钼顶头破坏行为及强韧化分析

通过对钼顶头破坏行为的分析，说明了钼顶头破坏的主要原因。并进一步通过对钼顶头强韧化的分析，阐述了钼顶头延长使用寿命的措施，并制定了钼顶头生产工艺。     

Microstructure of Silicon Carbide Whiskers Synthesized by Carbothermal Reduction of Silicon Nitride

The microstructure of silicon carbide whiskers synthesized by carbothermal reduction of silicon nitride has been studied using transmission electron microscopy. All of the whiskers examined are single crystals, and grow in the (111) crystallographic direction. Two different forms of stacking faults and microtwins were observed; in one the planar defects are normal to the whisker growth direction, and the other has the defect planes at an angle of about 70° to the growth axis, while both forms of the defects are on the [111] closed-packed planes. Without the addition of catalyst, droplets containing metallic impurities were not found at the tips of the whiskers synthesized by the present process. A core and outer regions were observed in the single-crystal whiskers, which may be evidence that the whiskers were formed by a two-stage mechanism.     

Wear resistance of plasma coatings for a constant work of friction

We analyze the wear resistance of plasma coatings for a constant work of friction. The dependences of the wear resistance of the coatings are obtained for a broad range of loading conditions. It is shown that the minimum sensitivity to loading conditions is exhibited by the molybdenum coatings. It is also established that the wear resistance of the coatings decreases as the amplitude of displacements increases and the cyclic frequency of the tests decreases due to the intensification of fatigue processes on the surfaces. The comparative characteristics of coatings are presented. __________ Translated from Problemy Prochnosti, No. 5, pp. 94–100, September–October, 2007.     

Ni-Mo-O催化剂中协同作用对丙烷氧化脱氢的影响

在 Ni-Mo-O体系中 ,加入 Mo O3 能极大地提高丙烷氧化脱氢制丙烯的反应活性。选用固混法、沉淀法、柠檬酸法制备了 Mo O3 过量 1 5 % (摩尔分数 )的α -Ni Mo O4催化剂 ,其中用沉淀法制得催化剂在 5 0 0℃ ,V( C3 H8) /V ( O2 ) /V ( N2 ) =1 0 /1 0 /5 0 ,反应气流量为 70 m L/min的条件下丙烷转化率可达 38.7% ,丙烯选择性达 70 .1 4 %。经 XRD,XPS,TPR表征说明 ,在含有过量 Mo O3 的催化剂中 ,α -Ni Mo O4与 Mo O3 两种晶体之间可产生微小的相互吸引 ;从而发挥协同作用 ,是提高催化剂活性     

Development of High Thermal Conductivity Aluminum Nitride Ceramic

AIN ceramics with densities varying from 3.18 to 3.30 g/cm³ and room-temperature thermal conductivities varying from 88 to 193 W/m K were produced. Different sintering conditions, packing powders, AIN powder sources, carbon additive, and sintering times were evaluated, and the key processing parameters which cause the differences in density and thermal conductivity were identified. SEM, TEM, and EDS were used to characterize the correlation between thermal conductivity, microstructure, and processing parameters. The important parameters which control the thermal conductivity of AIN ceramics are discussed.     

Ion implantation doping of OMCVD grown GaN

Doping by ion implantation using Si, O, Mg, and Ca has been studied in single crystal semi-insulating and n-type GaN grown on a-sapphire substrates. The n-and p-type dopants used in this study are Si and O; Mg and Ca, respectively. Room temperature activation of Si and O donors has been achieved after 1150°C annealing for 120 s. The activation of Mg and Ca acceptors is too low to measure at both room temperature and 300°C. Using higher doses to achieve a measurable p-type conduction increases the amount of damage created by the implantation. Rutherford back scattering measurements on this material indicate that the damage is still present even after the maximum possible heat treatment. Secondary ion mass spectrometry measurements have indicated a redistribution in the measured profiles of Mg due to annealing.     

氮化镓低维纳米结构的制备与表征

主要是以氧化镓为原料,通过气相沉积法,制备出GaN纳米线和纳米带.通过X-射线衍射（XRD）,扫面电镜（SEM）和高分辨透射电镜（HRTEM）等测试手段对其形貌进行了表征和分析.研究了实验过程中工艺条件的改变对所制备GaN纳米结构形貌特征的影响.对两种GaN纳米材料的拉曼散射光谱进行了分析.     

Chemistry and Physics of Alkali Metals on MoS2 Surfaces

The interaction of alkali metal with surfaces has been of great interest to the community of catalysis since alkali metal can play an important role as a promoter. On alkali-doped MoS₂, such a promotion effect of alkali metal has been exemplified in the direct synthesis of linear alcohols from CO and H₂, where the alkali-doping switches the catalyst selectivity from methanation to alcohol synthesis. This paper reviews recent high-resolution X-ray photoelectron spectroscopy experiments that have provided direct observation of electron transfer from alkali metals to a model single crystal MoS₂ and the capture of the supra-valence electrons in the subsequent oxidation reactions.     

钼还原过程相变化研究

采用钼酸铵直接氢还原及钼酸铵先焙解然后再分段氢还原两种不同的还原方法进行了钼粉还原。通过Ｘ射线衍射方法分析了两种工艺还原过程中的反应序列及相变化规律，并讨论了不稳定相Ｍｏ４Ｏ１１对于钼粉还原过程的影响。     

Formation of low-resistivity poly-Si and SiNx films by Cat-CVD for ULSI application

In this paper, bulk-Si metal–oxide–semiconductor field effect transistors (MOSFETs) are fabricated using the catalytic chemical vapor deposition (Cat-CVD) method as an alternative technology to the conventional high-temperature thermal chemical vapor deposition. Particularly, formation of low-resistivity phosphorus (P)-doped poly-Si films is attempted by using Cat-CVD-deposited amorphous silicon (a-Si) films and successive rapid thermal annealing (RTA) of them. Even after RTA processes, neither peeling nor bubbling are observed, since hydrogen contents in Cat-CVD a-Si films can be as low as 1.1%. Both the crystallization and low resistivity of 0.004 Ω·cm are realized by RTA at 1000 °C for only 5 s. It is also revealed that Cat-CVD SiN_x films prepared at 250 °C show excellent oxidation resistance, when the thickness of films is larger than approximately 10 nm for wet O₂ oxidation at 1100 °C. It is found that the thickness required to stop oxygen penetration is equivalent to that for thermal CVD SiN_x prepared at 750 °C. Finally, complementary MOSFETs (CMOSs) of single-crystalline Si were fabricated by using Cat-CVD poly-Si for gate electrodes and SiN_x films for masks of local oxidation of silicon (LOCOS). At 3.3 V operation, less than 1.0 pA μm⁻¹ of OFF leakage current and ON/OFF ratio of 10⁷–10⁸ are realized, i.e. the devices can operate similarly to conventional thermal CVD process.