杂萘联苯聚醚砜酮/环氧树脂共混体系固化反应动力学

采用热熔法制备了杂萘联苯聚醚砜酮(PPESK)/环氧树脂(E-51)共混物,利用差示扫描量热仪(DSC)对共混物的固化反应动力学进行了研究。借助Ozawa和Kissinger等方法确定了PPESK增韧E-51体系的固化动力学参数,包括反应的表观活化能E,指前因子A和反应级数n;结果表明,采用新型高性能热塑性树脂PPESK增韧环氧树脂不仅在工艺上具有可行性,而且PPESK的加入降低了固化反应的表观活化能,促进了固化反应的进行。     

线型双酚A酚醛树脂的合成

对线型双酚A酚醛树脂的合成工艺及催化剂浓度、种类、反应时间、醛酚比等影响因素进行了研究。结果表明,随着反应物醛酚比的增大,产物中残留的BPA量呈下降趋势,软化点先上升后下降,在1.2左右出现峰值;随反应时间延长,产物的软化点升高,分子质量增大,残留BPA量减少,分子质量分散性增加;催化剂用量增大,分子质量增大,软化点增高,残留BPA含量降低。合理的催化剂用量为m(BPA)∶m(催化剂)=100∶20。以合成的BPAN代替双氰胺(D ICY)作环氧树脂EB454A80的固化剂,在相同的固化工艺条件下,固化物的Tg提高近12℃。     

邻苯二甲酸二烯丙基酯树脂固化特性的研究

运用示差扫描量热(DSC)法研究了邻苯二甲酸二烯丙基酯(DAP)树脂的固化反应历程。讨论了引发剂对DAP固化特性的影响,并由DSC曲线得到了DAP树脂的固化工艺和动力学参数。通过固化度、FT-IR的测试对DAP树脂在中温条件下的固化情况进行了研究。结果表明:在过氧化二异丙苯(DCP)固化体系中引入BPO可以使DAP树脂在更低温度下引发固化;在BPO、DCP用量均为2%的条件下,确定了体系的凝胶温度、固化温度、后处理温度分别为:100.5℃,124.3℃,137.8℃,表观活化能为129.3 kJ/mol,反应级数为0.950。固化度、FTIR的测试结果表明:DAP树脂在中温条件下可以固化得较完全。     

紫外光固化聚合物涂层的原位光稳定化研究

选用实验室制备的四种新型反应型受阻胺类光稳定剂(r-HALS):4-甲基丙烯酰氧基-2,2,6,6-四甲基哌啶醇酯(MTMP)、4-丙烯酰氧基-2,2,6,6-四甲基哌啶醇酯(ATMP)、4-甲基丙烯酰氧基-1,2,2,6,6-五甲基哌啶醇酯(MPMP)和4-丙烯酰氧基-1,2,2,6,6-五甲基哌啶醇酯(APMP),实现了紫外光固化聚合物涂层(膜)的原位(in situ)光稳定化。通过室内人工光老化实验和在光氧化过程中黄度指数(Yellowness Index,YI)的监测,再与典型的商用HALS(Tinuvin770和Tinuvin292)进行平行实验对比,考察了r-HALS对紫外光固化聚合物涂层的光防护效果,探索一条紫外光固化聚合物涂层原位(in situ)光稳定化的新途径。     

相变换热器应用于电站锅炉的探讨

阐述了复合相变换热器是一种新型的换热器,可以控制低温受热面金属不发生低温腐蚀,降低烟气的排放温度,该技术可用于各种燃煤、燃油、燃气锅炉、窑炉、注气炉、加热炉等换热设备,目前复合相变换热器应用于工业锅炉和循环流化床已有不少成功案例[1-3],而应用于大型电站锅炉还很少有报道,结合某330 MW电站锅炉尾部加装复合相变换热器的运行情况,对复合相变换热器应用于电站锅炉的运行情况及优缺点做了简要探讨。     

西南地区低温过程特征及与MJO指数的关系

本文选取1979年~2008年西南地区76个台站的逐日最低气温和MJO指数资料,采用累积频率法和线性倾向估计,研究了单站和区域持续性低温过程的变化特征及其与MJO指数的关系。     

Development of a high curing latency no-flow underfill with self-fluxing ability for lead-free solder interconnects

Tin-lead solders have been used as joining materials in the electronics industry for many years. As present there are great concerns about the potential harm of lead-containing solders to human beings and many efforts have been made to remove the lead from the electronics packages. However, there is no no-flow underfill currently on the market that is compatible with the lead-free solder. In this study, a new no-flow underfill for flip chip bumped with lead-free solder has been developed based on a curing agent and catalysts with high curing latency. The curing agent itself has the fluxing ability, so the need of extra flux is eliminated. Compared with the underfill for lead-containing solder, the new underfill has a higher curing temperature, compatible with the melting profile of lead-free solder. The wetting compatibility of the underfill with the lead-free solder has been studied by wetting experiments. The material properties of the underfill have been investigated using DSC, TGA, TMA and DMA. The results show that the newly developed underfill material has the potential to be used in lead-free interconnects.     

Acid-catalyzed moisture-curing polyurea/polysiloxane ceramer coatings

The para-toluene sulfonic acid (p-TSA) was used to catalyze the moisture curing of an organic/inorganic hybrid coating system. The organic phase was based on the isocyanurate of 1,6-hexamethylene of diisocyanate (HDI). The inorganic phase was based on the prepolymerized oligomers of tetraethyl orthosilicate (TEOS). An alkoxysilane-functionalized HDI isocyanate was added into the coating formulation to aid in phase miscibility. The general coating and tensile properties were evaluated as a function of the acid catalyst concentration. In addition, the films were analyzed using differential scanning calorimetry (DSC) and dynamical mechanical thermal analysis (DMTA). The results indicated that the acid catalyst enhanced the adhesive properties of the hybrid coatings. The addition of the acid catalyst increased the changed crosslink density of films and decreased the crystallinity of the organic phase.     

Dynamics of mechanical,acoustical, and electrical properties of epoxy‐amine compositions during cure

Dynamics of mechanical, acoustical, and electric properties is studied in the cure of three samples of polymeric compositions produced on the basis of epoxy oligomer with different content of the curing agent. The measurements were made in a parallel mode with an automated measuring complex. Variations in elastic modules, sound speed, attenuation coefficient, relaxation of the shear stress, electric resistance of the samples during the complete cure in the transition from a liquid into a glass state are considered. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

紫外线(UV)固化技术在数字成像材料中的应用(三)UV固化技术在计算机直接制版(CTP)中的应用

近年来，数字成像技术不断提高和应用范围的迅速推广，也推动了UV固化技术在这一领域的融合和应用，取得了极大的成效，由于UV固化材料具有快速固化、高效、低污染、节能、优质等特点，很快发展成为一种新型的数字成像材料。目前实现产业化的主要有UV喷墨打印、印刷电路版数字化制作、计算机直接制版CTP、立体光刻等四种技术，作者拟分为四个专题予以阐述，本文主要讨论其第三个专题：UV固化技术在计算机直接制版（CTP）中的应用。