LaNiO3 and Cu3Ge contacts to YBa2Cu3O7-x films

Metallization of high-T_c superconductors using low resistivity metal oxides and Cu-Ge alloys has been investigated on high quality pulsed laser deposited epitaxial YBa₂Cu₃O_7-x (YBCO) films. Epitaxial LaNiO₃ (LNO) thin films have been grown on YBCO films at 700°C using pulsed laser deposition. The specific resistivity of LNO was measured to be 50 μΩ-cm at 300K which decreases to 19 μΩ-cm at 100K indicating good metallicity of the LNO films. The contact resistance of LNO-YBCO thin film interface was found to be reasonably low (of the order of 10^-4Ω-cm² at 77K) which suggests that the interface formed between the two films is quite clean and LNO can emerge as a promising metal electrode-material to YBCO films. A preliminary investigation related to the compatibility of Cu₃Ge alloy as a contact metallization material to YBCO films is discussed. The usage of other oxide based low resistivity materials such as SrRuO₃ (SRO) and SrVO₃ (SVO) for metallization of high-T_c YBCO superconductor films is also discussed.     

继电器的动态接触特性研究

本文主要研究触点带低电平负载时,继电器的动态接触特性。为此,在不同的环境应力下,对继电器的动态接触电阻及其弹跳情况进行了数据采集及处理,得到了一些新的试验结果。     

电子封装中的固相焊接：引线键合

引线键合是电子封装中最常用的IC互连方法,其在键合过程中及键合完成后具有固相焊接的特征。将键合过程分为冲击、接触和键合三阶段,并联系实际键合机台的基本键合时序,发现接触参数及超声功率和连接压力的大小关系对优质焊点的形成有重要影响;键合完成后的金属原子扩散将有助于金属间化合物的生长,但金属间化合物的过度生长将在界面形成开...     

LGA器件焊点缺陷分析及解决

文章针对LGA器件回流焊后常见的空洞和锡珠等缺陷,对其产生的原因进行了分析.通过对LGA器件采用预上锡回流工艺和印制板钢网一字架桥开口的方式,提升回流焊过程中焊膏中挥发气体的逸出,并通过对比试验,找到合适的预上锡钢网尺寸,解决了生产中LGA器件焊接常见的空洞大等缺陷.     

基于信号检测的光无线轨道角动量复用系统研究

基于轨道角动量(OAM)的光无线复用通信技术在理想传输条件下能够大幅度提升通信系统性能,然而现实中大气湍流、孔径失配等因素会造成OAM模态间串扰导致误码率(BER)上升。为了降低光无线OAM复用系统在复杂环境中的误码率,该文首先建立了大气湍流、孔径失配场景下基于垂直分层空时码准则(VBLAST)的OAM复用通信系统(VBLAST-OAM),之后分析对比基于排序干扰连续消除检测算法(OSIC)、基于马尔科夫随机场置信度传播算法(MRF-BP)、基于OAM串扰特性的排序干扰连续消除算法(OAM-OSIC)应用于上述系统时的性能。结果表明：所提信号检测算法均能有效降低OAM复用系统在复杂环境中的误码率,其中,基于MRF-BP算法的系统性能最好;OAM-OSIC虽然属于次优算法,但在算法的运行开销方面具有较大优势。     

银基触头材料裂纹类型及形成机理研究

根据不同电流等级及不同触头闭合压力,对银基触头材料裂纹类型及形成机理进行了分析研究。通过实验研究和理论分析,提出了三种裂纹类型并分析了每种裂纹的形成机理。     

Schottky barrier heights of contact metals to p-type ZnSe

Schottky barrier heights (SBHs) of a variety of metals (In, Cd, Nb, Ti, W, Cu, Ag, Au, Ni, Pt, and Se) contacting to p-ZnSe grown by a molecular beam epitaxy method were determined by analyzing capacitance-voltage (C-V) and/or current density-voltage (J-V) curves. The SBH values of the Au and Ni contacts were determined from intersections of straight lines of the C⁻²-V curves to be 1.23 and 1.13 eV, respectively. The J-V calculations provided a large SBH value of 1.2 ± 0.1 eV for a variety of metals, indicating that the Fermi-level could be pinned at the contact interface. Reduction of the SBH values to a level lower than 0.4 eV and/or increase of doping concentrations to a level higher than 10²⁰ cm⁻³ are essential to obtain an ohmic contact with contact resistivity of around 10⁻³ Ω·cm².     

Automatic Detection of Steel Bali＇s Surface Flaws Based on Image Processing

A new method to detect steel bali＇s surface flaws is presented based on computer techniques of image processing and pattern recognition. The steel bali＇s surface flaws is the primary factor causing bearing failure. The high efficient and precision detections for the surface flaws of steel ball can be conducted by the presented method, including spot, abrasion, burn, scratch and crack, etc. The design of main components of the detecting system is described in detail including auto-matic feeding mechanism, automatic spreading mechanism of steel ball＇ s surface, optical system of microscope, image acquisition system, image processing system. The whole automatic system is controlled by an industrial control computer, which can carry out the recognition of flaws of steel bali＇s surface effectively.     

Thermography of aged contacts of high voltage equipment

New developments in diagnostic tools and systems are necessary for a reliable and economic evaluation of the condition of equipment in power systems. In a research project a tool for the condition of contacts of centre break disconnector, which is used under normal operation by the aid of a thermography measurement system, has been developed. In this paper, an overview about the laboratory investigation of the temperature load behaviour and the environmental influence on-site for new and aged disconnector contacts are given. A condition evaluation tool for contacts, which was the aim of the project, has been created. The basic method for the evaluation is presented, and also two additional easements for a fast identification of suspect contacts are presented. With this evaluation tool and the usage of a thermography based measuring system, a condition based maintenance strategy can be applied, whereby an early detection of damages is possible and so power quality and reliability increase.