硅上后热氧化钛膜制备氧化钛及其电学特性

采用在硅上磁控溅射金属钛膜再热氧化的工艺制备了多晶氧化钛薄膜.测量了Ag/TiOx/Si/Ag电容器的I-V和C-V特性.结果表明,氧化钛薄膜的厚度为150～250nm,其介电常数是40～87.随着氧化时间的缩短,氧化钛薄膜中的固定电荷减少,漏电特性得到改善.     

靶功率对PEMSIP法TiN涂层相组成的影响

随着靶功率减小等离子体增强磁控溅射离子镀（ＰＥＭＳＩＰ）ＴｉＮ涂层的相组成朝着富氮相及其含量增加的方向发展。靶功率对膜层硬度的影响主要是膜层相组成变化而引起的，由Ｔｉ＿２Ｎ和ＴｉＮ两相组成的膜硬度最高。由Ｔｉ＿２Ｎ和ＴｉＮ两相组成的刀具涂层使切削力下降，明显提高刀具耐用度。     

镍钛形状记忆合金薄膜的相变温度和力学性能

利用直流磁控溅射法溅射沉积了NiTi形状记忆合金薄膜，对NiTi形状记忆合金薄膜进行晶化热处理以使其获得形状记忆效应。研究了550℃晶化热处理1h后Ti-48.2%Ni薄膜的相变温度和力学性能，研究结果表明，NiTi薄膜550℃晶化热处理1h后，升温过程中发生M→A的相变，而降温过程中则先发生A→R相变，再发生R→M的相变，薄膜的断裂强度随测试温度的升高而增大，残余应变随温度的升高而减小，当温度大于Af点时，表现为超弹性。     

Si基ZnO/Ga2O3氨化反应制备GaN薄膜

利用射频磁控溅射法在Si(111)衬底上先溅射ZnO缓冲层，接着溅射Ga2O3薄膜，然后ZnO／Ga2O3膜在开管炉中850℃常压下通氨气进行氨化，反应自组装生成GaN薄膜。XRD测量结果表明利用该方法制备的GaN薄膜是沿c轴方向择优生长的六角纤锌矿多晶结构的薄膜，利用傅里叶红外吸收光谱仪测量了薄膜的红外吸收谱，利用SEM和TEM观测了薄膜形貌，PL测量结果发现了位于350nm和421nm处的室温光致发光峰。     

新型磁控溅射法合成C_3N_4/TiN复合膜

本工作采用在封闭型非平衡磁场ｄｃ磁控溅射系统中增加对阴极的方法制备Ｃ３Ｎ４／ＴｉＮ复合交替膜，用获得的ＴｉＮ对进行Ｃ３Ｎ４强迫晶化，Ｘ射线衍射（ＸＲＤ）和电子衍射（ＴＥＤ）分析表明生成了立方氮化碳（ｃ－Ｃ３Ｎ４）。交替膜的界面处有ＴｉＣ的生成。     

射频磁控溅射TiO2/HA复合生物膜的制备与表征

将水热合成的羟基磷灰石(HA)粉与20 wt%Ti粉混合,冷压烧结成靶材。采用射频磁控溅射方法,在工业纯钛基体上沉积TiO₂/HA生物薄膜,通过扫描电镜(SEM)及其能谱(EDS)、X射线衍射(XRD)和差热分析仪(TDA)对膜层进行了表征,探讨了溅射膜的晶化工艺。结果表明:由于选择溅射和OH-损失,溅射膜由TiO₂晶体颗粒和非晶钙磷化合物组成,且其Ca/P比降低。经700℃,0.5 h水蒸气处理,非晶钙磷化合物结晶度大大提高,并部分转化为HA晶体,且处理后的溅射膜与基体间无裂纹。     

磁控溅射法制备防水透湿织物

利用磁控溅射法制备了防水透湿织物。主要研究了功率、靶距、工作压力和沉积时间四个工艺参数对织物应用性能的影响。结果表明这四种参数对PET基防水透湿织物的拒水性能变化规律和改变程度各有不同，但对织物透气性，透湿性影响不大，基本上保持了原有织物的透气性及透湿性．     

Feasibility of an Ag-alloy film as a thin-film transistor liquid-crystal display source/drain material

The Ag-alloy films have been investigated as source/drain materials applicable to thin-film transistor liquid-crystal displays (TFT-LCDs). The Ag-alloy consisting of 0.9at.%Pd, 1.7at.%Cu (designated APC) showed a resistivity that was lower than one-half that of AlNd. It also had good contact characteristics with amorphous Si (a-Si). In addition, the Ag/Si was stable after heating to above 700°C, requiring no diffusion barrier to prevent reaction between Ag and Si. Pure Ag films deposited on glass by DC magnetron sputtering showed severe hillock formation, hole growth, and agglomeration upon annealing in air. In comparison, the APC-alloy film exhibited improved resistance to agglomeration. Further, inverted-staggered back-channel-etch hydrogenated amorphous silicon (a-Si:H) TFTs using an APC-alloy film as a source/drain material had a threshold voltage of 4 V. A structure of single layers of gate-APC alloys and source/drain-APC alloys leads to lower costs and productivity improvements of large-area, high-resolution, active-matrix LCDs, such as 40-in. size panels through process simplification.     

Substrate geometry effect on the uniformity of amorphous carbon films deposited by unbalanced magnetron sputtering

A chromium doped amorphous carbon (a-C) film was deposited by an unbalanced magnetron sputtering. A special designed double-V shaped stainless steel model in simulating a plastic injection mold gateway was used as the substrate to investigate the geometric effect on the uniformity of the film. It was found that, on both the side wall and bottom plane of the double-V shaped substrate, the film properties strongly depended on a geometric parameter, geometric aspect ratio, defined as the depth over width of the simulated gateway at the points under measurement. With the increase of the aspect ratio, i.e. approaching to the narrow end and/or closer to the bottom plane of the gateway, the film thickness and hardness decreased and the intensity ratio of the Raman sub-bands D over G increased. With the increase of the aspect ratio, the micro hardness of the a-C film decreased far more significantly on the side wall than that on the bottom plane. With increasing working gas pressure, the film thickness decreased consistently, and the hardness uniformity on both the side wall and bottom plane was improved. When the substrate negative bias voltage was changed from −70 to −100 V, the film uniformity (for both the thickness and hardness) was improved on the bottom plane, but degraded on the side wall.     

ZnO:Al(ZAO)透明导电薄膜的制备及其特性

笔者采用射频磁控溅射工艺、以氧化锌铝陶瓷靶为靶材制备透明导电ZAO薄膜,系统研究了各工艺参数,如氧流量、工作气压、温度、射频功率和退火条件等对其结构和光电特性的影响。实验结果表明:在纯氩气中且衬底温度为300℃时制备的ZAO薄膜经热处理后电阻率降至8.7104 W·cm,可见光透过率在85%以上。X射线衍射谱表明ZAO晶粒具有六角纤锌矿结构且呈c轴择优取向,晶粒垂直于衬底方向柱状生长。