Strength, strain-rate sensitivity and ductility of copper with nanoscale twins

We present a comprehensive computational analysis of the deformation of ultrafine crystalline pure Cu with nanoscale growth twins. This physically motivated model benefits from our experimental studies of the effects of the density of coherent nanotwins on the plastic deformation characteristics of Cu, and from post-deformation transmission electron microscopy investigations of dislocation structures in the twinned metal. The analysis accounts for high plastic anisotropy and rate sensitivity anisotropy by treating the twin boundary as an internal interface and allowing special slip geometry arrangements that involve soft and hard modes of deformation. This model correctly predicts the experimentally observed trends of the effects of twin density on flow strength, rate sensitivity of plastic flow and ductility, in addition to matching many of the quantitative details of plastic deformation reasonably well. The computational simulations also provide critical mechanistic insights into why the metal with nanoscale twins can provide the same level of yield strength, hardness and strain rate sensitivity as a nanostructured counterpart without twins (but of grain size comparable to the twin spacing of the twinned Cu). The analysis also offers some useful understanding of why the nanotwinned Cu with high strength does not lead to diminished ductility with structural refinement involving twins, whereas nanostructured Cu normally causes the ductility to be compromised at the expense of strength upon grain refinement.     

Study of the copper leaching in the wet oxidation of phenol with CuO-based catalysts: Causes and effects

Catalytic wet oxidation of phenol as a model pollutant has been performed in a three phase fixed-bed reactor (FBR) by using a commercial catalyst based on copper oxide in order to analyze the variables affecting significantly the copper leaching. It has been found that temperature has an almost negligible influence in the range studied (70–160 °C). On the contrary, an important effect of the pH value was noticed. The copper leaching reduces when the pH of the solution fed to the reactor increases, being almost negligible at pH ≥ 5. Moreover, the composition of the reaction media also influences the leaching. Higher copper concentrations than those expected by the effect of the acid aqueous media have been measured in the reactor effluent when phenol, catechol, hydroquinone, p-benzoquinone and maleic acid are present in the reaction media. On the contrary, oxalic acid has a negative influence on the leaching, since it captures the copper in solution to form copper oxalate which precipitates on the catalyst surface. For a previously acidified medium, the acetic and formic acids do not have any other effect on the copper leaching. It has been also demonstrated that as copper in solution decreases, so does phenol conversion, because the homogeneous catalysis contributes significantly to the oxidation reactions even in fixed-bed reactors.     

Accumulation of Cu(II) cations in poly(3,4-ethylenedioxythiophene) films doped by hexacyanoferrate anions and its application in Cu-selective electrodes with PVC based membranes

Electrochemical properties of poly(3,4-ethylenedioxythiophene) doped with hexacyanoferrate(II,III) ions (PEDOT(HCF)) were studied in the presence of Cu²⁺ ions. Voltammetric and EDAX studies revealed retention of hexacyanoferrate anions in the polymer film and accumulation of Cu(II) cations, as well as formation of solid copper hexacyanoferrate near the polymer surface.Accumulation of Cu²⁺ ions was found to be advantageous from the point of view of PEDOT(HCF) applications as a solid contact (ion-to-electron transducer) in all-solid-state Cu²⁺-selective electrodes with solvent polymeric polyvinyl chloride (PVC) based membrane, containing Cu²⁺-selective ionophore. Binding of Cu²⁺ ions in the conducting polymer layer results in analyte ions flux into the transducer phase. Thus, pronounced enhancement of selectivity of the all-solid-state Cu²⁺-selective electrode or lower detection limit of the potentiometric response range was achieved, reaching under optimised conditions 10⁻⁷ M CuSO₄.     

The reaction of 1,2-dichloroethane with copper

The decomposition of 1,2-dichloroethane on polycrystalline copper has been studied using a microreactor. The reaction is found to have an activation energy of 81±5 kJ mol^–1 generating gaseous ethene and chemisorbed chlorine. The reaction terminates on completion of a monolayer of chemisorbed chlorine and is followed by a much slower reaction. The rate limiting step is thought to be C₂H₄Cl_2(phys)C2H₄Cl(_ads)+Cl_ads The reaction is compared with a UHV study of the same molecule on Cu(l 11) and the possibility of a negative ion transition state is discussed.     

火焰原子吸收光谱法测定芥蓝中钙、镁、铜和铁

火焰原子吸收法测定芥蓝中的钙、镁、铜和铁含量,相对标准偏差为1.45%~2.03%,回收率为96.8%~100.1%。结果表明芥蓝含有丰富的微量元素。     

化学法处理铜合金屑工艺的热力学和动力学分析

本文对化学法处理普通黄铜屑，直接制备纯铜粉末进行了热力学和动力学分析研究及试验表明：Zn，Fe等元素的酸浸反应容易进行，氧化及还原速度快．酸浸过程受扩散控制，其动力学方程为进一步的热力学分析指出，本工艺适合于处理各种铜合金尾料，尤其适合于黄铜类铜合金尾料。     

内螺纹粘接再造技术

本文介绍了两种内螺纹粘接再造技术，即钢丝增强粘接再造法和铜丝填充粘接再造法。     

Potassium sorbate solutions as copper chemical mechanical planarization (CMP) based slurries

Copper depassivation and repassivation characteristics in potassium sorbate solutions, subsequent to mechanical abrading are reported. The identification of copper repassivation kinetics obtained subsequent to mechanical damage of copper protective films formed in sorbate based solutions is discussed. The repassivation rate of copper in sorbate based solutions was measured by means of a slurryjet system capable of measuring single particle impingments on microelectrodes. Copper repassivation rates measured by this slurryjet system in sulfate solutions containing 10 g L⁻¹ potassium sorbate were found to be in the range of 0.5-1.5 ms. An increase in the potassium sorbate concentration leads to a decrease in copper repassivation time at potentials ranging from 200 to 600 mV_Ag/AgCl. The impingement angle between the copper surface and a single abrasive particle has no impact on copper repassivation time nor peak current (I_max) values. XPS studies revealed that copper passivation in potassium based solution was due to the formation of a thin film which is constituted of: Cu₂O, Cu(OH)₂ and Cu(II)-sorbate, while copper(II)-sorbate is mainly present at the top levels of the passive film. It is therefore recommended that the use of potassium sorbate as a passivating component in conjunction with the addition of strong oxidizing agents in chemical mechanical planarization (CMP) slurry design should be considered.     

Removal of Ag(l), Cu(II) and Zn(ll) ions with a supported liquid membrane containing cryptands as carriers

The interface behaviour in the facilitated co-transport of Ag(I), Cu(II) and Zn(II) ions through supported liquid membranes (SLMs) made of a flat-sheet polypropylene membrane support containing cryptands (2.2.2 or 2.2.1) as carriers was studied. The liquid-liquid extraction tests showed a maximum distribution coefficient when the carrier concentration was greaterthan 10⁻⁴M. In transport experiments the transmembrane flux increased with increasing carrier concentration reaching a limiting value at greater than 10⁻³M concentration. The calculation ofthe diffusion coefficients in membranes showed ahigherdiffusivityof2.2.2-metal complexes with respect to 2.2.1-metal complexes for silver ions. A sequence of diffusivity D(Ag+)>D(Cu²⁺)>D(Zn²⁺) was obtained, but carrier 2.2.1 showed a higher selectivity through copper ions. A sequence of diffusivity D(Cu²⁺)>D(Zn²⁺)>D(Ag⁺) was obtained. The diffusivity was significantly higher when using Celgard 2500 support compared to Celgard 2400 or 2402. Variable metal ion concentrations in the feed phase fluxes almost zero, at less than 10⁻² M concentration, were obtained. In the transient state of the transport through the SLM, different molar flow rates at the feed-membrane and membrane-strip interfaces were observed. The selectivity of the interfaces containing 2.2.2 in the separation binary mixtures of ions showed the following separation factors: SF_AgZn = 2.50, SF_AgCu = 1.64, SF_cuZn = 1.42.     

New N,O-containing ligands for the biomimetic copper-catalyzed polymerization of 2,6-dimethylphenol

Poly(2,6-dimethyl-1,4-phenylene ether) (PPE), which is widely used in high-performance engineering plastics, is obtained by the copper-catalyzed oxidative coupling of 2,6-dimethylphenol. The oxidative polymerizations have been carried out in acetonitrile with structurally related [copper-(N,O-containing ligand)] complexes as the catalyst precursor compounds, which appeared to be of great interest for a better understanding of the factors influencing the catalytic activities. Steric effects (influence of a methyl group close to the metal center; ligands 4–7) or electronic effects (imino versus amino group; ligands 4, 5, 8 and 6, 7, 9, respectively) on the polymerization rates have been demonstrated. The use of mono- or dinucleating ligands has strengthened the proposed mechanism of the reaction involving dinuclear active species.