Thermally stimulated creep (TSCr) study of viscoelastic behavior and physical aging of a polymeric matrix composite for spacecraft structures

Thermally Stimulated Creep (TSCr) mechanical spectroscopy has been used to analyze molecular movements in KMU‐4lcarbon/epoxy composite material around the glass transition temperature. This technique is powerful to characterize the microstructure and micromechanical properties of the epoxy matrix and their evolution upon thermal aging. Three cooperative submodes have been distinguished by resolving the fine structure of the material complex α‐retardation mode. The elementary processes constituting this mode possess activation enthalpies and preexponential factors that strongly depend on the thermal history of the sample. The activation parameters of the composite are subject to perceptible evolution due to postcuring degradation. The α‐mode associated complex spectrum shifts towards higher temperatures by 27°C as a consequence of a series of quenching in the temperature range 260 to 0°C; the material shows a rise in the fragility and a deterioration in the crack‐growth resistance qualities. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 342–350, 2002     

Dynamic viscoelasticity of low‐density polyethylene/in‐situ‐grafted carbon black composite

The study on the dynamic viscoelastic properties of grafted carbon black (g‐CB) filled low‐density polyethylene (LDPE) was carried out. Because of formation of CB networking, the characteristic modulus plateau and loss tangent arc appears. Addition of grafting monomer like butyl acrylate (BA) and acroleic acid (AA) enhances the interaction between particles and matrix due to accelerated formation of micronetworking in the composites induced by forming branch chains of AA and BA with multiunit. The decrease of the temperature corresponding to α_c mechanical relaxation together with AA (BA) addition given by the position of loss tangent (tan δ) peak for LDPE is owed to the formation of long‐chain polymer grafted between CB and the matrix, which facilitates the slip of the lamella of LDPE. The influence of maleic anhydride (MA) on enhancing interaction between LDPE and CB is not so pronounced, as compared with AA and BA because of no formation of long chain between CB particle and polymer matrix. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4127–4132, 2006     

环糊精改性超支化聚合物的合成与性能评价

以丙烯酰胺(AM)、丙烯酸(AA)、环糊精改性超支化功能单体(MAH-β-CD-HPEA)、甜菜碱(DEPS)为原料合成了四元共聚物PADAH。考察了引发剂质量分数、AM与AA质量比、DEPS与MAH-β-CD-HPEA质量比对聚合物溶液黏度的影响。得到的最佳合成条件为:AM与AA的质量比为2∶1(共占单体总质量的85%),DEPS与MAH-β-CD-HPEA的质量比为14.5∶0.5(共占单体总质量的15%),引发剂质量分数为0.3%。性能研究表明,该共聚物的质量浓度为2000 mg/L时,溶液黏度可达643 mPa·s,3500 r/min剪切20 s后黏度保留率高于80%;90℃时,PADAH的黏度为237m Pa·s,黏度保留率为37.5%,均优于未加MAH-β-CD-HPEA的甜菜碱型聚合物(PADA)和普通部分水解聚丙烯酰胺(HPAM)。     

一步法多单体反应挤出PP/PA6增容体系研究

采用一步法将接枝单体马来酸酐(MAH)和苯乙烯(St)、引发剂过氧化二异丙苯(DCP)与聚丙烯(PP)、尼龙6(PA6)、乙烯辛烯共聚物(POE)等混匀后在双螺杆挤出机中就地反应增容，详细地讨论了MAH／St／DCP用量和PA6含量对共混体系拉伸性能和冲击性能的影响；通过扫描电镜(SEM)分析了MAH／St／DCP用量及PA6含量对共混物的亚微形态、相界面的影响；通过红外光谱(FTIR)的结果分析对PP／PA6共混物增容反应机理进行了初步探讨。结果表明：一步法添加MAH／St／DCP引起PP／PA6共混体系发生了酰亚胺化反应，生成了Pp—(St—MAH)—PA6接枝共聚物有很好的增容作用；PA6与基体PP的界面非常模糊，分散相的颗粒也变得均匀细小，约0．5μm，大大改善了两相之间的粘结；从而使得PP／PA6共混体系的力学性能有了较大的提高，PA6质量分数在20％，MAH／St／DCP添加1～4份时效果最佳，缺口冲击强度提高2倍左右，拉伸强度、断裂伸长率、无缺口冲击强度也有明显改善。     

The Kinetics of the Thermal Decomposition of Thermoplastic Polyurethane Elastomers under Thermoplastic Processing Conditions

A theoretical approach to the kinetics of the thermal decomposition of molten thermoplastic polyurethane elastomers, under conditions of thermoplastic processing, is described. On the basis of these considerations, the thermal decomposition in different instruments (melt index analyser and measuring extruder) can be described quantitatively and the various results can be compared. As a result, identical conditions of decomposition of the melt can be defined accurately, thus opening up the possibility of combining experimental values from different instruments. The fundamental kinetic equation obtained for the kinetics of the thermal decomposition of thermoplastic polyurethanes describes the decomposition reaction and the reverse reaction (formation reaction) – which is dependent on the system of measurement and processing – as a function of the molar mass (end‐group concentration) of the original product, determined from the velocity constants for the decomposition reaction and back reaction. The consideration of the limiting value for t → ∞ is in agreement with the equilibrium constant. Consequently, the development of physical characteristic functions of thermoplastic polyurethane elastomers – independent of the system of measurement – is possible.

Experimental values and calculated curves for the thermal decomposition of PUR‐Et in a melt index analyser.     

Thermal and crystallization characteristics of poly(ethylene terephthalate) with poly(oxybenzoate‐p‐trimethylene terephthalate) copolymer

Poly(ethylene terephthalate) (PET) was blended with two different poly(oxybenzoate‐p‐trimethylene terephthalate) copolymers, designated T28 and T64, with the level of copolymer varying from 1 to 15 wt %. All samples were prepared by solution blending in a 60/40 (by weight) phenol/tetrachloroethane solvent at 50°C. The crystallization behavior of the samples was studied by DSC. The results indicate that both T28 and T64 accelerated the crystallization rate of PET in a manner similar to that of a nucleating agent. The acceleration of PET crystallization rate was most pronounced in the PET/T64 blends with a maximum level at 5 wt % of T64. The melting temperatures for the blends are comparable to that of pure PET. The observed changes in crystallization behavior are explained by the effect of the physical state of the copolyester during PET crystallization as well as the amount of copolymer in the blends. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1599–1606, 2002     

Effect of filler network on dynamic viscoelastic properties of uncured polymethylvinylsiloxanes filled with silica and carbon black

Dynamic properties of polymethylvinylsiloxane (PMVS) filled with filler‐blends composed of carbon black (CB) and silica (SiO₂) were investigated using an advanced rheometric expansion system. A variety of weight fraction of CB to SiO₂ were 0/100, 10/90, 30/70, 50/50, 70/30, 90/10, and 100/0, and a bifunctional organsilane, bis(3‐triethoxysilylpropyl)tetrasurfane, was used to facilitate the filler dispersion. The results reveal that the incorporation of CB/SiO₂ filler‐blends into PMVS result in a reduced Payne effect. This effect reaches a minimum when the ratio of CB/SiO₂ approaches 1, and then it began to rebound with the ratio increase. Meanwhile, a characteristic Newtonian viscosity plateau appearing in low frequencies also significantly decreases, depending on the amount of CB or SiO₂ added. On the basis of a simplified Fowke model, we ascribe this phenomenon to the deteriorated filler network, which is predominantly induced by the totally different surface activity between CB and SiO₂. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3477–3482, 2006     

Use of organosolv lignin in phenol-formaldehyde resins for particleboard production: II. Particleboard production and properties

The objective of this work was to demonstrate the utility of lignin-based resins designed for application as an adhesive in the production of particleboard. Bond qualities of lignin-phenol-formaldehyde resins, phenolated-lignin-formaldehyde resins and commercial phenol-formaldehyde (PF-com) resin were assessed by using an automatic bonding evaluation system, prior to production of particleboards. In order to evaluate the quality of lignin-based resins, particleboards were produced and physical and mechanical properties were investigated. These physical properties included internal bond, modules of rupture and modulus of elasticity. Thickness swell and water absorption properties of particleboards bonded with lignin-based resins were also determined. The lignin-based resins have been reported previously in Part I of this study. The results showed that particleboards bonded with phenolated-lignin formaldehyde resins (up to 30% lignin content) exhibited similar physical and mechanical properties when compared to particleboards bonded with PF-com. The work has indicated that phenolated-lignin formaldehyde resins (up to 30% substitution level) can be used successfully as a wood adhesive for constructing particleboard. The performance of these panels is comparable to those of boards made using PF-com resin.     

Optical and surface properties of whey protein isolate coatings on plastic films as influenced by substrate,protein concentration,and plasticizer type

Composite film structures of common plastic polymers including polypropylene (PP) or poly(vinyl chloride) (PVC) with whey protein isolate (WPI) coatings may be obtained by a casting method. Optical and surface properties of the resulting WPI‐coated plastic films, as affected by protein concentration and plasticizer type, were investigated to examine the biopolymer coating effects on surface modification with polymeric substrates of opposite polarity. The measured properties involved specular gloss, color, contact angle, and critical surface energy. Regardless of the substrates, WPI‐coated films possessed excellent gloss and no color, as well as good adhesion between the coating and the substrate when an appropriate plasticizer was added to the coating formulations. The protein concentration did not significantly affect gloss of WPI‐coated plastic films. Among five plasticizers applied, sucrose conferred the most highly reflective and homogeneous surfaces to the coated films. The WPI coatings were very transparent and the coated films with various protein concentrations and plasticizers showed no noticeable changes in color. Experimental results suggest that WPI coatings formulated with a proper plasticizer can improve the visual characteristics of the polymeric substrate and enhance water wettability of the coated plastic films. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 335–343, 2004     

Reaction-formed W2B5/C composites with high performance

Highly densified W₂B₅/C composites with W₂B₅ content from 30 to 70 vol% were fabricated by reaction hot pressing of the powder mixture of B₄C, WC and carbon black. The reaction products were identified by XRD analysis to consist of only W₂B₅ and carbon, regardless of carbon content. The reaction formed composites have excellent mechanical properties (the maximum flexural strength and fracture toughness of 786 MPa and 8.9 MPa m^1/2 respectively), electrical conductivity (the highest electrical conductivity of 1.64 × 10⁶ Ω⁻¹ m⁻¹), and resistance to both wear and oxidation because of the presence of the plate-like W₂B₅ grains. In this paper, the preparation, microstructure and properties of this new composite are investigated, and the strengthening, toughening, conduction mechanisms are discussed.