高厚径比盲孔电镀

盲孔能够大大的增加板的密度,从而减小板面积。介绍了有关高厚径比盲孔电镀的有关工艺,从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。     

激光直写布线技术的现状与展望

本文归纳了激光直写布线技术的特点,重点综述了该技术在电子线路板的应用及在国内外发展的现状,并展望了激光直写技术的应用前景。     

Fe-Ni-P合金改性空心微珠及吸波性能研究

采用化学镀的方法制备了表面包覆Fe-Ni-P合金的空心微珠,研究了制备方法及条件对空心玻璃微珠表面改性的影响,并对其吸波性能进行了测试.实验结果表明,空心玻璃微珠表面镀层中铁、镍的质量分数分别为30.1%和63.2%,在频率为16.80 GHz处,涂层的反射衰减可达-18.20 dB,且在12.5 ～18.00 GHz频段范围内,反射衰减皆低于-10.00 dB.     

Low Resistance Contacts to p-CulnSe2 and p-CdTe Crystals

Room temperature formation of ohmic contacts by electroplating gold on chemically treated surfaces of p-CuInSe₂ and p-CdTe single crystals is reported. The effect of Br₂/methanol and KOH+KCN+H₂O treatments prior to plating was analyzed in the case of CuInSe₂. It is shown that the former treatment yields better ohmic contacts, with lower contact resistance, than the latter. While annealing these contacts made them highly non-ohmic, the method gives reasonably ohmic contacts on surfaces, that were purposely oxidized prior to contact preparation. In the case of p-CdTe stable, low resistance ohmic contacts were obtained at room temperature by electrochemical diffusion of Hg from solution, prior to gold plating. The treatment forms a highly degenerated p^+- HgCdTe layer. The contacts, which have a very low contact to bulk resistivity ratio, were further improved by vacuum annealing.     

A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric

To realize embedded resistors on multilayer benzocyclobutene (BCB) either on-chip or on-board, a low-cost large format electroless process for deposition of NiP and NiWP thin-film resistors using both low-temperature (25°C) and high-temperature (90°C) baths has been developed. The electroless process exhibits uniform resistor thickness in the submicron range and offers low profile and excellent adhesion to the BCB dielectric layer. The resistor films also act as a seed layer for direct electroplating of copper traces. The NiP alloys can also be tailored to a variable temperature coefficient of resistance (TCR) with different alloy compositions. The electroless process can be adopted in the PCB manufacturing industries with no additional investment. This article is the first report on electroless plated thin film resistors on low loss BCB dielectric.     

镀铜石墨-银基复合材料的制备与性能研究

用化学镀方法对粒度<30μm的石墨粉进行表面镀铜处理。将镀铜石墨粉与银粉用粉末冶金法制备成镀铜石墨一银基复合材料,对其密度、电阻率、硬度、抗弯强度和摩擦磨损性能进行测试,并与相同石墨含量的银-石墨复合材料进行对比。结果表明,镀铜石墨-银基复合材料具有低的电阻率和摩擦因数,以及高的硬度、抗弯强度和耐磨性。     

导通孔电镀铜填充技术

概述了下一代PCB用镀铜层导通孔填充技术。     

适合批量生产的GaAs数字IC背面金属化工艺

当前,IC逐步向高集成度、高密度、多功能方向发展,管芯尺寸也在增大;剪切力是器件考核的基本项目,随管芯面积的增大而增大,这就对背面金属化可靠性提出了较高的要求.本文通过分析、实验、分析改进的方法,提出了适合批量生产又兼顾成本因素的数字背面金属化工艺,使背面金属化性能满足了器件可靠性要求.     

电镀废液回收铜粉的化学镀银工艺及其电磁屏蔽性能

采用高频超声脉冲电解法从电镀铜废液中回收制备枝晶状的铜粉,并在铜粉表面进行化学镀银以制备电磁屏蔽用银包铜粉,采用SEM、EDS、XRD、TEM等对其进行形貌和组分分析,研究了银包铜粉复合涂层的导电性能和电磁屏蔽性能。结果表明,经过表面化学镀银可以有效地避免铜粉的氧化;涂层的电磁屏蔽性能与银包铜粉的添加量紧密相关,当涂层中银包铜粉质量分数为60%时,其电磁屏蔽效率高达52 dB。     

利用镀液组成改善镀层厚度均匀性

概述了利用CuSO4镀液组成控制PCB的贯通孔镀层均匀性和导通孔填充镀层均匀性。