Research on Processes and Adhesion of Electroless Plating Ni-Cu-P Coating

In order to improve the corrosion and wear resistance of the coatings of electroless plating Ni-Cu-P and broaden its application, an optimizing mathematical theory test has been applied in this research. The processing parameters have been optimized and some Ni-Cu-P coatings have been obtained with smooth and glittering appearance. At the same time,the composite complexants can prevent copper from depositing first and obtain coatings with strong adhesion. The porosity of Ni-Cu-P coating (20 μm) ranked class 9. The changing color time of the coating is more than 800 seconds with HNO3 dropthan 0.5 g/L. The surface appearance of deposition is typical cystiform cells by SEM,which rank close and neatly.     

放射性同位素XRF技术中一种与“特散比”法等效的新方法

在一定的条件下,待测元素特征X射线和康普顿散射强度比值,与待测元素特征X射线强度和带吸收滤片所测量的强度比值之间有着简单的双曲函数关系。利用这一函数关系,很容易在单道携带式放射性同位素X射线荧光分析仪上实现“特散比”法改善基体效应。用这种方法所得到的分析结果和用“特散比”法得到的分析结果,二者吻合很好,而且不需要增加任何设备,节省了测量时间和成本。已经测量了几种类型的锡矿样品和某些铜矿样品。     

多弧离子镀与磁控溅射共沉积TiN/TiCN多层膜的高温抗氧化性能

TiN/TiCN多层膜的高温抗氧化性研究对于扩大其应用领域具有重要作用,但目前鲜见相关报道。采用多弧离子镀与磁控溅射技术以不同调制周期在304不锈钢表面共沉积TiN/TiCN多层膜。采用XRD、XPS、倒置显微镜及高温氧化试验研究了多层膜的高温抗氧化行为。结果表明:TiN/TiCN多层膜表面光滑平整、均匀致密,薄膜主要为具有Ti-(C,N)键的fcc-TiN结构;随着调制周期的减小,TiN/TiCN多层膜生长取向发生转变,且具有(111)晶面生长织构;随着氧化温度的升高,多层膜的显微硬度逐渐降低,氧化增重速率不断增大,且在700℃之后变化速率较快,薄膜的开始氧化温度约为750℃;随着调制周期的减小,多层膜TiN与TiCN界面层数量增多,促使晶粒细化,提高了其致密性,还隔断了缺陷贯穿薄膜的连续性,显著降低了薄膜的孔隙率,致使O原子扩散困难,增强了薄膜的高温抗氧化性能。     

Scattering of phonons by vacancies

The scattering of phonons by vacancies is estimated by a perturbation technique in terms of the missing mass and the missing linkages. An argument is given why distortion effects can be disregarded. The resonance frequency of the defect is sufficiently high so that resonance effects can be disregarded for phonons in the important frequency range for thermal conduction. The theory is applied to the thermal resistance by vacancies in cases where the vacancy concentration is known: potassium chloride with divalent cations, nonstoichiometric zirconium carbide, and tin telluride.     

Ta/Ta2O5/Cu结构制备及应用性能研究

介绍了以Ta/Ta₂O₅/Cu为结构的平板MIM电容器的制备方法和性能测试,探究金属Cu直接作为钽电解电容器阴极层的可行性。通过阳极氧化法在钽箔表面制备非晶态的Ta₂O₅薄膜,以化学镀铜、磁控溅射镀铜两种镀铜工艺制备Ta/Ta₂O₅/Cu结构,并对所得结构进行结构表征和性能测试。实验结果表明：不同镀铜方式制备的Ta/Ta₂O₅/Cu结构在电学性能测试过程中都没有表现出电容特性,正负极之间的电阻仅有0.7Ω;以金属Cu直接作为钽电容器的阴极层会导致金属铜在测试过程中被氧化成铜离子从而进入Ta₂O₅介质层中,进而导致Ta₂O₅的击穿,因此金属铜不适合直接作为钽电容的阴极层。     

Effects of Chloride Ion on the Texture of Copper and Cu-ZrB2 Coatings Electrodeposited from Copper Nitrate Solution in Different Plating Modes

For the first time, the texture of copper and Cu-ZrB2 coatings produced from copper nitrate solution was studied. Chloride ion shows different effects on the deposit texture under direct current （DC） and pulse current （PC） conditions. Copper deposits are strongly 〈220〉 textured in DC plating with and without chloride ion. While in PC condition, the predominant texture shifts from 〈220〉 to 〈200〉 as the chloride ion concentration exceeds 20 mg/l. The addition of ZrB2 particles enhances the cathodic polarization of copper deposition, which improves the growth of （111） plane. However, this improvement can be eliminated by further addition of chloride ion.     

PCB镀层厚度控制的必要性

概述了PCB的电性能,应用电镀法制造的多层板和工艺,特性阻抗的整合和变化因素,以及镀层控制和可靠性。     

不同电镀面积计算方法探讨

电镀铜流程是印制板制造过程中非常重要的一步,孔壁镀铜厚度是影响板件可靠性的重要因素之一,PCB制造厂家和客户都十分重视孔铜的控制.在电镀生产过程中,电流密度和电镀面积是决定孔铜厚度的两个关键参数,通过这两个参数,可以利用法拉第定律来理论计算电镀铜层的厚度.但在实际运用过程中,对于全板电镀使用拼板面积(板件尺寸长x宽)做为电镀面积,而对于图形电镀使用外层线路图形面积(拼板面积减去干膜覆盖面积)做为电镀面积,往往出现实际孔铜厚度与理论计算相差甚远,这是因为没有考虑到板件上孔对电镀面积的影响.板件厚度和孔数量对实际电镀面积影响很大,本文讨论了三种电镀面积的计算方法,确定了最合适的电镀面积计算方法,并在实际生产过程中进行验证.     

波峰焊过程产生板脏问题的分析和解决方法

实施无铅化工艺后,导入新的无铅波峰焊设备.在生产过程中,有时会发现被焊接板底面焊点之间粘有脏物,导致电路漏电,造成电气故障.经分析,主要原因为部件板在过波峰焊时,因设备相关问题,锡炉锡渣粘到印制板上造成.根据一年多跟踪与分析,提出相应解决办法.