基于集成技术的二维智能焊缝传感器

本文简述了基于GMR的二维焊缝检测传感器.为解决焊接加工自动化过程中焊缝的跟踪检测,将GMR焊枪悬浮高度传感器、焊缝检测传感器以及相应的微处理器有机集成,从而使传感器实现小型化智能化,减少对工件检测的死区范围.该传感器与自动焊接机组成的焊缝跟踪系统,焊缝跟踪精度高、响应速度块,减少了焊缝轨迹空间捕捉算法的复杂性.     

Impact of power electronics packaging on the reliability of grid connected photovoltaic converters for outdoor applications

This paper deals with thermal and reliability aspects of converters for grid connected photovoltaic applications (rate power approximately 100 W) which can be integrated into solar modules. The use of these Module Integrated Converters (MIC) promises a reduction of costs due to mass production. It improves behaviour of the whole photovoltaic system, as there is no voltage mismatch caused by shading effects. The electronic components of the MIC are exposed to extreme environmental conditions. Lifetime limiting factors are described. Methods to increase the lifetime of the most crucial components in the MIC, electrolytic capacitors, are described. The presented 1st generation Low Profile MIC with “optimised design” is capable of running in very high ambient temperatures. This design maximises availability of the photovoltaic system, which consequently leads to a cost reduction of the electrical energy delivered to the grid. Different realisations of how to integrate the designed Low Profile MIC into the solar module are discussed. A detailed thermal simulation is used to optimise the MIC design according to temperature and reliability issues. The models used for thermal simulation are described.     

32 nm node BEOL integration with an extreme low-k porous SiOCH dielectric k = 2.3

A 32 nm node BEOL integration scheme is presented with 100 nm metal pitch at local and intermediate levels and 50 nm via size through a M1-Via1-M2 via chain demonstrator. To meet the 32 nm RC performance specifications, extreme low-k (ELK) porous SiOCH k = 2.3 is introduced at line and via level using a Trench First Hard Mask dual damascene architecture. Parametrical results show functional via chains and good line resistance. Integration validation of ELK porous SiOCH k = 2.3 is investigated using a multi-level metallization test vehicle in a 45 nm mature generation.     

Evaluating k-values for low-k materials after damascene integration: Method and results

This work discusses a method for measuring k-values of low-k films after integration in damascene structures. The experimental results are obtained from 90 nm ½ pitch single damascene structures on low-k materials with intrinsic k-values ranging between 2.2 and 3. The measurement technique is discussed in detail with a focus on the accuracy, limitation of the method, impact of low-k damage and applicability for smaller dimensions.     

三网融合下的视听新媒体内容监管策略研究

随着信息技术及网络技术的发展以及三网融合的推进,一方面极大地促进了新媒体的发畏,为国家政治、经济、军事、文化发展提供了良好的宣传作用,另一方面也为非法内容的传播提供了土壤.从法律法规、信息技术两个角度阐述了新媒体的监管方法和策略,为管理者制定合理政策提供了参考.     

对数字家庭网络新核心——家庭网关的分析

伴随互联网、物联网的发展,家庭设施呈数字化发展趋势,数字家庭概念的轮廓逐步清晰,包括家庭媒体设备间的数据分享、自动化家居的远程监控、对家庭网络门户及家庭内数据进行安全管理。随之衍生出对数字家庭网络新核心—家庭网关的需求。文章对家庭网关的形成、发展及未来可能性作了分析与预测,并结合国内外在家庭网关需求上的差异作了描述与分析。     

A Highly Parallel Joint VLSI Architecture for Transforms in H.264/AVC

In H.264/AVC, the concept of adapting the transform size to the block size of motion-compensated prediction residue has proven to be an important coding tool. This paper presents highly parallel joint circuit architecture for 8 × 8 and 4 × 4 adaptive block-size transforms in H.264/AVC. By decomposing the 8 × 8 transform to basic 4 × 4 transforms, a unified architecture is designed for both 8 × 8 and 4 × 4 transform and the transform data-path can be efficiently reused for six kinds of transforms. i.e., 8 × 8 forward, 8 × 8 inverse, 4 × 4 forward, 4 × 4 inverse, forward-Hadamard, inverse-Hadamard transforms. Linear shift mapping is applied on the memory buffer to support parallel access both in row and column directions which eliminates the need for a transpose circuit. For reusable and configurable transform data-path, a multiple-stage pipeline is designed to reduce the critical path length and increase throughput. The design is implemented under UMC 0.18 um technology at 200 MHz with 13.651 K logic gates, which can support 1,920 × 1,088 30 fps H.264/AVC HDTV decoder.

推扫成像中积分时间对孔径函数的影响分析

分析了线列推扫成像中,积分时间对采样孔径函数的影响.给出了在推扫方向上随着积分时间变化的梯形采样孔径函数,并根据该孔径函数,分析了积分时间和输入频率对截取过程中的调制传递函数值下降速度的影响,同时对细分采样叠加成像方式与积分延迟效应的类似性作了简要对比.这些分析有助于更清晰地了解推扫成像方式中积分时间对系统成像质量的影响.     

基于Web Service光传输监控系统的应用

提出了一种基于分布式Web Service技术的光传输监控系统的应用。在该系统结构中,光传输设备分布在广大的区域内,各个局域网内的光传输系统所采用的通信标准、平台和技术的不同给系统集成带来很大的困难。基于这样的背景下,采用分布式Web Service技术,利用Web Service平台无关性、简单灵活性的优点解决了光传输系统的集成问题。     

综合化航空电子系统发展历程及重要支撑技术

阐述了航空电子系统结构的综合化演变过程及发展趋势,说明了航空电子综合化的作用和意义,提出了提高航空电子综合化水平需重点研究的关键支撑技术。