Thermophysical properties data on molten semiconductors

Thermophysical properties of molten semiconductors are reviewed. Published data for viscosity, thermal conductivity, surface tension, and other properties are presented. Several measurement methods often used for molten semiconductors are described. Recommended values of thermophysical properties are tabulated for Si, Ge, GaAs, InP, InSb, GaSb, and other compounds. This review shows that further measurements of thermophysical properties of GaAs and InP in the molten state are required. It is also indicated that a very limited amount of data on emissivity is available. Space experiments relating to thermophysical property measurements are described briefly.Nomenclature Density - C _p Specific heat - Kinematic viscosity - Dynamic viscosity= - Thermal diffusivity - Thermal conductivity=C_p - Volumetric thermal expansion coefficient - Surface tension - d/dT Temperature coefficient of surface tension - g Gravitational acceleration - T Temperature - T Temperature difference - L Characteristic dimension     

The need and prospects for improved fusion reactors

Conceptual fusion reactor studies over the past 10–15 yr have projected systems that may be too large, complex, and costly to be of commercial interest. One main direction for improved fusion reactors points toward smaller, higher-power-density approaches. First-order economic issues (i.e., unit direct cost and cost of electricity) are used to support the need for more compact fusion reactors. The results of a number of recent conceptual designs of reversed-field pinch, spheromak, and tokamak fusion reactors are summarized as examples of more compact approaches. While a focus has been placed on increasing the fusion-power-core mass power density beyond the minimum economic threshold of 100–200 kWe/tonne, other means by which the overall attractiveness of fusion as a long-term energy source are also addressed.Nomenclature a Plasma minor radius at outboard equatorial plane (m) - A Plasma aspect ratioR _T /a - AC Annual charges ($/yr) - b Plasma minor radius in vertical direction (m) - B Magentic field at plasma or blanket (T) - B _c Magnetic field at the coil (T) - B Toroidal magnetic field (T) - B Poloidal magnetic field (T) - BOP Balance of plant - C Coil - COE Cost of electricity (mills/kWeh) - CRFPR Compact RFP reactor - CT Compact torus (FRC or spheromak) - c _FPC Unit cost of fusion power core ($/kg) - DC Direct cost ($) - DZP Dense Z-pinch - E Escalation rate (1/yr) - EDC Escalation during construction ($) - ET Elongated tokamak - F Annual fuel charges ($/yr) - FC Component of UDC not strongly dependent or FPC size ($/kWe) - FW First wall - FPC Fusion power core - f _Aux Fraction of gross electric power recirculated to BOP - f ₁ (IC+IDC+EDC)/DC - f ₂ (O&M + SCR + F)/AC - IC Indirect cost ($) - IDC Interest during construction ($) - I _w Neutron first-wall loading (MW/m²) - i Toroidal plasma current (MA) - j Plasma current density, I/a² - k _B Boltzmann constant, 1.602(10)^–16 (J/keV) - LWR Light-water (fission) reactor - MPD Mass power density 1000P_E/M_FPC (kWe/tonne) - M _N Blanket energy multiplication of 14.1-MeV neutron energy - M _FPC Mass of fusion power core (tonne) - n Plasma density (m^–3) or toroidal MHD mode number - O&M Annual operating and maintenance cost ($/yr) - p _f Plant availability factor - PFD Poloidal field dominated (CTs, RFP, DZP) - P Construction time (yr) - P_TH Thermal power (MWt) - P _E Net electric power (1-)P _ET (MWe) - P_ET Total gross electric power (MWe) - p_f Fusion power (MW) - q Tokamak safety factor (B /B _gq )(a/R _T ) - q _e EngineeringQ value, 1/e - R _T Major toroidal radius (m) - RFP Reversed-field pinch - RPE Reactor plant equipment (Account 22) - S Shield - SCR Annual spare component cost ($/yr) - SSR Second stability region for the tokamak - S/T/H Stellarator/torsatron/heliotron - ST Spherical tokamak or spherical torus - T Plasma temperature (keV) - TDC Total direct cost ($) - TOC Total overnight cost ($) - UDC Unit direct cost,TDC/10 ³ P _E ($/kWe) - V _p Plasma volume (m³) - W _p Plasma energy (GJ) - W _B Magnetic field energy (GJ) - Magnetic utilization efficiency, 2nk_BT/(B ²/2₀) - ₀ Permeability of free space, 4(10)^–7 H/m - XE Plasma confinement efficiency, a²/4_E - _e Plasma energy confinement time - _p Overall plant efficiency, _TH(1-) - _TH Thermal conversion efficiency - _FPC AverageFPC mass density (tonne/m³) - Plasma vertical elongation factor,b/a - Thickness of allFPC engineering structure surround plasma (m) - Total recirculating power fraction, (P _ET-P _E)/P _ET, or inverse aspect ratioa/R _T This work was performed under the auspices of USDOE, Office of Fusion Energy.     

人群头发元素分布及某些特征研究

本文介绍用堆中子活化分析法测定人群头发中I、Br、Mg、Mn、Cu、Na、V、Cl、Al、Ca、S等11种元素。研究人发中元素分布特征、相关性特征、性别年令分布特征。方法学中还从法庭科学应用角度介绍同一性识别中差异率和重合几率的双判据方法。     

Properties and Microstructuresof Three Kinds of Silversheathed Bi-2223 Tapes

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THEORETICAL INVESTIGATION ON BY-ONLY-CURRENT ELECTROMAGNETIC SEPARATION OF INCLUSION FROM MOLTEN METALS

The electromagnetic field under applied AC and DC current in round and rectangular pipe was systematically investigated, then a concept of "equivalent current density" was proposed for evaluating the inhomogeneous electromagnetic pinch force, and the mono-component removal efficiency and the overall removal efficiency of inclusion were formulated. It is founded that flat pipe is superior to round pipe for the electromagnetic removal of inclusion, and DC current can get a higher removal efficiency than A C current due to absence of skin phenomenon. Under usual condition, a removal efficiency of 52% for 10μm inclusion or more than 92% for 20μm inclusion can be achieved by imposing a current density of 3×106A/m2 in a flat pipe.     

金品纯度的比重法测定

介绍了金品纯度的测定方法,推导出了比较实用的纯度计算、杂质估算和温度影响等几个表达式。     

Electronic struture of titanium silicides

ＥＬＥＣＴＲＯＮＩＣＳＴＲＵＣＴＵＲＥＯＦＴＩＴＡＮＩＵＭＳＩＬＩＣＩＤＥＳＬｏｎｇ，Ｘｉａｎｇｙｕｎ（ＤｅｐａｒｔｍｅｎｔｏｆＣｈｅｍｉｓｔｒｙ，ＣｅｎｔｒａｌＳｏｕｔｈＵｎｉｖｅｒｓｉｔｙｏｆＴｅｃｈｎｏｌｏｇｙ，Ｃｈａｎｇｓｈａ４１００８３）Ｃ...     

固溶处理对电解制备的A356合金硅颗粒的影响

以电解低钛铝基合金为原料制备了A356合金,研究了在535℃下固溶处理时间对合金共晶硅相细化、球化和分布的影响.测量了硅颗粒的长径和短径,计算了颗粒的直径和长短径比值等参数,分析了上述参数随固溶时间的变化及其概率密度分布.实验结果表明:由该电解合金制备的A356合金经2～4 h的固溶处理,共晶硅就可得到较好的细化和球化效果,具有较高的分布集中度;A356合金的固溶处理时间可有效缩短.     

台塑公司高密度聚乙烯专用树脂的开发策略

介绍了台湾塑胶工业股份有限公司高密度聚乙烯(HDPE)树脂的生产装置、工艺技术、生产能力、树脂牌号及新产品开发现状,同时阐述了HDPE专用树脂的开发策略。目前,台塑公司HDPE商品牌号台塑烯的产品包括薄膜专用树脂、中空吹塑专用树脂、挤出专用树脂和注塑等用树脂等,并且产品具有单峰、双峰甚至宽峰相对分子质量分布的特性。2006年,台塑公司将调整台塑烯专用树脂的生产比例,强化产品结构而维持一定的营利水平。     

Adhesion Mechanisms of Polyurethanes to Glass Surfaces I. Structure-Property Relationships in Polyurethanes and Their Effects on Adhesion to Glass

Polyurethanes were prepared from toluene diisocyanate (TDI), 1-4-butane diol (BDO) and polycaprolactone-based triols with varying molecular weights. Among each molecular weight triol-based urethane, hard segment content was varied from 20% to 70%. Differential scanning calorimetry, tensile testing, and Iosipescu shear testing were done on all the various urethanes prepared. Thermal characterization data revealed the dependence of phase separation on hard segment content as well as on the triol molecular weight. Tensile data and Iosipescu shear data further confirmed the observations made from the DSC data. The data further indicated that phase separation can greatly improve the modulus of cross-linked segmented urethanes. Adhesion of these urethanes to glass surface was evaluated using soda-lime float glass plate. Urethane samples were cast on the air side of the glass plates and adhesion was measured in shear mode. Adhesion data indicated that in addition to hard segment content, modulus, cross-link density, and molecular weight of the triols, phase separation seems to be a major factor in controlling adhesion. Surfaces of the failed adhesion samples were also analyzed and the failure mode was found to be cohesive, in varying degree, with the different urethane systems.