熔体中电沉积TiB2的阴极过程

采用循环伏安法研究了700℃时46.5LiF-11.5NaF-42KF(摩尔分数,%)熔盐中Ti(Ⅳ)(c(K2TiF6)=0.2 mol/L)和B(Ⅲ)(c(KBF4)=0.4 mol/L)在铂电极上的电化学还原机理,计算了各还原步骤传递的电子数。研究了LiF-NaF-KF-K2TiF6-KBF4(c(K2TiF4)=0.3 mol/L,c(KBF4)=0.3,0.6,0.9 mol/L)熔盐中电化学合成TiB2的阴极过程机理。结果表明:Ti(Ⅳ)的电化学还原为三步电荷传递反应,且阴极过程近似可逆;B(Ⅲ)在铂电极上的电化学反应机理为简单的三电子一步反应,阴极过程近似可逆;Ti(Ⅳ)和B(Ⅲ)可在同一电位下发生共沉积并反应生成TiB2。     

Analysis of corrosion behavior of LY12 in sodium chloride solution with wavelet transform technique

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