一种有效计算有耗分层媒质中格林函数的方法

以两层平面分层媒质为例,讨论了不同情况下空域格林函数的计算方法,指出了有耗平面分层媒质情况下传统方法的缺点,提出采用二维离散复像法(2D-DCIM)处理有耗平面分层媒质中的格林函数,并对积分路径做了相关要求,得到了同时包含场点纵坐标z和源点纵坐标z′及场源点横向距离ρ的格林函数的空域闭式表达式。所得结果与数值积分法的结果吻合良好,证实了该文方法的正确性。     

冷机低阻通路下的潜通电路分析及隔离方法

介绍了潜通电路的概念和分析方法,指出冷机低阻通路是在工程实际中形成潜通电路的典型原因以及冷备份电路和先后上电电路两种常见的潜通表现形式,提出了采用二极管、三态门、集电极开路(OC)输出、光电隔离和选用开关电源等5种电路潜通隔离方法,并阐述了各种方法的潜通隔离原理,可用于指导潜通电路的分析及其隔离防护电路的设计.     

A comparative study of the kinetics of interfacial reaction between eutectic solders and Cu/Ni/Pd metallization

A comparative study of the kinetics of interfacial reaction between the eutectic solders (Sn-3.5Ag, Sn-57Bi, and Sn-38Pb) and electroplated Ni/Pd on Cu substrate (Cu/Ni/NiPd/Ni/Pd) was performed. The interfacial microstructure was characterized by imaging and energy dispersive x-ray analysis in scanning electron microscope (SEM). For a Pd-layer thickness of less than 75 nm, the presence or the absence of Pd-bearing intermetallic was found to be dependent on the reaction temperature. In the case of Sn-3.5Ag solder, we did not observe any Pd-bearing intermetallic after reaction even at 230°C. In the case of Sn-57Bi solder the PdSn₄ intermetallic was observed after reaction at 150°C and 180°C, while in the case of Sn-38Pb solder the PdSn₄ intermetallic was observed after reaction only at 200°C. The PdSn₄ grains were always dispersed in the bulk solder within about 10 μm from the solder/substrate interface. At higher reaction temperatures, there was no Pd-bearing intermetallic due to increased solubility in the liquid solder. The presence or absence of Pd-bearing intermetallic was correlated with the diffusion path in the calculated Pd-Sn-X (X=Ag, Bi, Pb) isothermal sections. In the presence of unconsumed Ni, only Ni₃Sn₄ intermetallic was observed at the solder-substrate interface by SEM. The presence of Ni₃Sn₄ intermetallic was consistent with the expected diffusion path based on the calculated Ni-Sn-X (X=Ag, Bi, Pb) isothermal sections. Selective etching of solders revealed that Ni₃Sn₄ had a faceted scallop morphology. Both the radial growth and the thickening kinetics of Ni₃Sn₄ intermetallic were studied. In the thickness regime of 0.14 μm to 1.2 μm, the growth kinetics always yielded a time exponent n >3 for liquid-state reaction. The temporal law for coarsening also yielded time exponent m >3. The apparent activation energies for thickening were: 16936J/mol for the Sn-3.5Ag solder, 17804 J/mol for the Sn-57Bi solder, and 25749 J/mol for the Sn-38Pb solder during liquid-state reaction. The corresponding activation energies for coarsening were very similar. However, an apparent activation energy of 37599 J/mol was obtained for the growth of Ni₃Sn₄ intermetallic layer during solid-state aging of the Sn-57Bi/substrate diffusion couples. The kinetic parameters associated with thickening and radial growth were discussed in terms of current theories.     

On the fault-tolerant routing in distributed loop networks

Based on their "Theorem 2", an O(δ)-time algorithm of searching for the shortest path between each pair of nodes in a double loop network was proposed by K.Mukhopadyaya, et al.(1995). While, unfortunately, it will be proved that both "Theorem 2" and its proof are in error. A new and more faster O(△)-time, △≤δ, algorithm will be presented in this paper.     

SCM信道建模分析与仿真

对MIMO的基础信道模型SCM模型进行了详细的介绍,首先对SCM模型分类,建模基本原理,适用场景和建模具体流程作了全面的分析说明,其次从SCM模型所适用的三种环境的具体特征,建模过程中的相关参数的生成和简化等进行了充分分析。最后对SCM系统仿真模型所适用的三种环境分别从信道容量以和空间相关性进行了仿真验证,说明了SCM模型建模的合理性与实用性。     

长距离磁路传输电能系统之磁路分析

提出一种新的传输电能的系统,即长距离磁路传输电能系统,长距离磁路是指距离在400km以上的闭合磁路。通过磁路分析的第一类方法及第二类方法对该系统的磁路结构及系统参数进行了分析,验证了该新的系统的合理性,为电能传输方式提供新的思路并进行了有益的探索。但还有诸如恒定磁场如何取电的问题有待进一步研究。     

基于陷阱检测的咬尾卷积码译码算法

该文分析了循环维特比算法(CVA)中存在的循环陷阱问题,并证明了传统基于CVA的咬尾卷积码译码算法中存在的不足,提出了一种高效率的咬尾卷积码译码算法。该算法通过检测两次不同迭代中获得的两条最大似然路径是否相同来判断是否有循环陷阱产生,并及时终止循环,减少冗余迭代;在没有循环陷阱产生的情况下,新算法比较当前迭代中最大似然路径和已经发现的最优咬尾路径是否相同来自适应终止迭代。文中对循环陷阱检测方案和自适应终止方案做了进一步优化,即利用路径的净增量而非路径本身作为检测量。实验结果表明新算法提高了译码效率,降低了译码复杂度。     

Empirical millimeter-wave wideband propagation characteristics of high-speed train environments

Owing to the difficulties associated with conducting millimeter-wave (mmWave) field measurements, especially in high-speed train (HST) environments, most propagation channels for mmWave HST have been studied using methods based on simulation rather than measurement. In this study, considering a linear cell layout in which base stations are installed along a railway, measurements were performed at 28 GHz with a speed up to 170 km/h in two prevalent HST scenarios: viaduct and tunnel scenarios. By observing the channel impulse responses, we could identify single- and double-bounced multipath components (MPCs) caused by railway static structures such as overhead line equipment. These MPCs affect the delay spread and Doppler characteristics significantly. Moreover, we observed distinct path loss behaviors for the two scenarios, although both are considered line-of-sight (LoS) scenarios. In the tunnel scenario, the path loss exponent (PLE) is 1.3 owing to the waveguide effect, which indicates that the path loss is almost constant with respect to distance. However, the LoS PLE in the viaduct scenario is 2.46, which is slightly higher than the free-space loss.     

基于扩展CHAM的SA级路径覆盖方法

化学抽象机形式化语言（CHAM）通过把化学反应和抽象机的概念有机地结合来描述系统状态的变化,以此来指导分析和测试.针对软件体系结构（SA）中构件的概念,采用CHAM对SA中的构件进行建模,并据此导出该构件的标号迁移系统（LTS）,以表示该构件与其它构件之间的行为交互,并根据选取的测试覆盖准则,生成基于此构件的LTS中的所有测试路径.最后以B/S体系结构为例,通过实验验证了该方法在生成DB构件的测试路径上是可行的.     

基于区分服务感知的MPLS网络流量分配方法

服务质量（Qos）和流量工程（TE）是在当今网络中提供实时应用业务的两种重要技术。多协议标记交换（MPLS）在IP网Qos提供和TE功能实现中起了关键作用。首先介绍了区分服务感知的流量工程（DS-TE），然后提出了一种基于DS-TE的网络流量分配新方法。给出了相关的数学模型，并进行了相应的仿真，仿真结果表明使用该方法实施DS-TE时，在满足不同业务的QoS同时能较好地均衡网络负荷。