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991.
Electron beam melting (EBM), as one of metal additive manufacturing technologies, is considered to be an innovative industrial production technology. Based on the layer‐wise manufacturing technique, as‐produced parts can be fabricated on a powder bed using the 3D computational design method. Because the melting process takes place in a vacuum environment, EBM technology can produce parts with higher densities compared to selective laser melting (SLM), particularly when titanium alloy is used. The ability to produce higher quality parts using EBM technology is making EBM more competitive. After briefly introducing the EBM process and the processing factors involved, this paper reviews recent progress in the processing, microstructure, and properties of titanium alloys and their composites manufactured by EBM. The paper describes significant positive progress in EBM of all types of titanium in terms of solid bulk and porous structures including Ti–6Al–4V and Ti–24Nb–4Zr–8Sn, with a focus on manufacturing using EBM and the resultant unique microstructure and service properties (mechanical properties, fatigue behaviors, and corrosion resistance properties) of EBM‐produced titanium alloys.
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992.
Metal additive manufacturing (AM) is an innovative manufacturing technique, which builds parts incrementally layer by layer. Thus, metal AM has inherent advantages in part complexity, time, and waste saving. However, due to its complex thermal cycle and rapid solidification during processing, the alloys well suit and commercially used for metal AM today are limited. Therefore, it is important to understand the alloying strategy and current progress with materials performance to consider alloy development for metal AM. This review presents the current range of alloys available for metal AM, including titanium, steel, nickel, aluminum, less common alloys (including Mg alloys, metal matrix composites alloys, and low melting point alloys), and compositionally complex alloys (including bulk metallic glasses and high entropy alloys) with a focus on the relationship between compositions, processing, microstructures, and properties of each alloy system. In addition, some promising alloy systems for metal AM are highlighted. Approaches for designing and optimizing new materials for metal AM have been summarized.
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993.
We explore conditions for achieving laser liftoff in epitaxially grown heterojunctions, in which single crystal thin films can be separated from their growth substrates using a selectively absorbing buried intermediate layer. Because this highly non‐linear process is subject to a variety of process instabilities, it is essential to accurately characterize the parameters resulting in liftoff. Here, we present an InP/InGaAs/InP heterojunction as a model system for such characterization. We show separation of InP thin films from single crystal InP growth substrates, wherein a ≈10 ns, Nd:YAG laser pulse selectively heats a coherently strained, buried InGaAs layer. We develop a technique to measure liftoff threshold fluences within an inhomogeneous laser spatial profile, and apply this technique to determine threshold fluences of the order 0.5 J cm?2 for our specimens. We find that the fluence at the InGaAs layer is limited by non‐linear absorption and InP surface damage at high powers, and measure the energy transmission in an InP substrate from 0 to 8 J cm?2. Characterization of the ejected thin films shows crack‐free, single crystal InP. Finally, we present evidence that the hot InGaAs initiates a liquid phase front that travels into the InP substrate during liftoff.
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994.
Unmanned aerial vehicles (UAVs) have shown promising benefits in many applications. This has been enabled by the emergence of additive manufacturing (AM), which give the designers a large amount of geometrical freedom. In this paper, a novel design process of fused deposition modeling (FDM) combining both topology and infill optimization is introduced for AM of high performance porous structures. Tensile testing of FDM printed samples is first carried out to study the effect of the build orientation on the mechanical properties of acrylonitrile butadiene styrene (ABS) samples. It is found that samples built perpendicular to the load axis are the weakest with a tensile strength of 29 MPa and Young's modulus of 1960 MPa. The materials properties are fed to the finite elements analysis (FEA) for geometrical topology optimization, aiming to maximize stiffness and reduce weight of those parts. Afterwards, an infill optimization is carried out on the topology optimized parts using different mesostructures such as honeycomb, triangular, and rectangular to achieve high structural performance. The results showed that triangular pattern with 50% infill density had the lowest developed stresses, less mass, and strain energy when compared to other structures. Optimum UAVs parts of a quadcopter are successfully manufactured, assembled, and tested.
  相似文献   
995.
Tungsten is of industrial relevance due its outstanding intrinsic properties (e.g., highest melting‐point of all elements) and therefore difficult to 3D‐print by conventional methods. Here, tungsten micro‐lattices are produced by room‐temperature extrusion‐based 3D‐printing of an ink comprising WO3–0.5%NiO submicron powders, followed by H2‐reduction and Ni‐activated sintering. The green bodies underwent isotropic linear shrinkage of ≈50% during the thermal treatment resulting in micro‐lattices, with overall 35–60% open‐porosity, consisting of 95–100% dense W–0.5%Ni struts having ≈80–300 μm diameter. Ball‐milling the powders and inks reduced the sintering temperature needed to achieve full densification from 1400 to 1200 °C and enabled the ink to be extruded through finer nozzles (200 μm). Partial sintering of the struts is achieved when NiO is omitted from the ink, with submicron interconnected‐porosity of ≈34%. Several tungsten micro‐lattices are infiltrated with molten copper at 1300 °C under vacuum, resulting in dense, anisotropic W–Cu composites with 40–65% tungsten volume fraction. Partially sintered struts (containing nickel) with submicron open porosity are also infiltrated with Cu, resulting in co‐continuous W–Cu composites with wide W struts/Cu channels at the lattice scale (hundreds of micrometers), and fine W–Cu interpenetrating network at the strut scale (hundreds of nanometers) allowing for the design of anisotropic mechanical and electrical properties.
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996.
Organizing DNA origami building blocks into higher order structures is essential for fabrication of large structurally and functionally diverse devices and molecular machines. Unfortunately, the yields of origami building block attachment reactions are typically not sufficient to allow programed assembly of DNA devices made from more than a few origami building blocks. To investigate possible reasons for these low yields, a detailed single‐molecule fluorescence study of the dynamics of rectangular origami dimerization and origami dimer dissociation reactions is conducted. Reactions kinetics and yields are investigated at different origami and ion concentrations, for different ion types, for different lengths of bridging strands, and for the “sticky end” and “weaving welding” attachment techniques. Dimerization yields are never higher than 86%, which is typical for such systems. Analysis of the dynamic data shows that the low yield cannot be explained by thermodynamic instability or structural imperfections of the origami constructs. Atomic force microscopy and gel electrophoresis evidence reveal self‐dimerization of the origami monomers, likely via blunt‐end interactions made possible by the presence of bridging strands. It is suggested that this mechanism is the major factor that inhibits correct dimerization and means to overcome it are discussed.  相似文献   
997.
998.
The micro‐supercapacitors are of great value for portable, flexible, and integrated electronic equipments. Here, the large‐scale and integrated asymmetrical micro‐supercapacitor (AMSC) array is fabricated in virtue of the laser direct writing and electrodeposition technology. The AMSC shows the ideal flexibility, high areal specific capacitance (21.8 mF cm?2), and good rate capability. Moreover, its energy density reaches 12.16 µW h cm?2, outperforming most micro‐supercapacitors reported previously. Meanwhile, large‐scale series‐connected AMSCs are integrated on the flexible substrates (e.g., indium tin oxide‐polyethylene terephthalate film), which can power a veriety of the commercial electronics. The combination of AMSCs array, solar cell, and electronic device proves the feasibility for practical application in the portable, flexible, and integrated electronic equipments.  相似文献   
999.
Recent efforts and advances in additive manufacturing (AM) on different types of new materials are presented and reviewed. Special attention is paid to the material design of cladding layers, the choice of feedstock materials, the metallurgical behavior and synthesis principle during the AM process, and the resulted microstructures and properties, as well as the relationship between these factors. Thereafter, the trend of development in the future is forecasted, including: Effects of the particles size and size distribution of powders; Approaches for producing fine microstructures; Opportunities for creating new materials by AM; Wide applications in reconditioning of damaged components; Challenges for deep understanding and applications of the AMed new materials. The idea of “Develop Materials” or “Create Materials” by AM is highlighted, but a series of scientific, technological and engineering problems remain to be solved in future.  相似文献   
1000.
In this study, the crack propagation behaviors in the equiaxed and equiaxed-columnar grain regions of a heat-treated laser additive manufacturing (LAM) TC11 alloy with a special bi-modal microstructure are investigated. The results indicate that the alloy presents a special bi-modal microstructure that comprises a fork-like primary α (αp) phase surrounded by a secondary α colony (αs) in the β phase matrix after the heat treatment is completed. The samples demonstrate a fast crack growth rate with larger da/dN values through the equiaxed grain sample versus across the equiaxed-columnar grain sample at low ΔK values (<13.8). The differences that are observed between the crack propagation behaviors (in the crack initiation stage) of the samples can be mostly attributed to the different size and morphology of the αp lamellae and αs colony within the grains in the equiaxed and columnar grain regions rather than the grain boundaries. The cracks prefer to grow along the α/β boundary with a smooth propagation route and a fast propagation rate in the equiaxed grain region, where the αp and α clusters have a large size. However, in the columnar grain region, small and randomly distributed αp lamellae generate a zigzag-shaped propagation path with a reduction in the da/dN value. Additionally, the change in the size of the αp lamellae in the equiaxed grains (heat affected bands, HAB) is also observed to influence the propagation behavior of the crack during the crack initiation stage.  相似文献   
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