硼对快凝Ni3Al组织结构及力学性能的影响

本文通过快凝及加硼合金化的方法改善金属间化合物Ni_3Al的韧性。实验表明:加入0.5-1.4at.-％的硼对Ni_3Al的塑性提高最有利。结构分析表明:在含1.37at.-％硼的Ni_3Al中,硼以Ni_(23)B_6弥散相及晶界偏聚方式存在;当硼量增至2.22at.-％时,硼以粗大的Ni_(23)B_6及NiB_(12)相在晶界处析出。无硼的Ni_3Al晶界为大角度晶界;当硼加至1.37at.-％时,Ni_3Al晶界以位错排列成亚晶界,以小角晶界形式存在。     

铝热快速凝固工艺合成高强TiC/FeNiCr复合材料

采用铝热快速凝固工艺制备了FeNiCr合金及TiC／FeNiCr复合材料,利用光学显微镜、扫描电镜、X射线衍射等手段研究了该复合材料的显微组织和相结构,测量了复合材料的压缩强度。结果表明,TiC／FeNiCr复合材料由TiC陶瓷增强相和α-Fe合金基体组成。TiC／FeNiCr复合材料组织细小,TiC呈多边形均匀分布在合金基体中,晶粒尺寸约为2-3μm。TiC对FeNiCr基体具有很好的晶粒细化及强化作用,TiC／FeNiCr的压缩断裂强度及形变率分别为2 760MPa及25％,远大于FeNiCr合金及部分Fe基非晶材料。     

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

铝合金凝固过程的声发射及氢气析出过程

采用声发射测试技术,对Al-Si和Al-Cu系合金凝固过程进行监测,证实合金在凝固过程中存在声发射现象,表现为两个声发射信号计数率峰,两个峰的总计数都随着合金中气体含量增加而增高。本文对Al-Si,Al-Cu合金系产生声发射现象的机理进行了探讨,同时,借助其它实验手段证实了声发射信号与合金凝固中气体析出有很好的对应性。第一个计数率峰与气泡在枝晶臂间形核相吻合。第二个计数率峰与凝固末期的枝晶间拉裂现象相对应,可能是氢在枝晶间析出和聚集产生高压氢导致的拉裂。     

定向凝固过程的数值模拟进展

针对定向凝固模拟的研究现状,概述了其中几种用于凝固的模拟方法,如三维枝晶胞膜跟踪法、电磁成形法、相场法等,并着重介绍了相场法。最后,在分析现有相场模型不足的基础上,指出了该领域研究中亟需解决的问题,并对今后的发展方向作了分析。     

Calculation of cooling rate of amorphous aluminum alloy melt-spun ribbons

Based on the heat transfer theory and liquid solidification theory, the heat transfer during the rapid solidification process of amorphous ribbons prepared by melt spinning was approximately modeled by one-dimensional heat conduction equation. Besides, integration with the temperature gradient, the relationship between the ribbon thickness and solidification time was derived according to the boundary conditions of ribbon-copper wheel. A simply theoretical model was obtained to calculate the cooling rates of aluminum amorphous ribbons. According to the above theoretical model, the critical cooling rate of aluminum amorphous ribbons by melt spinning is above 10^6 K/s, which proves that the aluminum based alloys belong to the marginal glass forming ability of alloys. The calculated results are in good agreement with other estimated values reported previously.     

测定金属凝固温度场的实验教学

介绍材料成型与控制专业材料成形原理中测定金属凝固温度场实验的教学案例。从建立Fe-C状态图的实验方法讲起，较为清晰地说明各种成分金属液的冷却曲线对了解合金性质，了解合金动态凝固行为的作用，并进一步引伸到近代利用所测定的金属凝固温度场的数据对相应温度场所开展的数学模拟和计算机仿真的结果进行评估，从而为用遗传算法、人工神经网络依据试验设计所取得的凝固温度数据，进行高精度建模、优化和预测服务。     

大型钛合金压气机盘超塑性等温锻造模具结构及工艺参数实验研究

通过超塑拉伸和压缩试验，用金属铅进行模拟实验，探讨了大型ＴＣ１１合金压气机盘超塑性等温锻造的工艺参数，模具结构，锻坯形状尺寸及润滑剂的选择、并讨论了其模具材料及加热方式的选择。     

高密度脉冲电流对2024铝合金凝固组织的影响

研究了把高密度脉冲电流以外部瞬间能量和环境作功的形式注入到凝固过程中的高熔点2024铝合金熔体以细化其凝固组织，结果表明，高密度脉冲电流可以显著细化其凝固组织，讨论了高密度脉冲电流细化凝固组织的机理，指出了需要进一步解决的新问题。     

快速冷凝Ti3Al基合金粉末性能研究

研究了用快速冷凝(RS)旋转电极工艺制取的Ti_3Al基合金粉末的物理性能、化学性能、显微结构以及热处理对显微结构、显微硬度的影响。结果表明,用该方法制备的合金粉末,化学成分稳定,工艺性能良好,细颗粒粉末由单相β固溶体组成,但随着热处理温度的变化,粉末的显微结构和显微硬度发生相应的变化。