履带车辆电传动系统电气机械联合制动优化控制与仿真

根据电传动研究情况,提出了电传动电气机械联合制动优化控制目标;在这个目标下,完成了电气制动控制策略优化,进行了原车机械制动系统在联合制动中制动力的分配,通过试验和仿真说明它的合理性;最后给出联合制动的仿真结果,并进行了分析。     

Research on Combination Winding of Revolving Bodies

A methematical model based upon the theory of differential geometry isestablished for the combination winding of revolving bodies and programs are developedfor the filament winding operations as well.Trial winding on a filament winding machineproved this model is right and useful.     

防泵轴头甩油新结构的研制开发

通过对泵原结构轴头甩油原因分析，指出了漏油原因。研制出防止轴头甩油的离心密封和螺旋密封组合的新结构。利用离心密封作为初步节流阻漏密封，利用螺旋密封作二次密封。这种改进方法只需改造轴承箱压盖和轴承锁紧螺母，对原结构改动很小，即能满足密封要求，又能适应原结构可利用空间小的限制。实际使用效果良好，有普遍推广价值。     

Stress intensity factors for an interfacial crack between an orthotropic half-plane bonded to a dissimilar orthotropic layer with a punch

The plane strain problem of determining Stress Intensity Factors (SIF) for a moving interfacial Griffith crack between an elastic orthotropic half-plane and a dissimilar orthotropic layer with a moving punch situated along the boundary of the layer have been considered. The problem is reduced to the solution of three simultaneous singular integral equations with Cauchy-type singularities. Expressions for SIF for the case of a general loading are obtained. Numerical results for some particular cases are also presented graphically.     

Application of multi-layer perceptron neural networks to vision problems

This paper discusses the application of a class of feed-forward Artificial Neural Networks (ANNs) known as Multi-Layer Perceptrons(MLPs) to two vision problems: recognition and pose estimation of 3D objects from a single 2D perspective view; and handwritten digit recognition. In both cases, a multi-MLP classification scheme is developed that combines the decisions of several classifiers. These classifiers operate on the same feature set for the 3D recognition problem whereas different feature types are used for the handwritten digit recognition. The backpropagationlearning rule is used to train the MLPs. Application of the MLP architecture to other vision problems is also briefly discussed.     

Size effect on the optimum actuation condition for SMA-composites

Techniques of using shape memory alloy (SMA) wires as actuators inside the hybrid composites have been studied extensively for improving mechanical properties of structures. There were many experimental findings and theoretical predictions agreed the higher the actuation temperature on built-in SMA wires, the greater the improvement in mechanical response of a composite due to recovery action of wires. However, due to the limitation of interfacial shear strength, over-actuation (by means of electrical resistive heating) of SMA wire is able to induce the development of interfacial crack inside the composite structure. When the maximum interfacial shear strength is attained due to vigorous recovery action of SMA wire under relatively high temperature, interfacial debond can be initiated. In this paper, a typical SMA–matrix cylinder model is employed to study the captioned risk of SMA-composite actuation. Applying the criterion of optimum actuation condition (OAC), target actuation level can be determined to prevent structural failure due to over-actuation. Effects of geometric factors including wire embedded length and matrix-to-wire radius ratio on the interfacial shear stress distribution are evaluated prior to the study of size effect on OAC. Results indicate that the size effect become negligible when these two geometric factors are sufficiently large and as a result, the governing equation of OAC can be greatly reduced to a simple relation between externally applied stress and actuation temperature on the SMA wire. This simplified model is able to enhance the application of OAC and provide a simple and explicit solution to determine an ideal range of actuation levels for a large scale SMA-composite structure in the design stage.     

基于轮廓和统计特征的手写体数字识别

提出了数字规范化模板特征,并利用这一特征与轮廓分段特征相结合对手写体数字进行识别。首先使用基于轮廓分段特征的分类器进行识别,通过提高拒识率获得高可靠性的分类结果。然后由基于数字规范化模板特征的分类器对前一级分类器的拒识样本分类。实验结果表明分别基于这两个特征的分类器在分类结果上具有较强的互补性。实验的数据为真实支票上采集的10000个手写体数字样本,该方法的识别率为98.06%。     

Wettability and interfacial reaction mechanism between Ag–Cu alloy and Si3N4 ceramics in air atmosphere

The wetting behaviour and interfacial reaction mechanism between Ag–Cu alloy fillers (with varying copper contents) and Si₃N₄ ceramics using reactive air brazing at 970 °C were systematically investigated. As the copper content increased, the contact angles of the Ag–Cu filler on the Si₃N₄ ceramics decreased. A violent boiling-like interfacial reaction was observed during the experiment, and mass spectrometry analysis identified the gaseous products as N₂, NO and NO₂. The solid products SiO₂ and Cu–O formed at the interface, and the interfacial reactions improved the wettability of the Ag–Cu filler on the Si₃N₄ ceramics. Owing to buoyancy and the pushing of the gases, the interfacial products floated to the surface of the filler and their distribution increased along with the increasing copper content. Two different microstructures were formed at the interface near the triple line. Thick and thin SiO₂ layers were respectively formed on the triple line interface of the fillers with low (Ag–3Cu/Ag–5Cu) and high (Ag–6.6Cu/Ag–16Cu) copper content. The interfacial bonding zones formed in Ag–5Cu, Ag–6.6Cu, and Ag–16Cu samples indicated that the corresponding Ag–Cu fillers were effectively brazed with the Si₃N₄ ceramics.     

Current enhanced wettability of eutectic SnBi melt on Cu substrate

The effect of a direct electric current on the wetting behaviour of eutectic SnBi melt on Cu substrate at 220°C was investigated in the present study. It is found that the application of current enhanced the growth rate and lateral growth of interfacial reaction layer between eutectic SnBi melt and Cu substrate. Furthermore, with the increase in the current, the spread of eutectic SnBi melt on Cu is accelerated significantly and the steady state contact angle is decreased markedly. The reason for these is also discussed in the present paper.     

The effect of metal coatings on the interfacial bonding strength of ceramics to copper in sintered Cu-SiC composites

Cu-SiC composites are very promising materials which have high thermal and electrical conductivity and may find many applications. Unfortunately, the main disadvantage of these materials is the dissolution of silicon in copper at elevated temperature, which significantly reduces their properties. In order to overcome this problem particles can be coated with a protective material before sintering. In this paper– the influence of three different metallic coatings on bonding strength were investigated. SiC particles were coated with tungsten, chromium or titanium. As reference a material with uncoated particles was prepared. The experiments were carried out with the use of microtensile tester. The highest increase in strength was observed in the case of chromium coating. On the other hand, the titanium coating, which was of very poor quality, decrease the bonding strength in comparison with uncoated particles. Furthermore, scanning electron and optical microscopes were used to determine the mechanism of debonding.