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1.
T. Choi J.‐H. Jang C.K. Ullal M.C. LeMieux V.V. Tsukruk E.L. Thomas 《Advanced functional materials》2006,16(10)
The probing of the micromechanical properties within a two‐dimensional polymer structure with sixfold symmetry fabricated via interference lithography reveals a nonuniform spatial distribution in the elastic modulus “imprinted” with an interference pattern in work reported by Tsukruk, Thomas, and co‐workers on p. 1324. The image prepared by M. Lemieux and T. Gorishnyy shows how the interference pattern is formed by three laser beams and is transferred to the solid polymer structure. The elastic and plastic properties within a two‐dimensional polymer (SU8) structure with sixfold symmetry fabricated via interference lithography are presented. There is a nonuniform spatial distribution in the elastic modulus, with a higher elastic modulus obtained for nodes (brightest regions in the laser interference pattern) and a lower elastic modulus for beams (darkest regions in the laser interference pattern) of the photopatterned films. We suggest that such a nonuniformity and unusual plastic behavior are related to the variable material properties “imprinted” by the interference pattern. 相似文献
2.
CMP系统技术与市场 总被引:3,自引:1,他引:2
葛劢冲 《电子工业专用设备》2003,32(1):17-24
概述了CMP系统技术的发展历史、发展趋势以及在IC生产中的重要性,介绍了国外CMP设备主要制造厂家的设备型号和性能及CMP设备市场分布和需求,阐述了CMP系统技术的基础研究、关键技术和国内研究概况。 相似文献
3.
4.
The aim of this work was to establish the important parameters that control the hot compaction behaviour of woven oriented polypropylene. Five commercial woven cloths, based on four different polypropylene polymers, were selected so that the perceived important variables could be studied. These include the mechanical properties of the original oriented tapes or fibres, the geometry of the oriented reinforcement (fibres or tapes), the mechanical properties of the base polymer (which are crucially dependant on the molecular weight and morphology), and the weave style. The five cloths were chosen so as to explore the boundaries of these various parameters, i.e. low and high molecular weight: circular or rectangular reinforcement (fibres or tapes): low or high tape initial orientation: coarse or fine weave.A vital aspect of this study was the realisation that hot compacted polypropylene could be envisaged as a composite, comprising an oriented ‘reinforcement’ bound together by a matrix phase, formed by melting and recrystallisation of the original oriented material. We have established the crucial importance of the properties of the melted and recrystallised matrix phase, especially the level of ductility, in controlling the properties of the hot compacted composite. 相似文献
5.
We present uniaxial tensile test results for 30–50 nm thick freestanding aluminum films. Young’s modulus and ductility were found to decrease monotonically with grain size. Reverse Hall–Petch behavior was observed with no appreciable room temperature creep. Non-linear elasticity with small irreversible deformation was observed for 50 nm thick specimens. 相似文献
6.
本文以硼酸铝晶须为增强剂,以4,5-环氧环己烷-1,2-二甲酸二缩水甘油酯(TDE-85),甲基纳狄克酸酐(MNA)、N,N’-二胺基二苯甲烷型双马来酰亚胺(BMI)/O,O′-二烯丙基双酚A(BA)体系分别作为基体制备晶须增强复合材料。研究了晶须对树脂的尺寸、表面处理方法、含量对树脂体系力学性能和热性能的影响;通过扫描电子显微镜(SEM)分析了浇注体的弯曲、冲击断口,研究晶须的增强机理。 相似文献
7.
The present work is aimed to extend the knowledge of mechanical properties of sandwich structures used for marine applications
focusing on the possibility to increase the performances of such structures by adding a bonder at the skin/core interface.
Therefore, three sandwich structures that are utilised in different structural components of a yacht were realised by manual
lay-up. The mechanical characterisation was performed by flatwise compressive, edgewise compressive and three point flexural
tests. The tests execution has allowed both to determine the mechanical performances and to understand the fracture mechanisms
that take place when the bonder is added in the stacking sequence of the samples. 相似文献
8.
Recent advances in isotropic conductive adhesives for electronics packaging applications 总被引:4,自引:0,他引:4
Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs. 相似文献
9.
Total simulation model of the thermo-mechanical process in shape rolling of steel rods 总被引:2,自引:0,他引:2
The production of steel reinforcing bars for civil engineering is investigated by means of FEM-simulation. An integrated system for computing appropriate thermo-mechanical parameters of the rolling process is proposed. Generalized plane strain approach and coupled thermal-mechanical solution are applied. The microstructural model combines both the effect of the recrystallization mechanisms (static, dynamic and metadynamic) upon the austenite grain forming in hot rolling and that of phase transformation upon the final microstructure. The phases are created during interrupted below the temperature of martensite transition cooling. Thus a typical industrial process for thermo-mechanical strengthening of reinforcing bars, known as Tempcor-process is considered. Computational results are validated to experimental measured mechanical properties of the steel. By means of computer simulation the system can perform different solutions, giving the possibility to obtain a reasonable choice of different thermo-mechanical rolling conditions. 相似文献
10.