雷达信号基因形成机理与多层次建模方法研究

针对电子对抗侦察领域对截获雷达信号认知的需求,对雷达信号基因的形成机理和建模问题进行研究。首先,分析了雷达信号的不同层次和层次之间的转化关系,将雷达信号划分为脉冲层、脉冲群组层、工作方式层三个层次;然后,借鉴生物体基因工程中蛋白质、DNA、基因片段的概念,类比对应雷达信号的不同层次信息,提出了雷达信号基因的概念和层次模型,建立了雷达信号层次处理的研究框架;最后,针对当前新体制雷达的典型信号,给出了雷达信号脉内基因的表征实例。     

The effect of electroplating parameters and substrate material on tin whisker formation

Electroplated tin finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, the spontaneous growth of tin whiskers during service can result in localised electrical shorting or other harmful effects. Until recently, the growth of tin whiskers was successfully mitigated by alloying the tin with lead. However, restriction in the use of lead in electronics as a result of EU legislation (RoHS) has led to renewed interest in finding a successful alternative mitigation strategy.Whisker formation has been investigated for a bright tin electrodeposit to determine whether whisker growth can, at least partially, be mitigated by control of electroplating parameters such as deposition current density and deposit thickness. The influence of substrate material and storage at 55 °C/85% humidity on whisker growth have also been investigated.Whisker growth studies indicate that deposition parameters have a significant effect on both whisker density and whisker morphology. As deposition current density is increased there is a reduction in whisker density and a transition towards the formation of large eruptions rather than potentially more harmful filament whiskers. Increasing the tin coating thickness also results in a reduction in whisker density. Results demonstrate that whisker growth is most prolific from tin deposits on brass, whilst that from tin deposits on rolled silver is greater than that observed for tin deposits on copper.     

In Situ observation of the effect of temperature on Cu2O scale morphology

The effect of temperature on copper oxide scale morphology was studied during in situ oxidation of OFHC copper in a hot-stage environmental scanning electron microscope (HSESEM). Cuprous oxide scales grown at low temperature [0.2T_m(Cu₂O)] and intermediate temperatures 0.6–0.7T_m(Cu₂O)] were found to be crystallographically oriented. At intermediate temperatures, scales exhibited nonplanar features such as ridges and growth pyramids. At high temperatures [T> 0.8T_m(Cu₂O)], scales had planar morphologies and a few dislocation growth pits. Downquenching and upquenching of the Cu₂O scales from steady-state oxidation temperatures induced morphological changes such as cavity formation and surface reconstruction.     

Bluetooth scatternets: criteria, models and classification

Bluetooth ad hoc networks are constrained by a master/slave configuration, in which one device is the master and controls the communication with the slave devices. The master and up to seven active slave devices can form a small Bluetooth network called a piconet. In order to build larger network topologies, called scatternets, the piconets must be interconnected. Scatternets are formed by allowing certain piconet members to participate in several piconets by periodically switching between them. Due to the fact that there is no scatternet formation procedure in the Bluetooth specification, numerous different approaches have been proposed. We discuss criteria for different types of scatternets and establish general models of scatternet topologies. Then we review the state-of-the-art approaches with respect to Bluetooth scatternet formation and compare and contrast them.     

Low-temperature processing of antimony-implanted silicon

It is shown for the first time that antimony-implanted silicon produces the highest electrical activation (90%) with low resistivity (<200 ohms/square) following low-temperature processing. Thus, annealing at 650°C produces the best results for antimony, whereas for arsenic, it is necessary to anneal at temperatures above 1000°C to get optimum results. Silicon was implanted with antimony at 12 keV and 40 keV and doses of 8.5×10¹⁴ cm⁻² and 4×10¹⁴ cm⁻², respectively, and arsenic at equivalent energies and doses. The electrical data from both implants are compared in order to identify the process conditions require to obtain optimum results. It is demonstrated that annealing below 800°C produces electrical profiles with no measurable diffusion of the antimony, but higher temperature anneals produce significant diffusional broadening.     

含能五唑离子盐的能量性能预估

为了在同一水平上比较含能五唑离子盐的密度、生成热、爆速和爆压,采用密度泛函理论,对近两年合成的五大类16个非金属N_5~ˉ离子盐进行了研究。结果表明在MP2/6-311++G(d,p)理论水平上,根据Born-Haber能量循环计算的五唑离子盐的生成热为95.2～1362.0 k J·mol~(-1),三唑类N_5~ˉ离子盐的平均生成热最高。这些五唑离子盐的密度为1.395～1.650 g·cm~(-3)(298.15 K),远远低于理论预测的全氮化合物的密度。通过Kamlet-Jacobs公式计算的爆速和爆压结果与EXPLO5的计算结果吻合良好,大部分五唑含能离子盐的爆速为6500～8000 m·s~(-1);爆压为15～26 GPa,低于RDX的爆速和爆压。N_5~ˉ的缩二胍盐、羟胺盐和肼盐的理论爆轰性能突出,它们的爆速(8622～9032 m·s~(-1))与RDX持平或者略高,爆压(29.5～32.3 GPa)均低于RDX,并未展现出全氮阴离子衍生物的明显优势,也远未达到对它们超高能量的预期。     

编队舰炮对岸射击多发同时弹着研究

为提高编队舰炮对岸射击过程中火力密度和打击效果,对多发同时弹着进行研究。根据编队舰炮对岸射 击特点,利用高斯中纬度公式,确定敌我相对坐标,通过解弹道方程求出各舰舰炮弹丸飞行时间,采用控制舰炮发 射顺序和发射间隔,实现多发弹丸同时命中目标,并通过解算舰炮射击诸元进行应用分析。应用结果表明：该研究 具有较好的实用性,可为编队舰炮指挥员对岸指挥决策提供参考。     

曲线自动拟合法在多井试井分析中的应用

本文从渗流方程的反问题出发,提出一种用于多井试井解释的通用方法——曲线自动拟合法。该方法通过一个非线性最小二乘参数估计,使实测数据与油藏数学模型的理论曲线自动拟合。为了判断各井之间地层明显异性的情况,文中提出了一种新的多井试井方法(即多井激动、一井观察试井法),并研制了相应的多井试井软件。矿场实测和虚拟测试的分析结果表明,这种新方法既可以一次性地解释同一油藏中各激动井与观测井之间的不同渗透率,又节省了测试时间和少用了测试仪器。     

Morphological stability of solder reaction products in flip chip technology

We have studied two kinds of solder reactions between eutectic SnPb and Cu. The first is wetting reaction above the melting point of the solder, and the second is solid state aging below the melting point of the solder. In wetting reaction, the intermetallic compound (IMC) formation has a scallop-type morphology. There are channels between the scallops. In solid state aging, the IMC formation has a layer-type morphology. There are no channels but grain boundaries between the IMC grains. Why scallops are stable in wetting reactions has been an unanswered question of fundamental interest. We have confirmed that the scallop-type morphology is stable in wetting reaction by re-wetting the layer-type IMC by molten eutectic SnPb solder. In less than 1 min, a layer-type Cu₆Sn₅ is transformed back to scallops by the molten solder at 200 C. In analyzing these reactions, we conclude that the scallop-type morphology is thermodynamically stable in wetting reaction, but the layer-type morphology is thermodynamically stable in solid state aging, due to minimization of interfacial and grain boundary energies.     

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本文对“保护油气层防止地层损害”这一课题中的若干重要概念进行了探讨。对如何给地层损害下科学的定义。通过射孔完井电模拟试验,证明了某些情况下,射孔对地层的损害比钻井损害更为严重。目前普遍采用矿场试井法所确定的表皮系数作为地层是否受损的差别标准是不够确切的。