大规格圆钢质量分析和控制

针对湘钢棒材厂生产大规格圆钢出现的表面质量问题，重点介绍了在成品轧机后采用U形辊道和立活套替换棍道；冷床输入辊道采用镶WT合金套；增设高压水除鳞装置；中间轧件尺寸精度控制等措施，成功的解决了大规格圆钢表面擦伤、“麻面”、尺寸超差等表面质量问题，产品质量显著提高。     

Nd：碲酸盐玻璃的光谱和激光性质

对比了各种激光玻璃的光谱性质，指出碲酸盐玻璃是一咱理想的激光介质，并资产在室温下实现了钛宝石激光器泵浦了Ｎｄ：碲酸盐块体玻璃的激光发射，激光阈值４．２０ｍＪ，斜率效率１４．７％。     

Morphological and kinetics study of PEO/PVC blends

The kinetics of spherulite radial growth and the morphology of the compatible system PEO/PVC have been studied by optical microscopy. The usual spherulite radial growth behaviour has been found for compatible blends with PEO content higher than 70%. For lower composition, distortion of the usual spherulite morphology has been observed; the anomalies have been attributed to partial miscibility of the components.     

采取具体措施 发挥教研室的职能作用

本文就如何发挥高校教研室的职能作用记述了本教研室所采取的具体方法和措施。     

堤身的数据采集及断面设计的几点建议

针对堤防设计的基础资料采集和设计优化，提出了一些合理性建议。     

微波辐射电镜生物样品制备方法研究

本文报道一种快速微波辐射电镜样品制备方法──水浴法，以及这个方法在动植物样品超薄切片制备中的应用。实验结果表明，水浴法使得样品可以接受相对较长时间的微波辐射而不致造成任何损伤，浸泡液和样品的温度控制简单而且准确，样品处理的结果内外均匀一致，超微结构保存优秀，完全可与常规制样法和Ｌｏｇｉｎ法的结果相媲美，而且在某些方面水浴法要优于常规法和Ｌｏｇｉｎ法。     

基于最小截面差的相位展开

相位展开 (PhU)问题从理论上讲是一个不适定问题。根据被测物理量的整体连续性 ,提出了一种基于最小截面差的相位展开方法。理论分析和对实验条纹图的处理结果表明 ,该方法特别适合于具有相位间断大于π ,条纹欠采样及随机噪声等条纹图的相位展开。同支切 (Branchcuts)法相比 ,该方法具有算法简单、计算量小且可靠度高的特点 ,具有一定的实用性。     

用稳态反饱和吸收法测量C_（60）的激发态吸收截面

用准连续激光实现了Ｃ６０的稳态反饱和吸收，通过实验和理论计算的拟合，确定了Ｃ６０的三重第一激发态吸收截面。     

Electron-Impact Cross Sections for Dipole- and Spin-Allowed Excitations of Hydrogen,Helium, and Lithium

Electron-impact excitation cross sections are presented for the dipole- and spin allowed transitions from the ground states to the np ²P states for hydrogen and lithium, and to the 1snp ¹P states for helium, n = 2 through 10. Two scaling formulas developed earlier by Kim [Phys. Rev. A 64, 032713 (2001)] for plane-wave Born cross sections are used. The scaled Born cross sections are in excellent agreement with available theoretical and experimental data.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.