金刚石钻磨头超声振动钻磨硬脆材料表面质量的试验研究

硬脆材料以其优良的性能在生产实践中得到了广泛应用，但其低塑性、易脆性及不导电性等使得加工十分困难，尤其是超精密表面制作更加困难。为此，本文将超声振动引入普通钻磨中，介绍了超声振动切削原理，通过超声与普通两种方式下的表面粗糙度试验和微观形貌观察得出以下结沦：1）不同加工参数时，超声振动钻磨时的工件表面粗糙度值均低于普通钻磨时的表面粗糙度值；2）随着进给量、工件转速和输入功率的增加，超声和普通钻磨时的表面粗糙度均呈上升趋势；3）普通钻磨加工后孔壁表面有宽度和间距不均匀的沟槽，并且沟槽较宽，而超声钻磨加工后表面沟槽（划痕）较浅且均匀。     

金刚石圆锯片节块几何形状对磨损机理的影响

本文对目前石材加工领域广泛使用的具有几种典型节块结构的金刚石圆锯片的磨损机理进行了一些分析。讨论了节块几何形状和排列方式对锯片磨损的影响程度,并比较了从外观结构出发制造中凹与单纯从配方的角度制造中凹的优缺点。最后从切削加工的角度对改进金刚石圆锯片的质量提出了一些建议。     

提高伺服飞锯机定尺精度的方法

本文叙述了提高伺服飞锯机定尺精度所采用的两种方法,这两种方法目前都已应用在实际生产中,伺服飞锯机的定尺精度高于国际上通用的标准.     

数学处理在数控铣削中的应用

用数控铣床加工机械零件时,由于铣削方法或铣削刀具等工艺条件的限制,对于由直线、圆弧、非圆曲线、空间曲线和曲面等组成的轮廓曲线必须进行相应的数学处理,合理安排工艺路线,才能进行数控编程,加工出与设计要求相符的图形形状.     

混合室分配板成形工艺及模具设计

对混合室分配板零件介绍了一种落料拉伸成形和立体切沿分割的工艺思路以及模具结构和相关的理论计算 ,在实际应用中获得了好的效果。对同类形状产品 ,尤其是涉及到需要进行立体切沿分割的制件 ,可提供借鉴。     

曲轴斜油孔钻削头设计

曲轴的各轴颈在很高的比压下作高速旋转运动,使轴颈和轴承受到强烈磨擦.为保证曲轴轴承工作可靠,曲轴上必须设置可靠的润滑油道,将润滑油送到轴承磨擦表面上去.此油道属细长孔,且于轴线成一定的角度.本文介绍的是一种曲轴斜油孔钻削头的设计、结构和原理等,动用了两个电磁离合器,使得一根钻削头在工作时,另一根钻削头停止旋转,避免不必要的空转功率消耗;该设备用于生产后,实践证明,运行可靠,操作方便,满足了生产需要.     

Machining characteristics and fracture morphologies in a copper-beryllium (Cu-2Be) alloy

The technology of materials removal is improved greatly by the introduction of advanced cutting tools like cubic boron nitride, ceramics, polycrystalline diamond and the more recent whisker-reinforced materials. In this paper, the influence of cutting temperature on machinability, mechanical properties, microstructure, and fracture morphology of Cu-2Be alloy using a polycrystalline diamond cutter is investigated. The information on machining, microstructure, and fracture morphology of Cu-2Be alloy are very useful to understand their fabrication characteristics and the basic mechanisms of its deformation and fracture. The machinability (in terms of surface finish) of Cu-2Be alloy is evaluated as a function of cutting temperature, resulting from wet and dry cutting. Machining is carried out on a Hardinge Cobra 42 CNC machine (Hardinge Inc., Elmira, NY), and the machining parameters used—cutting speed, depth of cut, and feed rate—are kept constant during both wet and dry cutting. The machined surface finish on Cu-2Be alloy is measured using a surface finish analyzer (Surftest 401, series 178) technique. The machined specimens are examined for their strength and hardness properties using a standard Universal Testing Machine and Rockwell hardness tester, respectively. Wet cutting (using coolants) produced a smooth surface finish when compared with dry cutting of the Cu-2Be alloy. The machined specimens are examined for their microstructural features using a Nikon optical microscope. The specimens are etched using a suitable etchant solution for revealing such microstructure constituents as grain size, phase proportions, and the possible overheated areas (especially in dry cutting). The fractured surfaces from the tensile and impact toughness tests are investigated for their fracture morphologies (dry and wet cutting) using a microprocessor-controlled scanning electron microscope (Jeol Model JSM 5910 LV). A detailed analysis is also made to understand and interpret the basic fracture mechanisms responsible for crack initiation and crack propagation. The Cu-2Be alloy showed relatively higher mechanical properties in wet cutting in comparison to dry cutting operations. Fracture studies demonstrated intergranular and ductile fractures as dominant modes of fracture mechanisms in Cu-2Be alloy.     

激光焊接的裁焊板及其在汽车中的应用

介绍了激光焊接用于汽车裁焊板的新技术。使用裁焊板可以实现汽车部件尺寸和材质的优花配合。与滚压缝焊相比，激光焊接具有焊接质量高、适应性广、生产费用和维护费用低的优点，特别适合进行裁焊板的焊接加工。激光焊接裁焊板的技术问题主要有：采用激光切割坯板方案的可行性、接头的成形性、焊接质量的控制和大板拼接变形的控制。     

Micro-end-milling of single-crystal silicon

Ductile-regime machining of silicon using micro-end-mill is almost impossible because of the brittle properties of silicon, crystal orientation effects, edge radius of the cutter and the hardness of tool materials. Micro-end-milling can potentially be used to create desired three dimensional (3D) free form surface features using the ductile machining technology for single-crystal silicon. There is still a lack of fundamental understanding of micro-end-milling of single-crystal silicon using diamond-coated tool, specifically basic understanding of material removal mechanism, cutting forces and machined surface integrity in micro-scale machining of silicon. In this paper, further research to understand the chip formation mechanism was conducted. An analysis was performed to discover how the chips are removed during the milling process. Brittle and ductile cutting regimes corresponding to machined surfaces and chips are discussed. Experiments have shown that single-crystal silicon can be ductile machined using micro-end-milling process. Forces generated when micro-end-milling single-crystal silicon are used to determine the performance of the milling process. Experimental results show that the dependence of the cutting force on the uncut chip thickness can be well described by a polynomial function order n. As cutting regime becomes more brittle, the cutting force has more complex function.     

Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

In cutting of brittle materials, experimentally it was observed that there is a ductile–brittle transition when the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius of the zero rake angle. However, how the crack is initiated in the ductile–brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has not been fully understood. In this study, the crack initiation in the ductile–brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has been simulated using the Molecular Dynamics (MD) method on nanoscale cutting of monocrystalline silicon with a non-zero edge radius tool, from which, for the first time, a peak deformation zone in the chip formation zone has been found in the transition from ductile mode to brittle mode cutting. The results show that as the undeformed chip thickness is larger than the cutting edge radius, in the chip formation zone there is a peak deformation depth in association with the connecting point of tool edge arc and the rake face, and there is a crack initiation zone in the undeformed workpiece next to the peak deformation zone, in which the material is tensile stressed and the tensile stress is perpendicular to the direction from the connecting point to the peak. As the undeformed chip thickness is smaller than the cutting edge radius, there is no deformation peak in the chip formation zone, and thus there is no crack initiation zone formed in the undeformed workpiece. This finding explains well the ductile–brittle transition as the undeformed chip thickness increases from smaller to larger than the tool cutting edge radius.