CLP(ℜ) and some electrical engineering problems

The Constraint Logic Programming Scheme defines a class of languages designed for programming with constraints using a logic programming approach. These languages are soundly based on a unified framework of formal semantics. In particular, as an instance of this scheme with real arithmetic constraints, the CLP() language facilitates and encourages a concise and declarative style of programming for problems involving a mix of numeric and non-numeric computation.In this paper we illustrate the practical applicability of CLP() with examples of programs to solve electrical engineering problems. This field is particularly rich in problems that are complex and largely numeric, enabling us to demonstrate a number of the unique features of CLP(). A detailed look at some of the more important programming techniques highlights the ability of CLP() to support well-known, powerful techniques from constraint programming. Our thesis is that CLP() is an embodiment of these techniques in a language that is more general, elegant and versatile than the earlier languages, and yet is practical.An earlier version of this paper appeared in the proceedings of the 4th International Conference on Logic Programming, Melbourne, May 1987. Much of this work was carried out while the authors were at Monash University, Melbourne, Australia.     

Majority gates vs. general weighted threshold gates

In this paper we study small depth circuits that contain threshold gates (with or without weights) and parity gates. All circuits we consider are of polynomial size. We prove several results which complete the work on characterizing possible inclusions between many classes defined by small depth circuits. These results are the following:

基于Multisim的稳压电路的仿真分析

介绍使用7805设计了+5V稳压电路,使用LM317设计了可调稳压电源,可调范围为2.5V-7.5V,并对一些常用的参数进行了计算,同时给出Multisim仿真电路图。同时通过Multisim对整流电路,滤波电路和稳压电路的进行了仿真分析。利用虚拟软件可以设计出满足不同要求的电源分配系统,同时也可以对大多数模拟电路有很好的设计辅助作用。     

中职学校提高《数字电路》课程教学质量的探讨

《数字电路》是中职电类专业的一门专业基础课程。结合目前中职学校教学现状中存在的问题,如何让学生把这门课学好,笔者从精选教材、课堂导入、教学手段、考核评价等方面进行了探讨。指出了只有充分激发起学生的学习兴趣和学习积极性,才是提高教学质量的关键。     

Modelling of the mist formation in a segmented grinding wheel system

It has been found that using a segmented grinding wheel with a fluid chamber can significantly minimise the quantity of coolant while improving the ground surface integrity. The present investigation aims to explore the fluid flow mechanism in such a wheel system. To this end, the Weber theory for Newtonian jet instability was applied to quantitatively determine the contribution of coolant flow rate to mist and ligament modes. A semi-analytical model was then developed to predict the mist flow rate by taking into account both the grinding parameters and fluid properties. It was shown that the model prediction was in good agreement with experimental measurements. Because of the comprehensive integration of variables in the formulation, the model provides a good fundamental understanding of the mist formation and offers a practical guideline for the selection and use coolant in minimising the mist flow rate.     

短开路耦合谐振器加载的宽带带通滤波电路

提出了一种基于短开路耦合器加载的宽带带通滤波电路. 该滤波电路通过在输入和输出端口之间,并连加载短路耦合微带谐振器和开路耦合微带谐振器实现5个传输极点和3个传输零点的带通选择特性. 对所提出的短开路耦合谐振器进行了奇偶模理论分析,揭示了其传输零极点形成的物理机理. 最后,对所提出的滤波电路进行了加工测试. 测试结果表明,所提出的宽带滤波电路能够在2.0～4.2 GHz频率范围内实现 3 dB 带通传输,工作相对带宽为73%,仿真和实测结果吻合较好.     

细磨活化对白钨矿浸取行为的影响SCIEI

本文研究了细磨活化对白钨矿浸取行为的影响.实验结果表明,细磨活化后白钨矿在HCl-Na_3PO_4介质中的浸出速率显著加快,钨的浸出率由原来的约8％提高到99％以上.红外光谱和X射线分析结果表明,细磨除了使白钨矿比表面积显著增大外,还在固体的表面和内部产生缺陷结构,增加了矿物表面的反应活性,改善了白钨矿的分解,使得白钨矿的浸出能在较低的温度顺利进行。     

古代铜镜复制工艺的探讨

复制古代铜镜，要经过铸型制作，铜合金熔炼，镜体研磨等工艺过程。经过反其实验研究，获得了较为理想的铸型制作方法。对铜合金配比的优化及研磨镜面作了深入的讨论。     

基于演化算法的奇偶校验器自动设计*

基于演化算法技术,提出一种新的设计思想,实现奇偶校验器的电路自动设计.实验证明,多目标演化算法具有较少的运算量和较高的效率,能自动设计出使用逻辑门数更少、延时更小的奇偶校验器.     

3D Printing Conductive Composites with Poly(ionic liquid) as a Noncovalent Intermedia to Fabricate Carbon Circuits

In this study, a kind of imidazole type poly(ionic liquid) ([PEP-MIM]Cl) is synthesized, which can disperse carbon effectively. [PEP-MIM]Cl is used as an intermediate to coat carbon on the poly(acrylic acid)(PAA-co-MBA) via ion exchange to obtain conductive polymer composite (CPC). A series of characterizations are performed. Experiments show that carbon can be coated on the PAA-co-MBA uniformly, and compared with using carbon as filler, this method requires less carbon to achieve good conductive performance. The carbon layer on the polymer's surface is enriched via the swelling-shrinking properties of PAA-co-MBA according to the SEM images. Furthermore, in combination with 3D printing technology, PAA-co-MBA can be designed into different shapes to achieve various functions such as pressure-sensing element. Finally, a new type of CPC named carbon clad polymeric laminate (CCPL) is prepared by using the carbon coating method and 3D printing technology. It has the potential to replace copper clad laminate (CCL) and printed circuit board (PCB), to a certain extent. This technology expands the preparation method and application of the CPC such as flexible and wearable conductive fabrics.