阳泉市煤矿采空区地质因素对公路的破坏

介绍了阳泉市煤矿采空区对公路建设所造成的危害，对其上覆岩层变形破坏的地质因素及其破坏机理作了分析，指出应该采取各种措施减少对公路的破坏。     

混凝土输送泵的常见故障及排除

介绍了混凝土输送泵的常见故障，阐述了混凝土输送泵墙管的排除方法，指出只有认真分析造成故障的各种原因，才能按照先外后内、先易后难的原则进行故障处理。     

变压器有载合闸过程中故障分闸后铁心剩磁分析

通过有载合闸变压器模型,分析了变压器有载合闸过程中由于副边突然短路导致主保护动作时电流和磁通的暂态过程,并对变压器铁心内的剩磁作了定性的分析。     

防盐抽油泵的研制及在文留油田的应用

文留油田因其独特构造和地层特点，抽油井结盐严重，文中通过对油井结盐机理及抽油泵结盐主要形式、原因的分析，有针对性地开发了防盐抽油泵，并介绍了防盐泵的结构和主要技术特点，在实际应用中配套应用相应防盐技术，取得了较好的效果，极大地减少了盐卡泵现象，抽油井检泵周期得以延长，为其它油田类似油井生产管理提供了新方法。     

潜油电泵易损零部件失效分析方法

通过对大庆油田近5 a潜油电泵易损零部件的数据统计,应用可靠性分析理论和方法研究了易损零部件的失效规律,得出4大部件的故障率占整个机组系统的91.7%,其可靠度由小到大的次序为电机、保护器、电泵和分离器。在这4大部件中,可靠度较低的零件主要有泵轴、叶导轮、扶正轴承、胶囊和保护器轴,其中泵轴、叶导轮、扶正轴承的主要失效模式是磨损,连接螺栓的主要失效模式是断裂失效。     

宝浪油田宝北区块套管失效机理研究

为了深化宝浪油田的套损机理研究．提出了套管损坏因素新的分类方法。根据该新分类法,研究了宝北区块的套损机理。研究结果揭示了套损井的分布区域在主力油藏区域和主力油层;在构造顶部区域和油层顶部层段;为边缘注水井;集中在强度较低,变形量较大的煤层段和泥岩层段;在储层强度较低的射孔段。这些规律可以用有限元分析和实验结果合理地解释。     

低渗透油田套管损坏机理分析及防治措施

在注水开发油田,油水井套管损坏是一种极为普遍的现象,但又各具特点.通过对鄯善油田套管损坏井的自身特点进行统计、归纳,深入分析低渗透砂岩油藏套管变形影响因素和作用机理,提出了套管损坏井的预防及相应治理措施.     

乙烯装置失效模式分析及基于风险的检验

简述了乙烯装置的工艺流程,分析了装置中常见的几种失效模式及其分布;以乙烯裂解装置为例,简述了RBI的执行过程和结果,从基于风险的检验理念,对制订设备检验策略提出了几点建议。     

Uncertainty of Predictions of Embankment Dam Breach Parameters

Risk assessment studies considering the failure of embankment dams often require the prediction of basic geometric and temporal parameters of a breach, or the estimation of peak breach outflows. Many of the relations most commonly used to make these predictions were developed from statistical analyses of data collected from historic dam failures. The prediction uncertainties of these methods are widely recognized to be very large, but have never been specifically quantified. This paper presents an analysis of the uncertainty of many of these breach parameter and peak flow prediction methods. Application of the methods and the uncertainty analysis are illustrated through a case study of a risk assessment recently performed by the Bureau of Reclamation for a large embankment dam in North Dakota.     

Structural integrity in electronics

With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation.