Laval型雾化器气液流动特性研究

喷嘴出口气流速度和气液质量流率比是影响液态金属雾化效果的两个主要因素。为改善雾化效果,对现有环缝型雾化器进行改进,出口采用Laval型。建立了喷嘴出口速度、气体与金属质量流率的表达式,获得稳定气、液质量流率比的坩埚背压与金属液面高度的关系。通过实验方法建立了采用限制型Laval喷嘴导流管出口负压值与雾化压力之间的关系。     

火箭喷管两相流动性能计算公式

为方便应用两相流动模型对火箭发动机进行性能预示以及提高性能预示精度,利用火箭喷管内的一维两相流动的数值计算数据,通过对火箭喷管一维两相流动参数与纯气相流动变化规律的对比计算与分析,得到火箭喷管在两相流动下的性能(包括质量流量、排气速度和压强比)计算公式.该计算公式考虑了两相流动中所有的因素,如比热比、凝聚相尺寸、凝聚相百分比,甚至喷管尺寸等,具有广泛的适应性.利用这些公式与理论计算结果进行了对比,结果表明其理论预示精度达到千分位至万分位,并使得两相流动模型在火箭发动机中的应用分析得到简化,有利于提高火箭发动机性能的预示精度.     

隔离槽深度对面阵探测器热应力影响研究

热冲击下InSb面阵探测器的成品率制约着其适用性。为了解光敏元隔离槽深度对InSb芯片中热应力的影响,针对典型器件结构,借助ANSYS软件,分析了隔离槽深度对InSb芯片、底充胶和硅读出电路中Von Mises应力的影响。模拟结果表明:随着隔离槽深度的增加,InSb芯片上的热应力起初缓慢增加,之后增加速度越来越快,当隔离槽深度超过8μm后,InSb芯片上的热应力陡峭上升。对硅读出电路和底充胶来说,在热冲击下累积的热应力似乎与隔离槽深度无关,分别在370 MPa和190 MPa左右浮动。当隔离槽深度取4μm时,整个器件的热应力较小、且分布均匀,能够满足光学串扰及结构可靠性设计的需求。     

固体燃料超燃冲压发动机燃烧室的数值仿真

基于一种固体燃料超燃冲压实验发动机的实验数据,使用数值模拟软件分别对超燃冲压发动机燃烧室的初始状态以及启动后的燃烧流动进行数值模拟。采用用户自定义函数方式给定PMMA燃料进口边界。数值模拟结果显示:燃烧室流场特性分布符合理论分析;燃烧室固体燃料壁面的燃料退移速率与实验数据有一定差异,但是整个燃面沿轴向的燃速分布规律与实验值近似;沿轴向的燃面附近的压力分布与实验结果较为吻合。研究结果表明:该数值计算模型较为合理,对固体燃料超燃冲压发动机的理论研究具有一定参考价值。     

药厂净化空调系统几个问题的分析

对药厂净化空调系统中的空气处理流程、气流组织形式、除尘系统及室内压力控制等几个方面的问题,从理论和实践两个方面做了比较详细的论述分析,并提出了推荐方案。     

复杂流场的激光—超声测试方法及原理性实验研究

本文从复杂流场-旋涡场参量的激光-超声测试方法的需要出发,论述了超声波产生的声位相光栅对激光产生的衍射及偏转特性。在水中进行了声光偏转等试验,测出了产生声光偏转时折射率的变化及声压变化,从而估算出空气复杂流场激光——超声方法所需的超声频率及能量,为实现空气流场激光——超声无接触测试的研究提供了依据。     

The effects of etching and deposition on the performance and stress evolution of open through silicon vias

The effects of silicon etching using the Bosch process and LPCVD oxide deposition on the performance of open TSVs are analyzed through simulation. Using an in-house process simulator, a structure is generated which contains scalloped sidewalls as a result of the Bosch etch process. During the LPCVD deposition step, oxide is expected to be thinner at the trench bottom when compared to the top; however, additional localized thinning is observed around each scallop. The scalloped structure is compared to a structure where the etching step is not performed, but rather a flat trench profile is assumed. Both structures are imported into a finite element tool in order to analyze the effects of processing on device performance. The scalloped structure is shown to have an increased resistance and capacitance when compared to the flat TSV. Additionally, the scalloped TSV does not perform as well at high frequencies, where the signal loss is shown to increase. However, the scallops allow the TSV to respond better to an applied stress. This is due to the scallops’ enhanced range of motion and displacement, meaning they can compensate for the stress along the entire sidewall and not only on the TSV top, as in the flat structure.     

Risk and reliability assessment about a manufacturing issue in a power MOSFET for automotive applications

In the automotive semiconductor industry, risk assessments are requested by customers on quality incidents that happen in the assembly line or in field. More rarely, in a die business context, such a study is requested about a defect observed during the optical inspection performed by the customers on the known good dice after assembly. This article deals with the case of pin holes in the top metal surface of a MOSFET component. The risk assessment is addressing detection, occurrence and severity of the defect: this implies process and failure analysis. Also, reliability has been carried out, by completing accelerated and typical stress tests.     

应力波在多层介质中传播特性数值分析

通过与相关文献结果的对比,在验证了数值模拟应力波传播可行性的基础上,比较了应力波通过3层花岗岩和夹层为泡沫铝的3层介质后,发现后者应力波幅值的衰减远大于前者,应变能增加为前者的1．6倍,证明了软夹层在研究的速度量级上对能量耗散具有显著作用;在入射波波长为3层介质总厚度1／2的条件下,当泡沫铝的厚度占总厚度约0．2时,得出了3层介质的应变能约为系统总能量的60％,此时入射波波长为泡沫铝厚度的2．5倍,组合介质获得较佳的衰减性能．     

基于图像处理的颗粒流动层模型研究

如何方便且准确地测量滚筒中颗粒的运动速率分布是研究的难点。文中将给出一种基于数字图像处理算法的实验方法来解决此难题。通过找到最合适的极短曝光时间,可捕获在此曝光时间内颗粒运动轨迹的图像,然后利用数字图像处理算法计算出感兴趣区域的颗粒运动路程,即可计算出颗粒的运动速率分布。通过精确的实验数据分析可看出,本实验方法与理论仅有＜8%的误差,有力证实了通过图像法测量颗粒速率分布可展开有效的研究工作。