高温环境下大功率DPL的LD最佳散热效果

大功率DPL泵浦源LD的热管理技术是制约二极管泵浦固体激光器工程应用的瓶颈之一。介绍了二极管泵浦固体激光器的工作过程,设计通过半导体制冷片对LD实施温度控制。主要针对DPL的高温应用环境,对泵浦源LD的散热通道进行分析和计算,设计了可以在高温环境下正常工作的DPL工程样机。该样机主要性能指标：输出峰值功率大于100 kW,激光脉宽为5 ns,重频10 kHz。对该样机进行高低温环境试验,获得试验数据并得出结论：在高温50 ℃情况下,LD可以连续稳定工作 30 min以上。     

红外用微型节流制冷器温度采集系统

制冷温度是红外用微型节流制冷器最关键的参数之一.能否精确快速采集红外用微型节流制冷器的温度,对该制冷器的研制和生产起着至关重要的作用.介绍了一种使用美国NI公司的数据采集卡和LABview软件编制的温度数据采集系统.该系统可以同时对几个样本点进行精确的温度采集及保存,还可以将不同样本点与时间的关系用图表的形式直观的表现出来.     

Sub-1 V,pico-watt subthreshold CMOS voltage reference circuit with dual temperature compensation

A pico-watt CMOS voltage reference is developed using an SK Hynix 0.18 µm CMOS process. The proposed architecture is resistorless and consists of MOSFET circuits operated in the subthreshold region. A dual temperature compensation technique is utilized to produce a near-zero temperature coefficient reference output voltage. Experimental results demonstrate an average reference voltage of 250.7 mV, with a temperature coefficient as low as 3.2 ppm/°C for 0 to 125 °C range, while the power consumption is 545 pW under a 420 mV power supply at 27 °C. The power supply rejection ratio and output noise without any filtering capacitor at 100 Hz are −54.5 dB and 2.88 µV/Hz^1/2, respectively. The active area of the fabricated chip is 0.00332 mm².     

A fast temperature-aware fixed-outline floorplanning framework using convex optimization

With aggressive scaling of CMOS technology, it is essential to consider chip temperature in all design levels of digital systems to improve chip reliability and leakage power consumption. In this paper, we present a two phase fixed-outline floorplanning framework that attempts to reduce the peak-temperature of the chip. The first phase distributes evenly the available dead space between the floorplan blocks of a chip, so as to reduce the peak-temperature. The second phase employs a two-stage convex optimization formulation to perform fixed-outline floorplanning such that minimizes the peak-temperature while satisfying physical constraints. To mitigate the time and computational complexity of capturing the temperature behavior, we present a less computational expensive analogous formulation that approximates the temperature of a block by its corresponding power density. Although, the corresponding power density formulation exhibits lower complexity the experimental results demonstrate its high degree of accuracy. Moreover, this formulation manages to achieve significant improvements in terms of peak-temperature and runtime for almost all of the test cases. We investigate the trade-off between peak-temperature and area as well and provide conditions that result in a reasonable reduction of peak-temperature with minimum increase of the dead space.     

亚半微米光刻投影物镜温度补偿控制及算法研究

主要介绍一种光刻机投影物镜温度补偿控制的原理及控制算法。根据系统结构、对象特性和过程指标要求,采用了一种智能型线性－模糊控制器,获得了优良的动态和稳态性能。     

月表温度变化下电缆装联材料性能影响分析

在探月任务中,由于月球表面温度变化非常大,探测器上的电缆需要经历高温达125℃,低温达-180℃的严酷极限温度条件,因此电缆装联所用的电连接器、热缩套管、灌封胶等材料是否能经受住如此严酷的温度是一个疑问。为此开展了高低温下电缆用材料的特性变化试验,并对出现的问题进行了分析,得出了可适用于深空探测的合适的材料。试验结果如下:(1)airborn微小型电连接器在125℃高温下绝缘性能显著下降,国产J30JH微小型连接器高温绝缘性能较稳定;(2)125℃高温下国产RSG热缩套管发生熔化并粘连;(3)高低温循环作用下,采用ATUM套管加热缩带或纯热缩带的方式可保证尾罩处理满足使用要求。     

基于光纤光栅传感器高压开关柜温度监测系统设计

本文针对高压开关柜温度监测问题,提出了一种基于光栅原理的温度监测系统。文章首先阐述了高压开关柜温度监测在电力系统中的重要性,其次对国内外目前的监测手段进行简要介绍,再次阐述了光线光栅的测温原理,最后对设计的光纤光栅温度监测系统进行阐述。本文依据光纤光栅传感器的测温原理,对高压开关柜温度监测问题进行了有益探索,对实际应用具有一定的指导意义。     

盐雾腐蚀对不同封装形式集成电路性能的影响

通过分析塑料封装、陶瓷封装、玻璃封装和金属封装集成电路的材料成分,得出它们抵抗盐雾的腐蚀能力。根据市场的使用情况,选用塑封、陶封、玻封三种封装形式的集成电路按照6种不同的试验条件进行盐雾试验。文章通过对试验后的结果进行比较和分析,得出在正常盐雾腐蚀条件下, 它们性能受到影响的大小;在不同盐雾溶液和不同的温度条件下,陶瓷封装电路的性能也发生了变化。最后对塑料封装、陶瓷封装、玻璃封装电路的抗盐雾腐蚀能力进行了总结。     

纠正套刻畸变

介绍了调整扫描投影式光刻机畸变的几种方法。畸变是扫描投影式光刻机经常出现的问题,由此而带来的各机台间不能套刻,给生产造成相当的麻烦。简单分析问题的成因及调整方法。