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Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints.
IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported
that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method
can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to
study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni
immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening
the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress. 相似文献
213.
An efficient return algorithm for non-associated plasticity with linear yield criteria in principal stress space 总被引:1,自引:0,他引:1
An efficient return algorithm for stress update in numerical plasticity computations is presented. The yield criterion must be linear in principal stress space and can be composed of any number of yield planes. Each of these yield planes may have an associated or non-associated flow rule. The stress return and the formation of the constitutive matrix is carried out in principal stress space. Here the manipulations simplify and rely on geometrical arguments. The singularities arising at the intersection of yield planes are dealt with in a straightforward way also based on geometrical considerations. The method is exemplified on non-associated Mohr–Coulomb plasticity throughout the paper. 相似文献
214.
Microhardness measurements have been performed on untreated (virgin) and electrically stressed, solvent‐cast laboratory‐prepared samples of pure poly(phenylene oxide) (PPO), pure polystyrene (PS), and PPO : PS polyblends with different weight proportions. Results of such measurement on untreated polyblend sample show that microhardness (Hv) increases with increase in the content of PS up to 10 wt %, which attributed to the existence of homogeneous phase morphology. However, this feature is not observable in samples containing higher content of PS. Electrical stress is found to modify considerably the mechanical property of polymer. The effect of electric field on the microhardness of such samples (PPO : PS :: 90 : 10) has been characterized by the existence of a peak. Trapping of charge carriers in electrically stressed samples imparts hardening to the polyblend up to an applied step field of 190 kV/cm. However, the excessive charging beyond this step field value destroys this characteristic. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 相似文献
215.
Recent experiments have shown that metallic materials display significant size effects when the characteristic length scale of non-uniform plastic deformation is close to a micron. Couple stress plasticity has been developed to explain such phenomena by Fleck and Hutchinson. The mechanical behaviors of ultra-thin nickel beams in different boundary conditions were studied with the hybrid element developed for couple stress plasticity before. Strong scale effects are found when the beam's thickness is close to the material characteristic length scale. Such phenomena will disappear if the beam' s thickness is greatly larger than the material characteristic length scale. The scale effect is the beams inherent property and it does not change with the change of support conditions. 相似文献
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Alpass Fiona; Flett Ross; Humphries Steve; Massey Claire; Morriss Stuart; Long Nigel 《Canadian Metallurgical Quarterly》2004,11(3):270
Previous studies have identified a number of different farm stressors and have reported gender and age differences in levels of stress. This study aimed to determine stress experienced by New Zealand dairy farmers, particularly in relation to adoption of new technology and its relationship to age and gender. Measures of farm stress and adoption of technology were completed by 985 dairy farmers. The highest levels of stress were reported for time pressures, machinery breakdown, weather, and government policies. Stress related to new technologies occurred rarely. Women reported more stress and higher levels of stress for understanding new technologies. There was also an increase in severity of stress with age related to new technologies. Overall, stress levels were moderate and may reflect favorable economic conditions. The findings suggest a need to tailor stress interventions to meet specific needs. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
218.
针对一种侧面和一端的成分呈梯度变化的圆柱体电极模型进行了热应力缓和优化设计。模型材料成分是金属Cu和NiFe2O4尖晶石陶瓷。采用混合律定律确定材料组分.性质关系,利用ansys有限元分析软件计算了从300K(零应力状态)升温到1300K时模型表面的热应力,分析了层数n、成分指数p以及锥角θ对模型表面热应力分布的影响。结果表明:层数n主要影响应力曲线的光滑程度,层数增加,曲线变得平滑;成分指数p是热应力缓和设计的关键,指数越小,应力越小;锥角θ的增加也可缓和热应力,但作用不如成分指数。 相似文献
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