温度对超精密微位移系统定位精度影响的研究

超精密微位移系统的定位精度除了与其本身的特性有关外,还与工作环境等因素密切相关。本文系统地分析了温度对压电陶瓷微驱动器、微进给工作台和检测元件的影响。采用有限元方法给出了微进给工作台在环境温度发生变化时的变形云图,说明了温度影响微进给工作台定位精度的原理。对各种检测元件受温度的影响进行了分析对比。最后从环境温度的控制、材料选择和检测元件3个方面给出了解决的措施。     

内衬GFRP防护复合管壁原缺陷坑处应力重分布规律分析

为了深入研究内衬GFRP防护复合管壁在其原管道内腐蚀缺陷坑处的应力重分布状态以及其修复的效果,利用弹塑性力学中的平衡微分方程,建立了管道内腐蚀缺陷处的数学模型,采用有限单元法建立了含单个腐蚀缺陷的管道模型,并通过改变腐蚀缺陷坑的深厚比,将修复前后腐蚀缺陷坑处的应力状态进行对比分析。分析结果表明,腐蚀缺陷坑的深厚比对管道的应力分布有着显著的影响,所以在进行管道安全评估时应注意腐蚀坑深度的影响;在腐蚀缺陷坑深厚比0.1到0.8的分次增加的过程中,管壁腐蚀缺陷处的周向应力,径向应力,Mises应力都有增大的趋势;修复前腐蚀缺陷坑处的周向应力和Mises应力相近,径向应力较前两者小,三者中周向应力最大;在修复前后,管道腐蚀缺陷处的控制应力一般是周向应力,管道的失效可依据周向应力进行判断;修复后的内衬GFRP防护复合管壁,原始腐蚀缺陷坑处发生了应力重分布,其周向应力与Mises应力均有减小,修复效果明显。     

软土地区深基坑设计探讨

结合具体工程实例,对软土地区深基坑设计进行了探讨,介绍了软土地基深基坑设计时的荷载取值,设计原则,具体支护方案的选择等,并阐述了支护工程中相关参数的计算软件及程序,以期指导设计人员提高设计水平。     

电流密度对光电化学腐蚀宏孔硅阵列形貌的影响

宏孔硅阵列(MSA)在光子晶体、硅微通道板、MEMS 器件等领域应用前景广阔,引起人们广泛关注。为制备理想的MSA结构,本文开展了MSA光电化学方法腐蚀实验,重点研究了腐蚀电流密度对宏孔形貌的影响。给出了n型硅抛光片背面光照情况下在氢氟酸溶液中的电流-电压扫描曲线,讨论了临界电流密度JPS的意义和MSA稳定生长的基本电流密度条件。提出了一种间接地测量JPS与腐蚀时间关系的方法,并根据JPS的测量结果调整腐蚀电流,实现了理想的MSA等径生长,制备出孔深度为295m,长径比为98的MSA结构。     

A study of compaction of composite particles by multi-particle finite element method

We study the compaction of composite mixture of soft and hard micro-/nano-size particles using multi-particle finite element method. In this method, each particle is fully discretized into finite element mesh. Local non-uniform contact deformation and non-uniformity stress chains transmitted through the composite are well illustrated. In this work, we focus on the effect of inter-particle friction and volume fraction of hard particles on compaction pressure. Results of closed die compaction of 400 two-dimensional monosize spherical particles of zero and 40% volume fraction hard particles are presented. The results show that compaction pressure increases with inter-particle friction and volume fraction of hard particles. The predicted compaction pressure curves are in good agreement with experimental data and other models.     

Super-hydrophobic property of nano-sized cupric oxide films

Nano-sized cupric oxide (CuO) films with biomimetic super-hydrophobic surfaces were fabricated by isothermally oxidizing nano-sized Cu films prepared by electroless plating on smooth glass substrate following modification with octadecanethiol (CH₃-(CH₂)₁₇-SH). The microstructure characterization showed that CuO films with 54 nm thickness have a dual-scale structure consisting of the 150-200 nm agglomerates composed of the 30-50 nm granules, a similar structure to lotus-leaf. The measurement of wettability showed that CuO films modified with octadecanethiol exhibit a super-hydrophobic property with a water contact angle of ~ 154°. The mechanism leading to the super-hydrophobic property of CuO films was also analyzed based on the results of X-ray photoelectron spectroscopy (XPS).     

Fabrication and electroosmotic flow measurements in micro- and nanofluidic channels

An easy method for fabricating micro- and nanofluidic channels, entirely made of a thermally grown silicon dioxide is presented. The nanochannels are up to 1-mm long and have widths and heights down to 200 nm, whereas the microfluidic channels are 20-μm wide and 4.8-μm high. The nanochannels are created at the interface of two silicon wafers. Their fabrication is based on the expansion of growing silicon dioxide and the corresponding reduction in channel cross-section. The embedded silicon dioxide channels were released and are partially freestanding. The transparent and hydrophilic silicon dioxide channel system could be spontaneously filled with aqueous, fluorescent solution. The electrical resistances of the micro- and nanofluidic channel segments were calculated and the found values were confirmed by current measurements. Electrical field strengths up to 600 V/cm were reached within the nanochannels when applying a potential of only 10 V. Electroosmotic flow (EOF) measurements through micro- and nanofluidic channel systems resulted in electroosmotic mobilities in the same order of those encountered in regular, fused silica capillaries.     

上海地区超深基坑工程地下连续墙的变形特性

本文建立了上海地区58个开挖深度19m以上超深基坑工程数据库,对围护墙体水平位移特性进行了以下几方面的统计分析:归一化最大水平位移值的特征、最大水平位移位置的特征、软土层厚度对变形的影响、墙趾土层对围护墙体变形的影响等,得到了上海地区超深基坑围护墙体一般变形规律和变形控制要点,可以用于超深基坑的设计优化和进行变形估算。另外,通过对超深基坑支护体系系统刚度的研究,建立了墙趾进入硬土层基坑的变形比与支撑竖向间距和围护墙厚度的关系式,可以根据基坑围护的变形比要求进行支撑配置和围护墙厚度的初步选定。     

缓蚀剂在高压阳极箔电解扩孔中的作用机理

将高压阳极发孔铝箔在70℃、质量分数为3%的硝酸液中阳极电解扩孔,研究了添加大分子缓蚀剂聚苯乙烯磺酸(PSSA)后高压阳极箔的腐蚀机理。结果显示:添加PSSA后,腐蚀箔减薄量明显降低,质量损失率减小,并孔率降低,520 V化成的比容提高了约23%。隧道孔由孔口大、孔内小的"锥子"状转变为孔口小、孔内大的"垒球棒"状。铝箔表面的电位显著上升,而隧道孔内的电位基本保持不变,从而证明了,大分子缓蚀剂PSSA提高了铝箔表面和隧道孔口附近的电化学反应的阻力,电流主要分布到孔内,加速了孔内的扩孔过程。     

信息化监测技术在南坪交通枢纽深基坑施工中的应用

结合南坪交通枢纽工程,详细分析了信息化监测技术在具有复杂周边环境的深基坑施工中的应用,确保了正确施工和避免基坑事故的发生,为其他类似工程提供了借鉴和参考。