Red-Blood-Cell-Membrane-Coated Metal-Drug Nanoparticles for Enhanced Chemotherapy

To overcome high toxicity, low bioavailability and poor water solubility of chemotherapeutics, a variety of drug carriers have been designed. However, most carriers are severely limited by low drug loading capacity and adverse side effects. Here, a new type of metal-drug nanoparticles (MDNs) was designed and synthesized. The MDNs self-assembled with Fe(III) ions and drug molecules through coordination, resulting in nanoparticles with high drug loading. To assist systemic delivery and prolong circulation time, the obtained MDNs were camouflaged with red blood cell (RBCs) membranes (RBCs@Fe-DOX MDNs) to improve their stability and dispersity. The RBCs@Fe-DOX MDNs presented pH-responsive release functionalities, resulting in drug release accelerated in acidic tumor microenvironments. The outstanding in vitro and in vivo antitumor therapeutic outcome was realized by RBCs@Fe-DOX MDNs. This study provides an innovative design guideline for chemotherapy and demonstrates the great capacity of nanomaterials in anticancer treatments.     

In-situ generation of platinum nanoparticles on LaCoO3 matrix for soot oxidation

The LaCo_0.94Pt_0.06O₃ catalyst is reduced under 5% H₂/Ar at different temperatures to get Pt/LaCoO₃ with high catalytic activity for soot oxidation. Transmission electron microscopy (TEM), scanning electron microscopy (SEM), X-ray diffraction (XRD), Brunauer–Emmett–Teller method (BET), X-ray photoelectron spectroscopy (XPS), H₂-temperature programmed reduction (H₂-TPR), O₂-temperature programmed desorption (O₂-TPD) and thermogravimetric analysis (TGA) were used to study the physicochemical properties of the catalyst. SEM and TEM results indicate that Pt nanoparticles (<10 nm) are grown homogeneously on the surface of the LaCoO₃ matrix after in-situ reduction. XRD shows that the reduced catalyst has a high symmetrical structure. TGA results indicate that all reduced catalysts exhibit an excellent activity, especially the catalyst reduced at 350 °C (T₁₀ = 338 °C, T₅₀ = 393 °C, T₉₀ = 427 °C). And perovskite is the primary active component. According to XPS study, the high symmetrical structure benefits the mobility of oxygen vacancy, and Pt nanoparticles induce the oxygen vacancy to move to its adjacent situation, resulting in more adsorbed oxygen on the surface of the reduced catalyst and increasing the activity. The possible reaction principle is also proposed.     

STUDY OF INTERFACES AND SURFACES OF YBa_2Cu_3O_(7-x)-Ag

Interfaces and surfaces of YBa_2Cu_3O_(7-x)(YBCO)-Ag have been studied by SEM-EDXand AES.No effect of Ag on 123 structure in X-ray diffraction pattern was observedfor 0.4 mol Ag doped YBCO.AES analysis indicated that Ag segregated on surfaceof YBCO and resulted in decrease of YBCO-metal lead resistance.In addition,solutionand segregation of Ag as elemental state were often appeared on interfaces and surfacesof high temperature annealed YBCO,whether elemental Ag or compound Ag_2O andAgNO_3 adopted as doping material.     

Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

银基氟化镁材料的研究

采用粉末冶金的方法制备了银基氟化镁材料。利用X射线衍射仪、金相显微镜和差热分析仪等对其组织结构进行分析，同时对其硬度、电导率、密度和摩擦系数等进行了测试。结果表明：形成的合金相对密度达98％以上，银与氟化镁能达到原子级别的结合：在银中添加氟化镁，样品的电导率有较大幅度的下降，并且晶粒显著细化，但材料的硬度提高不大，对银和铜的摩擦系数没有明显的降低。因此，氟化镁不能作固体自润滑材料的添加剂。     

Yb2O3／TiO2纳米颗粒的制备及表征

采用溶胶-凝胶法制备了微量 Yb2O3掺杂纳米 TiO2颗粒,采用 XRD, TG-DTA, TEM等手段对试样经不同温度热处理后的结构相变、表面形貌、颗粒大小等特性进行了表征.实验表明温度不高于 400℃时,试样的颗粒粒径较小,粒径在 15 nm以下,比表面积大于 107.22 m2@ g-1, TiO2呈锐钛型;在 400℃以上, TiO2粒径迅速增大,微粒出现锐钛相与金红石相混晶结构;800℃时 TiO2微粒完全转化成金红石相.     

半导体硫化银纳米管的制备与光学性能

在以Triton X-100为表面活性剂形成的反相胶束体系中,成功地制备了半导体硫化银纳米管,管径88 nm～120nm、长度大于2.6 μm.X射线衍射测定表明,产物为纯单斜结构.紫外-可见光谱在275 nm处发现新的吸收峰,最大发射波长与体相材料相比,蓝移了38 nm.     

贵金属Cu、Ag、Au的电子结构和物理性质

由纯金属单原子理论(OA)确定了面心立方结构(FCC)贵金属Cu、Ag、Au的电子结构依次为[Ar](3dn)5.58(3dc)4.21(4sc)0.23(4sf)0.98、[Kr](4dn)4.87(4dc)4.56(5sc)0.66(5sf)0.91、[Xe](5dn)4.20(5dc)4.90(6sc)1.57(6sf)0.33,并确定了Cu、Ag、Au的密排六方结构(HCP)和体心立方结构(BCC)两种初态特征晶体和初态液体的电子结构。根据自然态的电子结构定性解释了熔点、拉伸强度、维氏硬度、体弹性模量、电导和热导率物理性质差异与电子结构的关系,定量计算了晶格常数、结合能、势能曲线及线热膨胀系数随温度的变化。根据非自然态的电子结构,定性解释了晶体结构BCC和HCP的关系。     

少量Ag对低Cu／Mg比的Al—Mg—Cu—Li合金组织与性能的影响

通过显微硬度测试、拉伸试验、能谱分析、SEM及TEM观察，研究了少量Ag对低Cu／Mg比的Al-Mg-Cu-Li合金微观组织与性能的影响。实验结果表明：Ag的添加提高了该合金的硬度和强度，同时改善了其塑性，并延缓了过时效的发生。微观组织观察表明：Ag的添加促进Z相的均匀弥散析出，同时抑制了S＇相在缺陷处非均匀析出；并且Ag的添加还促使了时效初期合金中δ’相的细化和弥散分布，延缓了δ’相的长大。同时分析了析出相种类对合金塑性的影响。