Silicon ribbons and foils—state of the art

Research and development on crystal growth technologies for production of crystalline silicon ribbon have been under way now for three decades. I review here their progress toward establishment of manufacturing capabilities for silicon wafers for photovoltaic applications. I examine technology improvements which are currently being explored for a future generation of low cost solar products based on ribbon wafers, and discuss potential limits of the technology.     

实施油气回收的必要性和技术方案的探讨

简要介绍油气回收技术;从环保和增加经济效益的角度,以福建炼化公司的实际情况为例提出了油气回收的方案,并对实行该方案的必要性和经济效益做了分析;希望增强炼化企业对油气回收问题的重视,达到安全生产、改善环境和节约能源的目的。     

抽水蓄能电站运行方式和电网经济效益分析

用计算机模拟法建立模拟模型，对选定的系统进行生产模拟，统计计算出电网系统投入不同抽水蓄能容量时所发生的系统运行总燃料费用（包括抽水蓄能电站的抽水费）和系统的负荷缺电力时间概率（LOLP）等指标。通过对计算结果的分析，得出不同系统在投入不同容量抽水蓄能机组和采取不同运行方式的情况下，其运行总燃料费用的边际成本和LOLP的边际值的变化规律，并且对电网的经济效益进行合理分析。从而为抽水蓄能电站的规划和投资建设提供理论依据，推动抽水蓄能电站的发展，促使我国电源结构趋向合理。     

发电设备的检修策略及可靠性管理研究

检修策略和可靠性管理是发电厂设备管理工作相辅相成的 2个方面 ,必须予以足够重视。目前要加大力度做好可靠性管理工作 ,建立可靠性管理系统为发电设备管理提供技术支持 ,为设备检修提供依据 ,以获得最佳的经济效益。     

变差函数在地下水位估值中的应用研究

用数值方法进行地下水水资源评价时 ,需要给出每个节点上的初始地下水位值。本文着重阐述了区域化变量和变差函数及其计算步骤 ,指出变差函数在分析地下水位的空间变异的重要性     

特大型桥梁工程地质勘察区域地壳稳定性研究

重大工程区域地壳稳定性研究，是工程前期工程地质勘察的重要内容之一，并越来越多地为工程建设所重视。大桥工程地质勘察以往对此涉及较少，也无明确的统一规定，以长江上所建特大桥为例，对此项工程作了些探索性的研究，重点研究的问题是：区域构造环境及构造变形，地壳结构和深部构造，新构造活动，断裂活动，地震活动等，为大桥建设宏观决策和抗震设计提供依据。     

Growth Stresses in the Oxide Scales on TiAl Alloys at 800 and 900°C

In the oxidation of TiAl alloys, the role of scale-growth stresses formed during oxidation has, thus far, been unknown. In the present paper the oxide-growth stresses were investigated by the deflection-test method in monofacial oxidation (DTMO) accompanied by acoustic-emission measurements. On unmodified surfaces the growth stresses are compressive and reach levels of around –100 MPa. At the same time, significant acoustic emission occurs indicating that even under isothermal conditions, stresses are relieved by a scale-cracking mechanism. For oxide scales on TiAl surfaces, which had been ion implanted with chlorine before oxidation, a very thin protective alumina layer is formed which, however, develops growth stresses in the range of several GPa, accompanied by intensive acoustic emission. In all stress–time curves, a dynamic situation is observed. This consists of phases of stress relief by scale microcracking and phases of stresses increase due to crack healing and further oxide growth. As a result, the level of stress as a function of oxidation time, is characterized by an oscillating course.     

Microscopic and Macroscopic Growth Rates of Fatigue Cracks in Steels and Alloys under the Influence of Crack Closure

On the basis of the experimental data, we show that the difference between the macroscopic and microscopic fatigue crack growth rates in the second section of the kinetic diagram of fatigue fracture is caused by the effect of crack closure within the limits of its existence. We establish the relationships between the macroscopic and microscopic fatigue crack growth rates and the structure of the material in the second section of the diagram for various values of the load ratio with regard for the effect of crack closure and propose a procedure of examination of the fracture processes in structural materials based on the analysis of microscopic and macroscopic fatigue crack growth rates.     

Numerical simulations of specimen size and mismatch effects in ductile crack growth - Part II: Near-tip stress fields

The effect of ductile crack growth on the near tip stress field in two different specimen geometries has been investigated. For homogeneous specimens it is observed that the peak stress level increases with ductile crack growth. The effect is most pronounced up to about 1 mm of crack growth. For low and intermediate hardening there is a significant effect of specimen size on the stress level. In case of mismatch in yield stress, the simulations show that the increase in stress level in the material with the lower yield stress is of a similar magnitude as is the case for stationary cracks. In case of ductile crack growth deviation from the original crack plane occurs, the highest stresses are still found close to the interface, and not in front of the current crack tip.