Performance evaluation of noise reduction method during on-line monitoring of MV switchgear for PD measurements by non-intrusive sensors

Partial Discharge (PD) measurement is a globally accepted method for insulation diagnosis of electrical assets. The consequences of insulation breakdown are well known. The trend is to move from conventional offline testing to online monitoring for insulation life prediction, which results in the inclusion of high frequency noise in the captured signals. Therefore de-noising is of paramount importance in online monitoring to obtain useful information from the signal.In this research, a 20 kV switchgear panel has been subjected to PD faults in the laboratory and measurements have been carried out by using different non-intrusive sensors including a novel sensor, the D-dot sensor and recorded by a high frequency oscilloscope. The measured results show the effective applicability of sensors for switchgear. The Discrete Wavelet Transform (DWT) has been used to de-noise PD signals in this paper. Time domain and frequency domain comparison of original and de-noised PD signals reveals the significance of this technique for online monitoring of Medium Voltage (MV) switchgear. Finally, an adaptive online de-noising concept, based on automatic de-noising is also proposed in this paper.     

Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.     

Soret and Dufour effects between two rectangular plane walls with heat source/sink

This study addresses the thermo‐diffusion and the diffusion‐thermo phenomena in a semi‐infinite absorbent channel whose walls are contracting/expanding, with heat source/sink effects. The governing partial differential equations with suitable boundary conditions are transformed to a system of dimensionless ordinary differential equations. An analytic solution of the problem has been found using a technique called homotopy analysis method (HAM). HAM gives consistently valid answers to the problem over an extensive variety of parameters and also provides better accuracy. To validate the analytical results, a comparison has been presented with a numerical solution calculated by using the parallel shooting method. The effects of dimensionless parameters, that is, deformation parameter, Reynolds number, Soret and Dufour numbers, and heat source/sink parameter on the expressions of velocity, temperature, and concentration profiles are analyzed graphically to understand the physics of the deformable channel. It has been noted that the velocity across the channel is higher for the expanding channel, as compared to that for the contracting channel. Also the Soret and Dufour number increases the temperature of the fluid, and decreases the concentration. The temperature profile has an increasing behavior in the case of heat source, and a decreasing behavior in the case of heat sink.     

Development of LTCC micro-hotplate with PTC temperature sensor for gas-sensing applications

Low temperature co-fired ceramic (LTCC) micro-hotplates show wide applications in gas sensors and micro-fluidic devices. It is easily structured in three-dimensional structures. This paper presents the low power consumption micro-hotplates which were developed with PTC (positive temperature coefficient) temperature sensor and inter-digitated electrodes. The paper presents two different structures for micro-hotplate with platinum as a heating element. The PTC temperature sensor using two different materials viz. PdAg and platinum paste are developed with micro-hotplates. The simulation has been achieved through COMSOL for LTCC and alumina micro-hotplates. The temperature variation with power consumption has been measured for the developed LTCC micro-hotplates. The change in resistance of PTC temperature sensors was measured with micro-hotplate temperature. The aim of this study was to place a temperature sensor with the gas sensor module to measure and control the temperature of micro-hotplate. A SnO₂ sensing layer is coated on LTCC micro-hotplate using screen printing and characterized for the sensing of carbon monoxide gas (CO). This study will be beneficial for designing hotplates based on LTCC technology with low power consumption and better stability of temperature for gas-sensing applications.     

Effects of SiC content on the densification,microstructure, and mechanical properties of HfB2–SiC composites

To investigate the effects of SiC on microstructure, hardness, and fracture toughness, 0, 10, 20, and 30 vol% SiC were added to HfB₂ and sintered by SPS. Upon adding SiC to 30 vol%, relative density increased about 4%; but HfB₂ grain growth had a minimum at 20 vol% SiC. This may be due to grain boundary silicate glass, responsible for surface oxide wash out, enriched in SiO₂ with higher fraction of SiC. By SiO₂ enrichment, the glass viscosity increased and higher HfO₂ remained unsolved which subsequently lead to higher grain growth. Hardness has increased from about 13 to 15 GPa by SiC introduction with no sensible variation with SiC increase. Residual stress measurements by Rietveld method indicated high levels of tensile residual stresses in the HfB₂ Matrix. Despite the peak residual stress value at 20 vol% SiC, fracture toughness of this sample was the highest (6.43 MPa m^0.5) which implied that fracture toughness is mainly a grain size function. Tracking crack trajectory showed a mainly trans-granular fracture, but grain boundaries imposed a partial deflection on the crack pathway. SiC had a higher percentage in fracture surface images than the cross-section which implied a weak crack deflection.     

Piperacillin/tazobactam‐induced neurotoxicity in a hemodialysis patient: A case report

Antibiotics are potentially a cause of neurotoxicity in dialysis patients, the most common are the beta‐lactams as ceftazidime and cefepime, and few cases have been reported after piperacillin/tazobactam use. This report presents a case of a hypertensive and diabetic 67‐year‐old woman in regular hemodialysis, which previously had a stroke. She was hospitalized presenting pneumonia, which was initially treated with cefepime. Two days after treatment, she presented dysarthria, left hemiparesis, ataxia, and IX and X cranial nerves paresis. Computed tomography showed no acute lesions and cefepime neurotoxicity was hypothesized, and the antibiotic was replaced by piperacillin/tazobactam. The neurologic signs disappeared; however, 4 days after with piperacillin/tazobactam treatment, the neurological manifestations returned. A new computed tomography showed no new lesions, and the second antibiotic regimen withdrawn. After two hemodialysis sessions, the patient completely recovered from neurological manifestations. The patient presented sequentially neurotoxicity caused by two beta‐lactams antibiotics. This report meant to alert clinicians that these antibiotics have dangerous neurological effects in chronic kidney disease patients.