Thermal Expansion Behavior of La1—xSrxMn1—yCoyO3—δ Perovskites

The thermal expansion behavior of La1-xSrxMn1-yCoyO3-δ (x=0.2-0.4, y=0.1-0.3) perovskites in air has been investigated. The average linear thermal expansion coefficients increased with increasing Sr content up to 40 mole fraction or Co content up to 30 mole fraction. The expansion is generally attributed to an increase in the average cation radius as some of the cations in the perovskite are reduced in valence when oxygen ions are removed from the structure.     

Effect of powder painting procedures on the filiform corrosion of aluminium profiles

In this work, the filiform corrosion behaviour of powder painted aluminium profiles was studied, and the coating barrier properties together with adhesion to the substrate were analysed. Samples coated with a traditional painting procedure (one powder layer application followed by curing), and other samples coated using a special cycle to obtain wood grain effect were compared using accelerated filiform corrosion tests. Moreover, in order to better understand the degradation mechanisms of painted metal substrates, thermal stresses were applied to accelerate the natural weathering. The effects of the thermal aging were analysed by electrochemical impedance spectroscopy.     

6m焦炉投产初期的热工管理

简要介绍焦化厂6m焦炉投产一年多以来的生产现状，整改措施和焦炉热工管理。     

Molecular simulation of temperature-programmed desorption

We use accelerated molecular dynamics to probe the thermal desorption of n-alkanes from the Au(1 1 1) and C(0 0 0 1) surfaces. Studying an alkane series ranging from CH₄ to C₁₆H₃₄, we find that the desorption prefactor increases with increasing chain length for the short chains until a certain chain length is reached when it becomes essentially constant and independent of chain length. We can understand the dependence of the preexponential factor on alkane chain length in terms of conformational changes within the alkane molecules. For the shorter molecules, the desorption temperatures probed in experimental temperature-programmed desorption studies lie below those for which torsional motion is activated. Thus, the short alkanes can be treated as rigid rods, and the loss in translational and rotational entropy upon adsorption leads to a preexponential factor that increases with increasing chain length. As the alkane chain length increases, the binding energy and the experimental desorption temperatures also increase. Thus, torsional motion is activated to an extent that increases with increasing chain length. This torsional activation increases the entropy of adsorption and counteracts the entropy decrease due to a loss of translation and rotation. This leads to a virtually constant prefactor for sufficiently long chains. Our findings are consistent with experimental data for the thermal desorption of alkanes from the Au(1 1 1), Pt(1 1 1), MgO(1 0 0) and C(0 0 0 1) surfaces.     

NUMERICAL ANALYSIS AND EXPERI- MENT OF UNSTEADY THERMAL FIELD OF ROTOR PLATE FOR EDDY CURRENT RETARDER

The physical model based on heat transfer theory and virtual boundary method for analyzing unsteady thermal field of rotor plate for eddy current retarder used in automobile is established and boundary conditions are also defined. The finite element governing equation is derived by Galerkin method. The time differential item is discrete based on Galerkin format that is stable at any condition. And a new style of varying time step method is used in iteration process. The thermal field on the rotor plate at the radial and axle directions is analyzed and varying temperature at appointed points on two side-surfaces is measured. The testing and analytical data are uniform approximately. Finite element method can be used for estimating thermal field of the rotor plate at initial design stage of eddy current retarder.     

Investigation of structural properties of ITO thin films deposited on different substrates

The influence of the substrate nature on the structure and morphology of ITO thin films grown by thermal evaporation in vacuum is investigated. The as-prepared metal films with Sn/In molar ratio of 0.1 were subsequently annealed for 2 h at 723 K in air (to obtain tin doped indium oxide), then annealed in vacuum at 523 K, followed by UV irradiation (to reduce the electrical resistivity). Irrespective of substrate nature, XRD data evidence a (222) preferential orientation in films. Substrate nature, annealing in vacuum and UV irradiation influence the structure, morphology, optical, electrical and surface wetting properties of the films' surface.     

Kinetic Studies of the Thermal Decomposition of C60H2 in Solution

Thermal decomposition of C₆₀H₂ in C₆D₄Cl₂ solution at 236°C for 2 hours was shown to produce hydrogen as a product, the hydrogen production was successfully followed by NMR. In order to further explore the rule of thermal decomposition of C₆₀H₂, the dynamics of decomposition reaction was studied and the results showed this decomposition reaction accorded with first order reaction dynamical equation. The experiment temperature was ranged separately in 459K, 455K, 451K, and 446K.     

Influence of Ni Interlayers on the Mechanical Properties of Ti6Al4V/(WC-Co) Friction Welds

Ni interlayers were introduced prior to dissimilar friction welding of Ti6Al4V base material to three cemented carbide substrates. The fracture strength of Ti6Al4V/(WC-6 wt% Co) welds were poor and were markedly improved when 20-µm thick Ni interlayers were introduced prior to dissimilar friction welding. These results were only produced when the (WC-6 wt% Co) cermet was electroplated prior to friction welding. When the Ti6Al4V alloy was electroplated prior to friction welding, fractured WC particles and cracking were observed in the (WC-Co) carbide substrate. The fracture strengths of Ti6Al4V/(WC-11 wt% Co) and Ti6Al4V/(WC-24 wt% Co) welds were not improved when 20-µm thick Ni interlayers were introduced prior to friction welding. During mechanical testing, the Ni layer retained at the dissimilar joint interface created a region of weakness.     

CBGA组件热变形的2D-Plane42模型有限元分析

本文介绍有限元中的2D-Plane42模型在CBGA组件热变形中的应用，利用有限元的模拟CBGA组件的应变、应力的分布，通过模拟表明有限元法是研究微电子封装中BGA焊点、CBGA组件的可靠性的方法。