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41.
喻琼 《计算机光盘软件与应用》2011,(16)
本文以引进吸收再创新的模式,综合机器视觉技术、自动化技术和集群协作处理技术,研发“拉铆钉多参数实时在线视觉检测系统”。 相似文献
42.
It is well recognized that the impact-acoustic emissions contain information that can indicate the presence of the adhesive defects in the bonding structures. In our previous papers, artificial neural network (ANN) was adopted to assess the bonding integrity of the tile–walls with the feature extracted from the power spectral density (PSD) of the impact-acoustic signals acting as the input of classifier. However, in addition to the inconvenience posed by the general drawbacks such as long training time and large number of training samples needed, the performance of the classic ANN classifier is deteriorated by the similar spectral characteristics between different bonding status caused by abnormal impacts. In this paper our previous works was developed by the employment of the least-squares support vector machine (LS-SVM) classifier instead of the ANN to derive a bonding integrity recognition approach with better reliability and enhanced immunity to surface roughness. With the help of the specially designed artificial sample slabs, experiments results obtained with the proposed method are provided and compared with that using the ANN classifier, demonstrating the effectiveness of the present strategy. 相似文献
43.
给出一种基于图像信息估计被测浮球及其中心轴孔空间姿态的视觉检测方法.若相机焦距已知,且给定空间球与圆特征的形状参数,则可由单视方法估计该球心与圆特征中心位置及其法向方向.基于该算法,可实现对被测球体中心轴端面法线方向的估计,同时还可估计出被测球体及端面中心的位置,从而实现对目标浮球位置及姿态的非接触测量.数值仿真及实际图像处理结果表明了该算法的有效性. 相似文献
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In the process of aircraft assembly, there exist numerous and ubiquitous cable brackets that shall be installed on frames and subsequently need to be manually verified with CAD models. Such a task is usually performed by special operators, hence is time-consuming, labor-intensive, and error-prone. In order to save the inspection time and increase the reliability of results, many researchers attempt to develop intelligent inspection systems using robotic, AR, or AI technologies. However, there is no comprehensive method to achieve enough portability, intelligence, efficiency, and accuracy while providing intuitive task assistance for inspectors in real time. In this paper, a combined AR+AI system is introduced to assist brackets inspection in a more intelligent yet efficient manner. Especially, AR-based Mask R-CNN is proposed by skillfully integrating markerless AR into deep learning-based instance segmentation to generate more accurate and fewer region proposals, and thus alleviates the computation load of the deep learning program. Based on this, brackets segmentation can be performed robustly and efficiently on mobile devices such as smartphones or tablets. By using the proposed system, CAD model checking can be automatically performed between the segmented physical brackets and the corresponding virtual brackets rendered by AR in real time. Furthermore, the inspection results can be directly projected on the corresponding physical brackets for the convenience of maintenance. To verify the feasibility of the proposed method, experiments are carried out on a full-scale mock-up of C919 aircraft main landing gear cabin. The experimental results indicate that the inspection accuracy is up to 97.1%. Finally, the system has been deployed in the real C919 aircraft final-assembly workshop. The preliminary evaluation reveals that the proposed real-time AR-assisted intelligent inspection approach is effective and promising for large-scale industrial applications. 相似文献
48.
Shin-Min Chao 《Pattern recognition》2010,43(5):1917-6849
In this paper, an anisotropic diffusion model with a generalized diffusion coefficient function is presented for defect detection in low-contrast surface images and, especially, aims at material surfaces found in liquid crystal display (LCD) manufacturing. A defect embedded in a low-contrast surface image is extremely difficult to detect, because the intensity difference between the unevenly illuminated background and the defective region is hardly observable and no clear edges are present between the defect and its surroundings.The proposed anisotropic diffusion model provides a generalized diffusion mechanism that can flexibly change the curve of the diffusion coefficient function. It adaptively carries out a smoothing process for faultless areas and performs a sharpening process for defect areas in an image. An entropy criterion is proposed as the performance measure of the diffused image and then a stochastic evolutionary computation algorithm, particle swarm optimization (PSO), is applied to automatically determine the best parameter values of the generalized diffusion coefficient function. Experimental results have shown that the proposed method can effectively and efficiently detect small defects in various low-contrast surface images. 相似文献
49.
基于无线通信的设备点检系统 总被引:1,自引:0,他引:1
针对传统设备点检系统工作效率低、劳动强度大、准确性低、实时性差等问题,提出了一种基于无线通信的设备点检系统。该系统结合了单片机、无线通信和计算机信息管理等技术,具有多元化通信方式,包括无线射频(RF)通信、GSM通信和Internet通信,能够在线检测现场设备的振动、温度、压力等主要参数,并能根据环境情况进行预警,同时具有远程监测功能。测试结果表明,该系统稳定性强,显著提高了设备点检系统的操作管理品质。 相似文献
50.
The defect of process equipments is a major factor that impairs the yields in the mass production of semiconductor wafer fabrication and it is a main supervision means to use high-resolution defect inspection tools to detect and monitor the defect damage. Due to the high investment costs of these inspection tools and the resulting decrease in the throughput, how to improve the sampling rate is an important issue for the associated inspection strategy. This paper proposes a new concept and implementation of virtual inspection (VI) to enhance the detection and monitoring of defect in semiconductor production process. The underlying theory of the VI concept is that the state variables identifications (SVIDs) of process equipments can reflect the process quality effectively and loyally. The approach of VI is to combine the application of the fault detection and classification (FDC), and the defect library and the re-engineering of inspection procedure to reach the full-scope of strategic objective. VI enables the defect monitoring to enter a new era by promoting the monitoring level of defect inspection from the previous lot-sampling basis to the wafer-sampling level, and hence upgrades the sampling strategy from random-sampling to full and right-sampling. In this study, various typical defect cases are utilized to illustrate how to create VI models and verify the reliability of the proposed approach. Furthermore, a feasible architecture of the VI implementation for mass production in semiconductor factory is presented in the paper. 相似文献