氧化铝陶瓷基无线无源压力传感器的高温性能研究

利用高温烧结陶瓷技术制备了一种基于氧化铝陶瓷的LC谐振式无线无源压力传感器,并通过合理地设计圆柱螺旋天线以及隔热结构,实现了该传感器在高温环境中的无线耦合测试。研究了传感器在不同温度下的阻抗频率特性,分析并探讨了传感器的高温性能。测试结果表明,在29℃(室温)至700℃的温度范围内,测试天线端的最高瞬时温度为188.4℃,保证了传感器高温测试的可靠性。谐振频率对温度的平均变化量为1.314 kHz/℃,两次重复性测试的相对变化量为3.81%,重复性较好。该压力传感器可应用于高温恶劣环境下的压力测试,其高温性能的研究为压力信号的准确读取奠定了良好的基础。     

磁通门传感器探头温度特性研究

磁通门传感器主要由磁探头与电路部分组成,其输出不仅随磁场变化,而且易受温度的影响。为了确定磁通门传感器磁探头在宽温度范围下的温度漂移情况,通过试验将探头置于-40℃~150℃的温度环境下,记录得到探头在宽温度范围下,其温度特性曲线近似为正比线性关系。分析认为,磁芯磁滞回线受热偏移与线圈漆包线随温度热胀冷缩是磁探头温漂的主要原因。本文提出选用低磁导率磁芯和高温漆包线绕制探头,并优选一致性较好的探头,采用最小二乘法对温度漂移结果进行拟合补偿,有效地消除了温度对磁探头的影响,提高了磁通门传感器的温度稳定性与应用的广泛性。     

集成于无源UHF RFID标签的宽温测范围CMOS温度传感器

针对无源UHF RFID标签温度测量范围小、功耗等问题,本文提出了一种集成于无源UHF RFID标签的宽温测范围CMOS温度传感器。本文设计采用UMC 0.18μm 1P6M CMOS工艺进行设计,提出一种新温度脉冲转换电路结构产生随温度变化的脉冲,从而实现了宽温度测量。仿真结果表明:当温度范围在-75℃~125℃时,温度脉冲宽度变化近220μs,标签芯片供电电压为1.5V时,室温时新增的温度传感器模块功耗仅为200 nW,温度传感器精度为0.45℃/LSB。测试结果:在-5℃~45℃范围内进行测试,温度传感器精度为0.48℃/LSB,其中在室温25℃左右振荡器频率2.087 MHz,脉冲宽度大约110μs,异步计数器显示为011011000。     

Sintering of the Mechanochemically Activated Powders of Hexagonal Boron Nitride

Pressureless sintering of hexagonal boron nitride (BN) was performed using a powder activated by mechano-chemical treatments. Physical properties of the sintered BN bodies depend on the type of starting powder and the conditions of the treatments. The BN body, which was obtained at 2000°C using an appropriate activated powder, was 99 wt% pure and was excellent in mechanical and physical properties, in spite of its low density (1.64 g/cm³).     

Exothermic effect in the process of electron‐beam curing of epoxy resins

Temperature measurements have been performed in the process of electron‐beam curing of EB‐I and EB‐II epoxy resin systems. The influence of initiator content, resin type, and dose rate on the temperature of the systems was studied. Transverse and longitudinal temperatures of samples in the glass vessel were also analyzed. The nature of temperature curves varied with the different epoxy resin systems in the steel mold, but did not change with different contents of the initiator. At the same time, the heat had no effect on the gel fraction of epoxy resin systems. The temperature curve was greatly affected by the dose rate, and its peak value, peak width, and plateau value also increased with it. The transverse temperature of EB‐II glass vessel samples increased as the radiation dose increased and, in the same sample, the temperature reduced as the distance between the radiation center and the test point increased. The longitudinal temperature of EB‐I and EB‐II resin systems in a glass vessel decreased as the radiation depth increased. As the radiation dose increased, the temperature of the EB‐I resin system increased simultaneously, while that of the EB‐II resin system initially increased and then kept constant when the dose reached a certain value. The temperatures of these two resin systems decreased rapidly when the radiation process stopped. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 2217–2222, 2004     

电子陶瓷和器件的低温共烧技术

较系统地介绍了电子器件用低温共烧陶瓷(low temperature cofired ceramics,LTCCs)材料,探讨了其工艺中的若干问题。电子器件用低温共烧陶瓷材料包括:玻璃/陶瓷复合材料、结晶化玻璃、晶化玻璃/陶瓷复合材料以及液相烧结陶瓷,其中典型的和最为常用的LTCCs为玻璃/陶瓷(特别是氧化铝)复合材料。正在研究的一些陶瓷介质材料中,Bi基介质材料引起了人们的关注。玻璃/陶瓷复合材料的制备工艺中,应当着重关注和加深了解玻璃的流动性和结晶性、玻璃的起泡、玻璃和陶瓷颗粒间的反应、共烧材料的匹配等问题,从优选材料配方和优化工艺着手,从而获得优质可靠的材质和器件。     

Lifetime assessment of epoxies by the kinetics of thermal degradation

The kinetics of thermal degradation of 4,4′‐diaminodiphenylsulfone (DDS)‐cured glycidylethers (DGBA) and glycidylamines (TGDDM) have been studied by isothermal annealing. Thermal degradation proceeds via first‐order kinetics with activation energies of 138 (DGBA/DDS) and 95 kJ/mol (TGDDM/DDS). From these data the temperature‐dependent lifetime can be calculated. Based on the heat distortion temperature and 20 years' service as criteria, the upper service temperature is found to be around 115–120°C. In spite of the different activation energies and bond stabilities, only marginal differences in the upper allowed service temperatures between these resins were found. Only slight improvements can be expected by optimizing the cure conditions. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 1881–1886, 2004     

安钢二炼焦加热集散控制系统

安钢二炼焦焦炉加热控制系统根据蓄热室温度，建立了可靠的数学模型，通过控制加热煤气的压力和烟道废气吸力实现加热的自动控制，并实现参数无纸记录，日报表的自动生成，设备巡检的记录等功能。     

不同玻璃料对PTC陶瓷性能的影响

研究了AST和ASL两种玻璃料对PTC陶瓷性能的影响,发现在1280℃～1340℃的烧成范围内,添加ASL的样品其室温电阻要比添加AST的样品大,而其电阻—温度特性要比添加AST的样品好,且两种样品的晶粒尺寸及晶粒均匀度有明显差别.研究结果表明,两种样品性能上的差异与它们显微结构上的差异有着密切关系.     

转炉用快速烧结镁r质投补料

根据转炉大面耐火材料的使用条件 ,研究了影响沥青结合及树脂结合镁质投补料使用性能的主要因素。结果表明 ,控制配入合适溶剂的沥青或树脂的加入量 ,掺加少量外加剂 ,可获得性能良好的修补料。二者相比 ,沥青结合镁质投补料的烧结时间较长 ,容易出现凹坑 ;树脂结合投补料与砖体间的粘结性比沥青的稍差 ,容易出现翘曲。