单壁碳纳米管的制备及生长特性研究

采用Fe/MgO作为催化剂 ,催化裂解CH4制备了较纯的单壁碳纳米管 ,用TEM和Raman对碳纳米管进行了表征 ,对不同生长温度下制备的碳纳米管Raman径向呼吸振动峰 (RBM)进行了分析 ,研究了生长温度对单壁碳纳米管生长特性和结构特性的影响     

钕电解阳极过电位的测定

用慢扫描示波法测定了钕电解的阳极过电位 .考察了温度、阳极电流密度、Nd2 O3添加量、电解质组成等因素对阳极过电位的影响 ,探讨了降低阳极过电位的可能途径 .结果表明 ,阳极过电位随阳极电流密度的增加而增大 ,随温度的升高而减小 ,一定范围内 ,阳极过电位与阳极电流密度的对数呈线性关系 ,满足塔菲尔方程 ;电解质中LiF和Nd2 O3浓度增加 ,阳极过电位降低 ;适当控制阳极电流密度、升高温度、增加电解质中LiF和Nd2 O3的浓度并尽可能减小极间距 ,均有利于降低阳极过电位     

Powder Deposition in Three Parallel-Oriented Dies of Different Shapes

Uniformity of bulk density distribution during the die filling process is required to minimize quality problems, such as distortion and cracking, for powder compacts. Understanding the die filling process is necessary in ensuring a uniform powder deposition. The second-generation pressure deposition tester (PDT-II) was used to investigate the deposition process and final pressure distribution of powder filling in toroidal, cylindrical, and E-shaped dies. All tests were conducted using a spray-dried free-flowing granular powder. The results indicated that for toroidal dies: (1) the area around 0° orientation (the leeward end) had the highest pressure values (1186.7 to 2498.0 Pa), with the average pressure values of the remaining area 353.7-648.0 Pa; (2) the pressure distribution was symmetrical about the centerline parallel to the feed shoe movement direction; (3) the highest feed shoe speed (500 mm/s) led to the most nonuniform pressure distribution among the three speeds; (4) higher feed shoe speed did not always result in higher final pressure values; and (5) the right die tended to have higher final pressure values (215.0 to 2498.0 Pa) than the center die (95.4 to 2052.5 Pa). For E-shaped dies: (1) the final pressure values of the middle leg (308.9 to 760.7 Pa) were higher than those of the left and the right legs (148.9 to 530.3 Pa); (2) the area along the backside had the highest final pressure value (1054.6 to 1303.8 Pa); (3) the pressure distribution was symmetrical about the centerline parallel to the feed shoe movement direction; and (4) neither the center die nor the right die always had higher pressure values than the other one at all locations. Comparison between cylindrical and toroidal dies indicated that: (1) neither of the two die shapes (cylinder and toroid) led to consistently higher or lower final pressure values at all locations and (2) for all three feed shoe speeds, the toroidal die had higher average final pressure values in the 0° orientation.     

The process window for diamond deposition from the vapor phase with sulfur in the C–H–O feed gas mixtures

Theoretical predictions using a modified radical species ternary diagram for C–H–O system indicate that addition of sulfur expands the C–H–O gas phase compositional window for diamond deposition. Sulfur addition to no-growth domain increases the carbon super-saturation by binding the oxygen and the addition of sulfur to the non-diamond domain reduces the heavy carbon super-saturation by decreasing C_nH_m species concentration in the gas phase. The overall effect of sulfur addition to gas phase mixtures is characterized as that of oxygen addition to the C–H system, i.e. expansion of the compositional window over which diamond can be deposited from the gas phase. In addition, the increasing sulfur concentration to diamond domain feed gases beyond 2000 ppm did not affect the steady state gas phase composition but the quality of diamond was reduced.     

金刚石薄膜中晶粒尺寸的研究

扫描电子显微研究表明，化学汽相沉积的金刚石薄膜中晶粒大小比较均匀。但随着沉积时间和薄膜厚度的增加，晶粒逐渐变大，且每一层内，存在少量的大金刚石颗粒，讨论了晶粒尺寸变化和大晶粒形成的原因和机制。     

Silver Electrodeposition from Photographic Processing Solutions

This paper describes the parameters that are important in the industrial practice of silver removal from photographic fixers. The experiments were performed under potentiostatic control using synthetic solutions. The current efficiency was analysed as a function of the cathodic potential taking into account the deposit quality. A cathodic potential of ?0.5 V against a saturated calomel electrode is recommended. The conditions to prevent the darkening of the electrodeposit were investigated. The determination of silver concentration in the solution was made by direct potentiometry. The results obtained with synthetic fixers were corroborated by making the silver deposition from commercial fixers in an electrochemical reactor with rotating cylinder electrode intercalated in an electrolytic flow circuit in order to simulate practical conditions.     

石英晶体监控法镀制高精度光学薄膜

讨论了石英晶体监控法在光学薄膜镀制过程中的应用原理。通过与常规的光学监控法镀制的膜层相比较．证实了石英晶体监控法有助于提高光学薄膜的光学品质。试验表明所镀膜层的光学性能优异，在光通信和激光器等领域具有广阔的应用前景。     

Deposition mechanisms in langmuir-blodgett films

As part of a study of the possible application of polymerisable Langmuir-Blodgett (LB) films as ultra-fine-line e-beam resists, an investigation of the variation of film structure of 22-tricosenoic acid with differing deposition conditions has been made. Unexpected effects with significant implications for deposition speed and resist sensitivity have been observed, and the new techniques for film characterisation developed during the investigation have resulted in a revised model of deposition explaining the observed independence of the disorder causing optical scattering and the macroscopic features observed by polarised microscopy.     

Formation of low-resistivity poly-Si and SiNx films by Cat-CVD for ULSI application

In this paper, bulk-Si metal–oxide–semiconductor field effect transistors (MOSFETs) are fabricated using the catalytic chemical vapor deposition (Cat-CVD) method as an alternative technology to the conventional high-temperature thermal chemical vapor deposition. Particularly, formation of low-resistivity phosphorus (P)-doped poly-Si films is attempted by using Cat-CVD-deposited amorphous silicon (a-Si) films and successive rapid thermal annealing (RTA) of them. Even after RTA processes, neither peeling nor bubbling are observed, since hydrogen contents in Cat-CVD a-Si films can be as low as 1.1%. Both the crystallization and low resistivity of 0.004 Ω·cm are realized by RTA at 1000 °C for only 5 s. It is also revealed that Cat-CVD SiN_x films prepared at 250 °C show excellent oxidation resistance, when the thickness of films is larger than approximately 10 nm for wet O₂ oxidation at 1100 °C. It is found that the thickness required to stop oxygen penetration is equivalent to that for thermal CVD SiN_x prepared at 750 °C. Finally, complementary MOSFETs (CMOSs) of single-crystalline Si were fabricated by using Cat-CVD poly-Si for gate electrodes and SiN_x films for masks of local oxidation of silicon (LOCOS). At 3.3 V operation, less than 1.0 pA μm⁻¹ of OFF leakage current and ON/OFF ratio of 10⁷–10⁸ are realized, i.e. the devices can operate similarly to conventional thermal CVD process.