The optimal diamond wheels for grinding diamond tools

Grinding is the most suitable process for manufacturing good quality diamond tools. In this paper, diamond wheels have been studied. From the grinding of polycrystalline diamond (PCD) insets, the effects of certain factors such as the bonding material, the grit size and structure of a diamond wheel have been investigated. It is concluded that vitrified bond diamond wheels are the most suitable for grinding PCDs and the recommended grit size is mesh number 1000, which can get a good surface quality within an appropriate time. The wheel structure is another important factor. Rougher wheels (mesh #800, #1000) with the softer grade scale P yield a higher material removal rate (MRR) than scale Q. However, a finer wheel (mesh #1200) needs a tougher structure to promote its grinding ability and to have a higher MRR.     

Characterization of temporal response, spectral responsivity and its spatial uniformity in photoconductive diamond detectors

Three photoconductive diamond detectors with highly oriented diamond (HOD) films fabricated by the same process were characterized with respect to temporal response, spectral responsivity and its spatial uniformity over the wavelength range from 190 to 250 nm. Temporal measurements showed a drift in the baseline, suggesting the presence of deep level carrier traps. The responsivity of specimen No. 2 was more than twice those of the other two specimens, but it showed an unpredictable current fluctuation. It was found that the spatial uniformities of all the specimens were too low for radiometric purposes. A prominent peak, thought to be due to photoemission, was found in the responsivity spatial distribution of specimen No. 3 under a negative applied voltage.     

Comparative study of the electrical properties of diamond films grown by microwave plasma assisted and hot-filament chemical vapor deposition

Schottky diodes were built on different polycrystalline diamond films grown by Microwave Plasma and Hot Filament Chemical Vapor Deposition and their electrical properties were studied. The barrier height increased with the diamond film quality and the corresponding ideality factor decreased. Even though the lower-quality HFCVD film displayed poor rectifying properties, it was found to be much less sensitive to variations in the operating conditions (air vs. vacuum). The activation energies of the films depend on morphological parameters, as preferable grain size or orientation. The bulk conduction also depends on the quality of the deposited films, changing from ohmic to trap-free or shallow trap SCLC and SCLC with an exponential distribution of traps. The hypothesis of using the electrical measurements as an indicator for film quality has been discussed.     

无氢类金刚石碳膜的研究进展

介绍了无氢类金刚石碳膜的制备方法 ,它们的机械、光学、电学性能 ,将无氢与含氢的类金刚石碳膜进行了简单比较 ,总结及探讨了它们的应用     

PDC钻头在胜利油田深井钻井中的应用

胜利油田为提高深井钻井速度，试验应用了PDC钻头，结果表明，深井钻井应用PDC钻头可大幅度提高机械钻速，缩短建井周期，降低钻井成本，经济效益明显。通过大量的现场试验，扩大了PDC钻头在胜利油田的使用范围，并取得很好的效果，初步形成了PDC钻头推广应用区域模式。详细介绍了胜利油田不适用PDC钻头钻进的地层岩性，给出了钻头选型及钻井参数选择原则，并对应用效果进行了分析。     

C－BN衬底上金刚石的异质外延生长研究

用热灯丝ＣＶＤ方法在Ｃ－ＢＮ单晶衬底上制备出金刚石膜，并且在Ｃ－ＢＮ（１００）面上观察到金刚石的异质外延。     

激光焊接超细基胎体金刚石薄壁钻

采用激光焊接超细预合金粉胎体，开发了新的薄壁钻产品，通过对与现有的产品工艺、性能测试以及实际使用分析对比，结果表明：激光焊接与普通钎焊相比结合强度提高2－3倍，克服了胎体脱落问题，胎体耐磨性提高了50％－120％，其中轴向磨损速率提高1．2倍；钻削速度提高30．4％，工矿适应性增加，使用寿命提高25％－108％。     

A comparative study of transient waves in random (polycrystalline) media

The paper investigates the transient response of a random medium as predicted by two methods, a perturbation scheme and a causal approach. It is shown by direct computation of a pulse propagation that the perturbation scheme yields an advanced response inconsistent with the physical realizability of the medium. The causal model as well as a modified perturbation scheme exhibit a physically reasonable behavior.     

含硼金刚石的金属包膜成分及其物相的研究

本文采用铁基触媒加入硼铁的方法，在高温高压条件下合成了含硼金刚石，利用电子探针（EPMA），透射电子显微镜（TEM）两种检测手段，分析了含硼金刚石金属包膜的微观组织结构，化学组成成分，各组成成分的物相及其可能形成的原因。研究结果表明：金属包膜的成分及其物相由正交立方结构的（Fe,Ni）3C，面心立方的γ-（Fe,Ni），面心立方的Fe23（C，B）。及少量的FeB,Ni3B组成，这些成份主要来源于原材料，其含量在高温压过程中是瞬间变化的。     

脆硬材料加工机理的研究

为了了解脆硬材料的加工情况，本文采用扫描电镜和高速摄影机对典型的脆硬材料，玻璃的磨削过程，静态，动态地进行了细致的观察和分析，提出了脆理材料的磨削模型，该模型全面地反映出整个加工过程中所发生的现象，对脆硬材料的加工有指导意义。