Effects of solidification structure on fatigue crack initiation and fatigue strength in Al−Si−Mg cast alloys

Rotating-bending uniaxial fatigue tests and micro-fatigue crack initiation tests were carried out using a permanent mold cast (PMC) and semi-solid die cast (SDC) with Al−7%Si−0.35%Mg composition in order to examine the relationship between solidification structures and fatigue behaviors. The crack length was measured using a replication method. Fatigue strength was improved in SDC, which was almost consistent with the predicted fatigue strength using the size of Si particle cluster. Resistance to fatigue crack initiation and fatigue strength were improved in SDC owing to the finer Si cluster and to higher ultimate tensile strength. Fatigue crack in PMC was preferentially initiated at pores. For SDC, the fatigue crack was initiated at the Si particle/matrix interface, and then sucessively grew along eutectic cell boundaries.     

明渠断面水流流速与边界剪切应力横向分布模型

天然河流的横断面多为由主槽和漫滩组成的复式断面,水流在这种断面中比在单一断面中受到更多因素影响,流态也更加复杂。通过将明渠横断面上微元体在水流方向的N-S控制方程沿水深积分,得出描述垂线平均流速和边界剪切应力横向分布的模型,并通过对实验数据的验证,确定了模型的实用性。     

Effects of hot-carrier stress on high performance polycrystalline silicon thin film transistor with a single perpendicular grain boundary

This paper is a report on the effect of a single perpendicular grain boundary on the hot-carrier and high current stability in high performance polycrystalline silicon (poly-Si) thin film transistors (TFTs). Under a hot carrier stress condition (Vg = Vth + 1 V, Vd = 12 V), the poly-Si TFT with a single grain boundary is superior to the poly-Si without any grain boundary because of the smaller free carriers available for electric conduction. The shift of transconductance in poly-Si TFT with a single grain boundary is less than 5% after hot carrier stress during a period of 1000 s. The shift of transconductance is about 25% in the case of the poly-Si TFTs without a grain boundary in the channel. On high current stress, the poly-Si TFT without the grain boundary is less degraded than the poly-Si TFT with the grain boundary because the concentrated electric field near the drain junction is lower.     

A note on the satisfaction of the boundary conditions for Chebyshev collocation methods in rectangular domains

The way boundary conditions are imposed when applying Chebyshev collocation methods to Poisson and biharmonic-type problems in rectangular domains is investigated. It is shown that careful selection of the number of collocation points leads to a linear system ofn linearly independent equations inn unknowns.     

测井曲线在识别陈家庄凸起北部缓坡带层序边界中的应用

针对陈家庄凸起北部缓坡带特殊的沉积、构造特征．应用测井曲线来识别层序边界。应用自然电位和电阻率测井曲线的组合来确定层序边界，可根据自然电位基线强烈偏移、视电阻率的突增或突减等异常现象的出现来判别；利用声波时差和电阻率曲线的叠合，在层序边界处常对应△logR的低谷值；应用累计倾角图来识别层序边界优于常规的地层倾角．累计倾角的一阶导数更能突出异常点的位置。测井曲线应用于识别层序边界，有其自身的优势，在该研究区取得了较好的效果。     

Drag coefficient of flow around a sphere: Matching asymptotically the wide trend

An empirical relationship of drag coefficient of flow around a sphere is developed for the entire range of Particle Reynolds numbers reported in the literature from Stokes regime to the condition when turbulent boundary layer prevails. The relationship is obtained using an approach to match asymptotically the wide trend of drag coefficient. The matching approach, which relies on dividing the wide trend into smaller segments that can be combined into an overall relationship, employs regression techniques and thus warrants the best-fit accuracy results. The relationship is calibrated with experimental data available in the literature covering the entire range for Reynolds numbers up to ~ 10⁶. For Reynolds values greater than 10⁶, the relationship renders a drag coefficient of 0.2. The performance of the relationship is tested and compared with other suitable models found in the literature. This relationship is also transformed into an explicit expression for settling velocity calculations.     

高温和低张应力引起的非平衡晶界偏聚动力学(Ⅱ)--实验结果的动力学模拟

以文献[1]建立的张应力引起的非平衡晶界偏聚动力学方程模拟了Shinoda T等的磷在钢中的应力时效实验结果和Misra R D K的硫在钢中的应力时效实验结果，模拟结果与实验结果互相吻合。通过模拟发现，张应力使磷-空位复合体以及硫-空位复合体在钢中的扩散系数均增加3个数量级，且磷原子和硫原子的扩散系数分别降低3个和5个数量级。     

A three‐dimensional model describing stress‐temperature induced solid phase transformations: solution algorithm and boundary value problems

An always increasing knowledge on material properties as well as a progressively more sophisticated production technology make shape memory alloys (SMA) extremely interesting for the industrial world. At the same time, SMA devices are typically characterized by complex multi‐axial stress states as well as non‐homogeneous and non‐isothermal conditions both in space and time. This aspect suggests the finite element method as a useful tool to help and improve application design and realization. With this aim, we focus on a three‐dimensional macroscopic thermo‐mechanical model able to reproduce the most significant SMA features (Int. J. Numer. Methods Eng. 2002; 55 : 1255–1264), proposing a simple modification of such a model. However, the suggested modification allows the development of a time‐discrete solution algorithm, which is more effective and robust than the one previously discussed in the literature. We verify the computational tool ability to simulate realistic mechanical boundary value problems with prescribed temperature dependence, studying three SMA applications: a spring actuator, a self‐expanding stent, a coupling device for vacuum tightness. The effectiveness of the model to solve thermo‐mechanical coupled problems will be discussed in a forthcoming work. Copyright © 2004 John Wiley & Sons, Ltd.     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.