钛酸钡添加量对埋容用环氧-钛酸钡-玻璃布板材性能的影响

采用热固化层压方法制备了环氧-钛酸钡-玻璃布(EBG)板材,并分析钛酸钡(BTO)添加量对埋容用EBG板材各项性能的影响。结果表明:随着BTO填料添加量的增大,EBG板材的实际密度先接近后偏离理论密度,孔隙率先减小后增大,耐浸焊时间、剥离强度先增大后减小,5%热分解温度和介电常数增大;当BTO的质量分数为80%左右时,埋容用EBG板材具有较好的综合性能;EBG板材为一种混联模型。     

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

In this work, tensile deformation of Sn-3.8Ag-0.7Cu (SAC387) solder and composite of SAC387 reinforced with nano-sized Mo particles have been studied with strain rates from 10⁻⁵ to 10⁻¹ s⁻¹ and temperatures of 25, 75 and 125 °C. It is found that the yield strength (σ_Y.S) and strain hardening exponent (n) are increased with the strain rate, but the n values decrease with increasing temperatures. The n values of the composite solder are also increased with the percentage of the Mo nano-particles (up to 1 wt.%) and thereafter decrease with further increasing of the Mo particle. The strain rate dependence of the Hollomon parameters is found to be stronger at higher temperatures for SAC387 solder, but it is weaker for the composite solders. Empirical equations for σ_Y.S and Hollomon parameters with strain rate and temperatures have been found for both SAC387 and composite solders. Finally, the fracture surfaces of the solders are examined.     

Director Field in a Bipolar Configured Nematic Droplet

Polymer dispersed liquid crystal(PDLC) have found its application in flexible displays and switchable windows. Such applications require dimension of the droplets to be several micro meters[1]. Recently, it is found that droplets in PDLC may gather together in some districts by special manufacture process, to form switchable period holographic gratings. Such an application requires dimension of the droplets less than 200 nm[2]. In spite of dimension of the droplets, whether in micrometers …     

Structural integrity in electronics

With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation.     

An initial study on welding procedure using tandem MIG welding of high strength aluminum alloy

The high-speed camera system and data acquisition system of welding parameters were created in tandem MIG welding of high strength aluminum alloy. The experiments were carried out in order to obtain the photos of droplet transfer under different welding parameters in pulsed mode. The droplet transfer mode of ““one pulse one droplet““ becomes the preferred selection during welding process because of its stable procedure and sound weld form. The parameter ranges for corresponding transfer mode were experimentally achieved, among which the stable droplet transfer mode of ““one pulse one droplet““ can be realized. These efforts brave the way for control weld heat input and weld formation in the future.     

Effect of bismuth on the growth kinetics of intermetallic compounds in Sn-3.5Ag solder joints: A growth kinetic model

The effect on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints, caused by adding Bi to eutectic Sn-3.5Ag solder alloy, was examined at the aging temperatures of 150°C and 180°C. The Cu₆Sn₅ layer growth was significantly enhanced, but the Cu₃Sn layer growth was slightly retarded by the addition of Bi, resulting in significant growth enhancement of the total (Cu₆Sn₅+Cu₃Sn) IMC layer with increasing Bi addition. The IMC layer growth in the Bi-containing solder joints was accompanied by the accumulation of Bi ahead of the Cu₆Sn₅ layer that resulted in the formation of a liquid layer at the Cu₆Sn₅/solder interface. A kinetic model was developed for the planar growth of the Cu₆Sn₅ and Cu₃Sn layers in the solder joints, accounting for the existence of interfacial reaction barriers. Predictions from the kinetic model showed that the experimental results could be well explained by the hypothesis that the formation of a Bi-rich liquid layer at the Cu₆Sn₅/solder interface reduces the interfacial reaction barrier at the interface.     

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

飞机投放机构卡死问题的摩擦机理研究

飞机挂物投放机构是由弹射杆、锥形体、锥形筒体、滚珠等部分组成的回转机构。地面投放实验过程中,机构有时出现卡死现象。为此,论文建立了多体接触问题的结构有限元模型,进行了塑性力学分析,以摩擦系数为参数,给出了机构卡死的摩擦条件。从库仑摩擦模型入手,考虑粘结点的微观力学特性,进一步研究了可能引起机构卡死的"咬焊"原因。最后,提出了结构改进方案。分析结论与机构投放实验结果取得了较好的吻合,为解决机构卡死问题提供了依据。     

Sn-9Zn无铅钎料合金的压蠕变行为研究

试验研究了Sn-9Zn合金钎料在温度为40～100℃和压力为9．3～18．6MPa范围内的压蠕变行为。结果表明：随温度和应力的升高，合金的压蠕变量增大，稳态蠕变速率的对数分别与应力对数和温度呈较好的线性关系，稳态蠕变速率符合半经验公式。在不同的温度下，应力指数n相近，平均值为5．74；不同的应力下，表观激活能Qa相差不大，平均值为51．95kJ／mol，材料结构常数为0．03，压蠕变变形是位错滑移和位错攀移共同作用的结果，控制稳态蠕变速率的主要因素为位错管道扩散过程控制下的位错攀移。     

气体保护焊短路过渡熔滴成形的建模分析

提出了气体保护焊短路过渡过程中的熔滴成形的概念,并建立了模型.通过微距高速摄像技术和数字图像处理技术对熔滴成形过程中小滴状熔液所受的重力、电磁力以及表面张力提供的支持力进行了分析和定量计算,认为表面张力所提供的支持力远大于电磁力和重力共同导致的促使小滴状熔液下落的力.同时考虑了焊丝的熔化,认为以上因素最终造成小滴状熔液能以滴状的形态不断在焊丝端面进行扩展,形成熔滴.试验证明了熔滴成形这一模型的正确性.