EDA介质快慢横波时差和振幅-方位曲线的实验分析

在含垂直定向裂隙的各向异性（EDA）介质中，地震快、慢横波传播的时差及振幅随裂隙（缝）方位变化曲线能反映裂缝的密度、走向和介质的性质，这对多波地震资料的处理、解释有着重要意义。但受观测条件限制以及噪声的影响，在横波分裂记录上，同相轴往往会出现扭曲、倾斜和不规则抖动等现象，给快、慢横波时差的求取和振幅-方位曲线的绘制带来误差。设计了EDA介质物理模型，并利用岩石超声波测量系统获得了快、慢横波记录；分析记录可知，在相同传播方向的分裂横波具有走时和传播速度不随裂缝方位变化的恒定性特征；以此为基础，提出了利用平均法和瞬时振幅法来计算快、慢横波的走时时差和绘制振幅-方位曲线，以提高精度。利用物理模型实验得到的2个正交横波（S1波与S2波）的快、慢横波记录，分别用平均法和瞬时振幅法计算了快、慢横波走时的平均值、时差和均方差，并绘制了相应的振幅一方位曲线。结果表明，采用上述2种方法，消除了同相轴扭曲、倾斜和不规则抖动等对计算结果的影响，时差的计算是可靠的，振幅一方位曲线的绘制是合理的。     

基于地面传感器的低空目标跟踪算法研究

研究了用地面声阵列传感器进行低空飞行目标跟踪问题。采用了3种类型的关联门,即初始波门、小波门和中波门,使用Kalman滤波算法来实现对方位角的跟踪。充分考虑声音传播的延时,进行传感器的方位角数据匹配,计算目标的位置。通过判断上报方位信息的各传感器是否在同一有效探测范围内,降低了计算量。仿真结果表明,该低空飞行目标数据融合算法是有效的。     

基于裂缝柔度和地应力模型的声电测井正、反演方法及应用

电阻率成像探测深度通常为几厘米,超声波成像数据也只能提供井壁的声幅或到时图像。因此,很难评估井壁张开裂缝在地层中的分布情况。声波测井一般应用弹性各向异性表征地应力场和裂缝特性等,通常岩石的固有各向异性、高角度地层层面、裂缝或不平衡应力挤压等都可以导致弹性波表观各向异性,因此往往难以判断各向异性的成因。前人针对单一方位二维裂缝模型进行了声波正演模拟,但不适用于井筒含多组任意方位裂缝介质的弹性波模拟。为此,首先拾取井壁成像测井中导致声波表观各向异性的三类结构特征(天然裂缝、层面缝(或薄层)和钻井应力诱导缝)信息,同时定量化层理结构信息(如倾向、方位等),并将裂缝分层、分组;然后从声波全波列中提取地层的快、慢横波慢度及各向异性方位;接着在岩石和裂缝信息井壁成像建模基础上,通过裂缝附加柔度模型、层面伪裂缝模型和非线性应力场弹性波动理论正演模拟岩石的声波属性;最后通过对比声波速度及各向异性方位等信息的模型预测结果与实测结果,利用最小误差拟合反演确定井壁图像表征的裂缝类型与各向异性的成因,并对比、分析了频散曲线特征。将所提方法应用于花岗岩潜山裂缝型气田生产测试井以验证方法合理性,实际模拟结果表明：...     

Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad

Eutectic solder balls (63Sn-37Pb) joined to Cu pads with an Au/Ni metallization have been widely used in wafer-level chip-size package (WLCSP) technology for providing electrical and mechanical interconnections between components. However, some reliability issues must be addressed regarding the intermetallic compounds (IMCs). The formation of a brittle IMC layer between the solder/Cu pad interface impacts considerably upon the solder-ball shear strength. In addition, it will degrade the long-term operating reliability of the WLCSP. This study investigates, by means of experiments, the growth of the IMC layer under isothermal aging for the eutectic Sn-Pb solder reflowed on a Cu pad with an Au/Ni metallization. Forming the Cu pad with an Au/Ni metallization was achieved by a simple semiconductor-manufacturing process. The effects of the intermetallic layer on solder-ball shear strength were examined for various parameters, including the thickness of the Au layer, solder-ball size, and the diameter of the Cu pad. Experimental results indicate that two IMC layers, Au_0.5Ni_0.5Sn₄ and Ni₃Sn₄, form at the solder/Cu pad interface after aging. The Au_0.5Ni_0.5Sn₄ intermetallic layer dominates the total thickness of the IMC layer and grows with aging time while the solder-ball shear strength decreases after aging. The degradation of the solder-ball shear strength was found to be caused mainly by the formation of the Au_0.5Ni_0.5Sn₄ layer. The experimental results established that a thinner Au layer on Cu pad can effectively control the degradation of solder-ball shear strength, and this is especially true for smaller ball sizes.     

钢桁架连梁-联肢剪力墙耗能机理及抗震性能试验研究

对设置全钢桁架连梁和设置钢筋混凝土、钢桁架混合连梁的双层联肢剪力墙平面结构进行了拟动力试验和低周反复荷载试验,研究了不同工况地震波作用下剪力墙的时程响应,以及其破坏机理、承载力、滞回延性性能、耗能机理、刚度及强度退化机理。试验结果表明：全部设置钢桁架连梁的剪力墙的刚度分布合理,耗能机理及刚度强度退化机理符合联肢剪力墙抗震设计的要求。大震时,在保证较高耗能能力的同时能够维持较高的承载力和刚度,持续约束墙肢,抗震性能优于混凝土连梁联肢剪力墙体系,是一种较理想的连梁设置方案。     

温8区块复合深部调驱体系的制备与评价

针对温米油田温8区块油藏地质条件,采用水驱流向改变剂／弱凝胶复合深部调驱技术。选用粒径为3～5mm水驱流向改变剂2^#用于复合调驱体系;并研制了适合该油藏条件的弱凝胶体系,确定了其最佳配方：聚合物HPAM浓度1000～1500mg／L,交联剂FO浓度300mg／L,交联剂GR20mg／L,稳定剂WD浓度100mg／L,除氧剂CY浓度100mg／L。通过岩心流动实验,评价水驱流向改变剂／弱凝胶复合深部调驱体系对吸水剖面的改善能力。结果表明,该复合调驱体系可大幅提高吸水剖面改善率,适用于温8区块的调驱作业。     

透明聚丙烯流变行为研究

分别考察了自主研制、进口、国产透明聚丙烯(PP)专用料ZPP,R 370 Y,J 301 G的流变行为.结果表明,ZPP,R 370 Y和J 301 G熔体均属于非牛顿型假塑性流体;R 370 Y专用料对温度的敏感性较大.成型加工时宜进行温度调整;ZPP和J 301 G专用料对剪切敏感性较大,成型加工时宜进行剪切速率或剪切应力的调整;透明PP专用料的相对分子质量及其分布对其表观黏度有一定影响;ZPP的各项力学性能均优于S 800型通用PP.     

小波不变矩的低空风切变识别

针对微下击暴流、低空急流、顺逆风以及侧风低空风切变样本图像间的形状特性关系,主要研究了小波不变矩的特征提取技术在风切变识别中的应用.首先,采用基于三次B样条的小波不变矩提取风切变图像的形状特征.然后,将提取的特征通过Fisher线性判别分析(LDA)降低维数,实现风切变有效特征的提取.最后,采用三阶近邻分类器分类识别四种低空风切变.实验结果表明,该算法与应用Hu矩和Zernike矩特征进行分类识别相比,识别结果更加稳定,且平均识别率得到了较大提高,能够有效用于风切变图像的类型识别中.     

数模混合飞控系统在小型无人飞行器上的应用

叙述了小型无人飞行器的数模混合纵向控制原理,重点阐述了控制电路的设计和电路参数的选取原则．     

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu₆Sn₅ particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu₆Sn₅ precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.